Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
32GB SO-DIMM DDR5-4800 262Pin 2GX8 1.1V Unbuffered Samsung Chip
AQD-SD5V32GN48-SB
Memory Module
Samsung Original Chip, Dual 32-bit Subchannels, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Inductor Products
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Macom Technology Solutions Holdings Inc.
They provide uniformity, durability and repeatability in circuit fabrication. The coils are polyimide coated to protect from ambient contaminants, and to eliminate the need for conformal coating. Quartz substrates are rugged and reduce dielectric losses. Chips may be bonded using either conductive or non conductive epoxies, and wire bonded with gold wire or ribbon by thermocompression bonding.
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Product
SODIMM DDR4
SQR-SD4N
Dual In-Line Memory Module (DIMM)
Original IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
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Product
PXI-2536, 544-Crosspoint, 1-Wire PXI Matrix Switch Module
778572-36
Matrix Switch Module
544-Crosspoint, 1-Wire PXI Matrix Switch Module—The PXI‑2536 is a high-density 8x68 PXI matrix switch module that is ideal for routing low-power DC signals in validation test systems of mass produced devices such as semiconductor chips and printed circuit boards (PCBs). Featuring FET relays, the PXI‑2536 offers unlimited mechanical lifetime and switching speeds up to 50,000 crosspoints/s. It also features onboard relay counting for relay monitoring and deterministic operation with hardware triggers to improve test throughput.
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Product
E-beam Metrology And Inspection
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Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
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Product
Peak Track Instrument
90323
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The model 90323 Peak Track Instrument is a general-purpose sensor readout device designed to complement our AutoID line of load cells and torque sensors. AutoID is a term that indicates that the calibration information for a sensor is stored on a chip inside the sensor’s connector. AutoID allows true “plug and play” operation without manual calibration procedures of any kind. The unit is also equipped with a 2-line alpha-numeric display and single button operation for simplicity.
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Product
Low Light USB Camera Board (Color)
See3CAM_CU30 - 3.4 MP
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See3CAM_CU30 is a 3.4 MP UVC-compliant Low Light USB camera board based on AR0330 sensor from ON Semiconductor®. This Low Light Board Camera is backward compatible with USB 2.0 and supports compressed MJPEG formats at frame rates equal to USB 3.0. This sensor enables a superior low light performance. It has a dedicated, high-performance Image Signal Processor chip (ISP) that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the MJPEG compressions.
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Product
8G SO-DDR3-1600 204Pin 512MX8 1.35V Unbuffered Samsung Chip
AQD-SD3L8GN16-SG1
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DDR3 1600Mhz Unbuffered SO-DIMM, 30μ" gold plating thickness, 1.35V power consumption, Samsung original chip.
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Product
Wide Temperature Server DIMM
SQR-RD4M
Dual In-Line Memory Module (DIMM)
Original Hynix IC chip adopted, Wide operating temperature support -25~85oC, Data transfer rate up to 3200 MT/s.
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Product
8K UHD Fanless Edge Computer
UBX-110H
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The UBX-110H is an 8K UHD fanless edge computer powered by an Intel® Celeron® 6305E or 11th generation Core™ i3/i5/i7 processor. Built-in an Intel® Celeron® 6305E or 11th gen Core™ i3/ i5/ i7 processor, Built-in a TPM 2.0 chip for data encryption enhancement.
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Product
Module Spectrum
nRF52805 Series
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Raytac nRF52805 tiny and low cost modules spectrum covers MDBT42TV-192K & MDBT42TV-P192K series with both Chip Antenna and PCB Antenna option for selection
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Product
Battery Backup IC
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Analog Devices offers a range of supervisory circuits that offer a complete single chip solution for power supply monitoring and battery control functions in microprocessor systems. Functions include microprocessor reset, backup battery switchover, watchdog timers, CMOS RAM write protection, and power failure warning.
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Product
Big Easy Driver
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The Big Easy Driver, designed by Brian Schmalz, is a stepper motor driver board for bi-polar stepper motors up to a max 2A/phase. It is based on the Allegro A4988 stepper driver chip. It's the next version of the popular Easy Driver board.
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Product
Software
DPM-3
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Was developed to read and edit Plug and Play Smart Sensors that are compliant to the IEEE 1451.4 Standard. TEDS, or transducer Electronic Data Sheet, is a set of electronic data in a standardized format defined within the IEEE 1451.4 standard. This data specifies what type of sensor is present, describes its interface, and gives technical information such as sensitivity, bridge type , excitation, etc. This information is stored in an EEPROM chip attached to the sensor. By having this chip, the sensor can identify and describe itself to the network and or Smart Load Cell Meter (DPM-3), thereby easing automatic system configuration.
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Product
16G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U16N32-SEW
Memory Module
DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
Semiconductor Thermal Transient Tester
T3Ster®
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T3Ster (pronounced "Trister") is an advanced thermal tester from Mentor Graphics MicReD Products for thermal characterization of semiconductor chip packages. Superior to all other thermal characterization equipment on the market due to its speed and ease of use; its extremely accurate temperature measurements (0.01oC); and its 1 micro-second measurement resolution in time.
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Product
BGA SMT Adapters
Giga-snaP™
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Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Product
Infiniium Oscilloscopes
Z‑Series
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The Infiniium Z-Series delivers this and more with its RealEdge technology enabling 63 GHz of oscilloscope bandwidth and superior signal integrity. The Z-Series takes advantage of indium phosphide chip technology and custom thin film packaging to give you extremely low noise, low jitter, and high effective number of bits. These technologies allow you to see the true representation of your signal.
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Product
EUV Lithography
NXE systems
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NXE lithography systems are used in high-volume manufacturing of advanced Logic and Memory chips. The first systems to use ASML’s novel 13.5 nm EUV light source, they print microchip features with a resolution of 13 nm, which is unreachable with deep ultraviolet (DUV) lithography. Chipmakers use our NXE systems to print the highly complex foundation layers of their 7 nm, 5 nm and 3 nm nodes. Read about how EUV lithography went from imagination to reality.
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Product
32GB ECC DDR5-5600 2GX8 1.1V SAM
AQD-D5V32GE56-SB
Memory Module
SAM Original Chip, Anti-sulfuration, PCB: 30μ gold finger. Independent Power Management IC build-in, ECC function support.
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Product
Actuators, Adjusters, & Transducers
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We offer a wide range of adjustment screws, micrometers, and kinematic positioners, as well as stepper motor, DC servo, high-precision piezo inertia actuators, and voice coil actuators. Additionally, our piezoelectric offerings include modular, screw, and replaceable-tip piezoelectric actuators, as well as Langevin transducers for ultrasonic welding applications. A wide variety of piezoelectric chips and stacks are also available.
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Product
Model MCPC: Lab Moisture Analyzer
AM-MCPC-RS
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PC-Based lab/production moisture analyzer connects through RS-232 Serial Port. Designed for nuts, granules, powders, pellets, chips, or flakes. Includes two sample cups, MCPC-RS test chamber, windows PC-based software, and more. See product link for complete features and minimum computer requirements.
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Product
Geophone Testing – Hydrophone Testing – Vibrator TestingVersatile Quality Control System - Three Test Units In One!
Bird Dog 3 - 3 Channels
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*32-bit, high speed, ADC chip for lower noise and increased accuracy*Three different operation with a single unit*8 Gigabytes of Data Storage, Expandable to 16*GPS based time and location saved for every record*Stable and rugged unit for use in all conditions*Three-Component Test Mode, checks 3 elements at onceto save time and effort*All test data saved in non-volatile memory for later download and retrieval*Connects to PC via Ethernet or optional Wi-Fi, provides control, data download and real time display and analysis of data and results
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Product
Ka-Band Silicon SATCOM Tx Quad Core IC
AWMF-0109
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The AWMF-0109 is a highly integrated silicon quad core chip intended for satellite communications transmit applications. The device supports four dual polarization radiating elements with full programmable polarization flexibility. The device provides 22 dB of gain per channel with an output power of +12 dBm per element per polarization. Additional features include gain compensation over temperature, temperature reporting, and Tx output power telemetry. The chip features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 48 lead 6x6 mm QFN for easy installation in planar phased array antennas.
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Product
Moving Die Rheometer
SG-S05A
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It tests the feature about vulcanization and searches for the best suitable vulcanization time.It adopts digital intelligent temperature-controller to adjust and sets easily.Its stability, reappear and accuracy is better than the general rotor rheometer.The microcomputer uses import CMOS chip which has high dependability.It draws、calculates and prints automatically,and has copy or blowwing up function. It adopts computer-control and interface to collect、store or deal with data and print test result .This machine's function is better than other types and shows high automatization features. It has functions about curve-comparing and blow up.It uses series of windows operation system flat and graphical software operation interface.The data is dealed with much truly.The user's test operation becomes faster, flexibly and protect conveniently.
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Product
KV CAPS
500 V
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Macom Technology Solutions Holdings Inc.
The MACOM KV CAPSTM Si high voltage capacitors feature very high working voltage ratings, very low loss and excellent stability by virtue of their novel internal construction and very high-quality dielectric layers. These capacitors are available as unpackaged chips. The chips have gold bonding surfaces on both terminals to enable excellent bonding and minimum contact resistance.
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Product
Isolated LVDS
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Isolated LVDS (low voltage differential signaling) devices couple differential signals applied to the LVDS receiver inputs across the isolation barrier to the outputs on the other side and re-transmits the bit stream or clock as LVDS. Analog Devices' drop-in LVDS isolators offer designers robust, high speed differential signaling for point-to-point and multidrop applications. Extending iCoupler® chip scale transformer technology for ultrahigh speed data encoding, these LVDS isolators support a a data rate of up to 2.5 Gigabits per channel for a total bandwidth of 10 Gbps. In contrast to expensive fiber implementations, deserialized links over standard digital isolators or optocouplers, and design-intensive bespoke solutions using transformers or high voltage capacitors, ADI Gigabit Digital LVDS isolators offer the only integrated comprehensive, high performance isolation at 10 Gbps. High performance galvanic isolation for applications include analog front-end (AFE), processor to processor serial communication, or video and imaging data (such as HDMI isolators) as well as isolation between boards, or at a cable interface for LVDS or CML signal chains.
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Product
Large Current 1000A Primary Current Injection Test Set
TEST-901
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Beijing GFUVE Electronics Co.,Ltd.
TEST-901 primary current injection test set adopts ARM Chip to control its output process and large capacity of toroidal transformers. It is equipped with LCD display and current meter; it can show primary current value, second current value, turn ratio and the action time. Packing is used as aluminum alloy body with PC panel. TEST-901 is mainly applied to CT turn ratio testing in the power system and contact resistance test which need large current.
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Product
Source Signature Recorder
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*GPS accuracy for time break collection and source equipment locations.*32-bit, high speed, ADC chip for lower noise and increased accuracy for signatures.*Operates independently of crew, including observer and shooter or operators.*Can be used with any Vibrator Control System.*Great for monitoring rental equipment and operators.*Provides accurate start times that can be used with any nodal recording system.
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Product
Multi-module Programmers
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Xeltek offers both traditional gang programmers and modern stand-alone models for production cluster setups. Traditional gang programmers come with four independent sockets that allow chips to be programmed concurrently.Recent trends have shifted from gang programming to cluster setups. Cluster setups consist of multiple stand-alone programmers operated by one operator for enhanced efficiency and cost-savings during production.
