Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
-
Product
8GB DDR4 SODIMM-3200 1GbX8 SAM
AQD-SD4U8GN32-SE
Memory Module
DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, 100% tested for stability, compatibility and performance.
-
Product
Wafer Level Test
-
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
-
Product
Image Sensor/Fingerprint-on-Display Testing
-
Enli Tech provides the most advanced optical and non-destructive inspection technology, which can de-convolute the digital images back to the analog properties, such as quantum efficiency, spectral response, system gain K, Dynamic Range (DR), PRNU, DRNU, Linearity Error LE, and Chief-Ray-Angle (CRA). The testing solution can be applied to CCD and CMOS image sensors in aerospace, defense, and scientific camera field. Image sensor packages that can be tested by Enli Tech’s systems include bare wafers, dies, chips, or camera modules. Our image sensor testers can help users reduce the sensor-modules or camera-modules development time and RD budget.
-
Product
Industrial Grade SODIMM DDR4 3200
SQR-SD4I
-
30u” Golden Finger, Wide Temp range: -40oC~85oC. Tier one original chip adopt, lifetime warranty, DRAM Software Monitoring.
-
Product
Hot Electron Bolometer (HEB) Mixers/ Receivers In Terahertz Range
-
Insight Product Company offers Hot Electron Bolometer (HEB) mixers, receivers, and chips made from NbN or NbTiN thin film. The HEB mixers can operate at frequencies of up to several terahertz.
-
Product
Defect Inspection and Review
-
KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
-
Product
Interface RS-232
-
The RS-232 specification allows for reliable data transmission from one transmitter to one receiver at data rates of up to 20 kbps over relatively short distances (up to 50 feet). On more recent RS-232 transceiver chips, data rates of up to 1 Mbps are achievable over shorter distances (up to 5 feet). The most common applications for RS-232 transceivers are computers and peripherals, mobile phone data cables, and diagnostic data ports.
-
Product
SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
Computer on Module
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
-
Product
32GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V32GN56-SB
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
-
Product
3.4 MP Custom Lens Low Light Camera Module
e-CAM30_CUMI0330_MOD
-
e-CAM30_CUMI0330_MOD is a high performance, small form factor, 3.4 MP pluggable Low Light Camera Module with S-Mount lens holder. It is based on AR0330 - a 3.4MP CMOS Image sensor from ON Semiconductor®. It has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs the entire Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the optional MJPEG compressions.
-
Product
Registered DIMM
-
a type of RAM module featuring a hardware register (RCD) between the DRAM chips and the system's memory controller.
-
Product
8G SO-DDR5-5600 1GX16 1.1V SAM -20~85℃
AQD-SD5V8GN56-SCH
-
SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
-
Product
ALD Applications
-
Atomic Layer Deposition (ALD) has the potential to optimize product design across a wide array of applications from making silicon chips run faster, to increasing the efficiency of solar panels, to improving the safety of medical implants.
-
Product
Chip Resistors
-
Panasonic Industrial Devices Sales Company of America
Panasonic offers a wide range of Chip Resistors including conventional Thick Film Chip Resistors, Specialized Resistors such as Thin Film, Current Sense, Anti-Sulfur, Anti-Surge and Metal Film Chip Resistors.Panasonic’s standard Thick Film Chip Resistors are offered in cases sizes from 01005 to 2512.
-
Product
8GB SO-DDR5-5600 1GX16 1.1V SAM
AQD-SD5V8GN56-SC
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
-
Product
Compact Goniophotometer
LSG-1200A
-
The compact goniophotometer of LSG-1200A is used to measure the luminous intensity distribution curve, intensity data, spread angle and other parameters for Chip LED, LED Module, LED Spotlight and all other light which beam angle is no more than 180 degree. • Meets the requirements of IEC, CIE and LM-79 standards • Measures beam angle automatically: staple half intensity angle as well as 1/4 intensity angle, 3/4 intensity angle and 1/10 intensity angle which meets the special requirements. • Measured data is matched with international standard form (IES) and can be applied for lighting design by other lighting design software such as DiaLux • LSG-1200A has included a dark room, measures the maximum size of lamps: 180mm • Test range of luminosity: 0.1～30,000lx. Test accuracy of detector: Class 1 • The distance between the tested lamp and detector is 316mm/1000mm • Angle interval: Horizontal angle: 1°/5°/10°/15°/22.5°/30°/45°/90°, Vertical angle: 0.5°/2°/1.5° • The LSG-1200A horizontal automatic rotating on 0°~360° and Vertical automatic rotating on -90°~+90° • Test accuracy of angle: ±0.2° Work with the follow instruments as a System
-
Product
Chip Resistor Networks/Arrays
-
Panasonic Industrial Devices Sales Company of America
Panasonic’s Chip Resistor Arrays are offered in cases from 0201 to 0805. The smaller 0201 case sizes are available with flat terminations and all other case sizes are offered with either convex or concave terminations. The EXB Series Resistor Arrays are available in 2, 4, or 8 Resistors per package. These Resistor Arrays allow for an improvement of the placement efficiency. Compliance Standards include: IEC 60115-9, JIS C 5201-9, EIAJ RC-2129, AEC-Q200 and RoHS.Panasonic’s Resistor Networks are available in 8 or 15 bussed Resistors and are recommended for all pull up/down circuits.
-
Product
6 Chip Detection and Burn Channels
CD1
-
The CD1 provides 6 Chip Detect and Fuzz Burn interface(s). A Chip Detector (CD) is a magnetic-electrical device that provides a reliable method of detecting impending failure of bearings and gears.
-
Product
PANAVIA Modules
-
AIM’s PANAVIA test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core design with one processor for real time bus protocol support, massive memory and IRIG-B time code encoder/decoder functions are standard. AIM delivers versions of our modules with extended temperature range and conformal coating. With 8 Tx and 8 Rx channels per module, functions include autonomous transmit sequencing, continuous clock and data transmissions, host controlled double buffering, programmable interrupts, data selection on specific tag identifier, selectable triggers on data and/or tags with full protocol error injection/detection, real time bus recording and time stamping to ensure your bus integrity. Each module is delivered with a Board Support Package (BSP) comaptible to the legacy PCI and cPCI hardware modules.
-
Product
Digital I/O Cards
104-DIO-48E
-
The circuits use an 82C55A PPI with mode 0 supported. Ports A, B and C are buffered with 74ABT245 transceivers and pulled up to 5V. The optional 82C54 has three-sixteen bit down-counters within one chip. These counters are useful for making frequency outputs, measuring frequency of square waves, pulse width outputs, pulse width measurements etc. Software drivers are provided on CD.
-
Product
Ethernet
-
Arasan Chip Systems has a complete portfolio of Fast (10/100) Mbps and Gigabit (10/100/1000) Mbps and now 10Gigabit Ethernet IP. Our high quality IP has completed the rigorous interoperability tests at UNH-IOL laboratories and has been widely licensed. Arasan also provides a portable Ethernet driver.
-
Product
Rugged SODIMM DDR4 2666/3200
SQR-YD4N
-
Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s, Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C, Original IC chip (Samsung/Hynix).
-
Product
PROBE CARD
-
the electrical characteristics of the individual CHIPs in WAFER that have been completed through the FAB stage during the semiconductor fabrication process
-
Product
Low Concentration Type HF/HCl/NH3 Concentration Monitor
HF-960M
-
The HF-960M uses sensors that offer outstanding corrosion resistance for high-precision, high-speed measurement of low concentrations of hydrofluoric acid, hydrochloric acid and ammonia, and is thus perfect for single-bath and wafer cleaning. The HF-960M is also an environmentally-friendly product that uses lead-free solder for mounting chips on the PCB.
-
Product
Diode Arrays
-
a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100 % Tin terminations. All Bourns® diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.
-
Product
3U PXI-E System Controller
PX32101
-
LinkedHope Intelligent Technologies Co.,Ltd.
PX32101 is a 3U PXI-E system controller based on the newest Intel® Haswell platform. It is designed to provide comprehensive and reliable system controller to support hybrid PXIe-based systems for multiple environments test and measurement applications.Hybrid PXIe-based systems are often required to complete independent diversified complex testing tasks on the PXI test platform. PX32101 provides rich interfaces: 4 USB2.0 / 3.0 for peripheral connectivities; UART for communication or control equipment; dual 1000Base-T Ethernet, one port for LAN connection and the other one for the control of the next generation of LXI instruments.PX32101 can support 4 x4 or two PCIe x8-link, and up to 16GB / s system bandwidth. The ExpressCard 34 expansion slots on the front panel allow users to expand the system modules flexibly. If you install a hybrid multi-slot backplane in the system, then various standard PXI-E and PXI / CPCI peripheral cards could be fitted.In a multitasking environment, PX32101 processor is able to complete multiple tasks independently. The CPU and memory chips soldered with PCB increase reliability performance in shock and vibration environments. Combined with a variety of instrument control interfaces and reliable mechanical & electronic design, PX32101 can meet your hybrid PXIe-based testing for system application requirements perfectly.
-
Product
Metrology & Inspection Systems
-
Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
-
Product
16GB ECC DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GE56-SB
Memory Module
SAM Original Chip, Anti-sulfuration, PCB: 30μ gold finger. Independent Power Management IC build-in, ECC function support.
-
Product
Analyze RTL
-
ASICs and FPGA routinely have millions of gates with memories, transceivers, third party IP and processor cores. Problems can be time consuming and complex to debug in the lab and through simulations. Designers need verification tools that can identify problems quickly to reduce their verification and debug time before simulation, before synthesis, and definitely before burning chips in the lab.
-
Product
Digital Step Attenuators
-
Analog Devices provides a range of broadband IC digital attenuators that come in low cost, leadless surface mount packages. Our digital attenuator family offers excellent attenuation and includes off chip ac ground capacitors for near dc operation, making it ideal for an extensive number of RF and IF applications.
