Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
IF/RF Receivers
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IF and RF Receivers are designed for communications infrastructure applications. Wide input bandwidth and high sample rates allow digitizing close to the antenna. Various receiver architectures, such as zero-IF, IF sampling to direct RF receivers, are supported and available on chip post digital signal processing can be used to offset demands in the FPGA or digital ASIC and ease analog filtering.
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Structural Test ICP® Accelerometers
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Conventional structural test data systems use few to several hundred sensors. Cables bundles can be complex and confusing resulting in setup errors. Sensors with TEDS (Transducer Electronic Data Sheet) allow for an internal sensor digital chip to store sensor information. This information contains descriptive identifiers that when connected to a TEDS compatible signal conditioner or data system, reads the descriptive information and automatically aligns the data system. Human error is minimized, reducing time consuming data verification or re-test. The Series 333 ICP® accelerometers, and their accessories, are designed to address the needs of multi-point modal and structural test measurement applications. This equipment was developed in conjunction with the world renowned University of Cincinnati Structural Dynamics Research Laboratory and proven in real-world testing situations. The PCB 333 Series accelerometers delivers rapid system setup, reduces human documentation errors, maintains calibration data of each sensor, allows for “Plug-and-Play” installation, reduces overall test time lowering project test costs.
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Universal Programmers
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Xeltek engineers work around the clock to maintain the largest device library in the industry, so new devices are being added on a daily basis for EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, and MCUs. The majority of SuperPro universal programmers come equipped with a ZIF socket supporting up to 144 pins for programming a wide range of DIP devices; other chip package supported includes SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, and SCSP.
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Electrical Receiver Conformance Test Application for IEEE 802.3bs/cd
M8091BSCB
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IEEE 802.3bs receiver test application for 200GAUI-4 and 400GAUI-8, covering chip-to-module, chip-to-chip, backplane, and copper cable interconnects.
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Arduino CAN Shield
IFB-10003-AWP
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CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt line to the MCP2515 and two LEDS are also provided. The chip select and interupt lines are selected via zero ohm resistors and have several configuration options for flexibility stacking additional shields. A set of stackable headers is included with this board, not installed. An optional on-board voltage regulator may be used to supply 7.5V to the Arduino's 'Vin' pin (which is regulated to 5V by the Arduino's on-board LDO). The CAN shield regulator supports a wide input range of 9V to 32V. This makes it possible to cleanly build a stand-alone CAN node (remote sensor) without the need for a separate Arduino power supply!
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Emulation
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Synopsys ZeBu® emulation system delivers the performance needed to make verification teams and software developers working on the most advanced chips successful. ZeBu emulation systems are modular, allowing users to deploy the capacity needed in a scalable and easily extensible fashion.
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Product
Thermal Conductivity Gas Analyzer
CI2000-RQD
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Shanghai ChangAi Electronic Science & Technology Co.,Ltd
Determining gas concentrations by measuring the thermal conductivity of the gas, CI2000-RQD analyzer uses advanced thermal conductivity sensor with single chip technology. It adopts platinum thread as sense organ to make up Imbalance Bridge, which output signal has a relationship with tested gas volume. And the single chip will magnify, sieve wavelength, modify linearly and criteria the signal by electric procedure.
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Signal Integrity Products
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Renesas' signal integrity products provide a 300% reach extension over passive copper solutions, and consume 80% less power than competing optical solutions. Renesas lane extender chips with analog equalizers are the perfect solution for DisplayPort™ USB-C long active cables.
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Product
Probe Series
AVIOR Series
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The MPI AVIOR series offers a broad lineup of high performance prober systems targeting the Optical Communications market. Our prober systems are available in Top emitting (TP), Flip chip (FP) emitting and Die/Package (DP) configurations to meet your specific test requirements. Whether it be R&D or mass production, MPI has a solution that will meet your needs for accurate and reliable measurements in conjunction with a reduced cost-of-test.
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Ultra-Low Power Computing Module
CM22303
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LinkedHope Intelligent Technologies Co.,Ltd.
CM22303 uses Intel® 7th generation Kaby Lake-Y platform and Core M Ultra low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.6 GHz and the display output resolution can be up to 4K. CM22303 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. SPI BIOS is designed on board to support dual-channel low voltage on board memory (up to 16GB), Gigabit Ethernet, TPM module and other functions. With high-performance and low power consumption, it can be widely used in the field of low power embedded systems. Meanwhile, CM22303 adopts COM Express standard and is compatible with Type10 pin out definition, and also provides rich peripheral interfaces such as USB3.0/2.0, PCIe, SATA, HD Audio etc.
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Chip Tester
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Chip aging test is a very important task. It simulates various environmental and stress conditions of the chip during long-term use, evaluates its reliability and life, and provides effective reference and guidance for chip product design and manufacturing. It is necessary to select high-quality chip testers to ensure accurate test data, thereby further improving the reliability and life of chip products.
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Battery Management Chip Module
Sentinel
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The first single system on chip module. Measures cell voltage, cell internal temperature and cell impedance.
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High Performance EV Battery Test System
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Shenzhen Sinexcel RE Equipment CO., Ltd
The 6V series battery test system uses a full-bridge circuit topology with a higher digit sampling chip. It can provide higher precision and more dynamic test data, and can provide a complete test program for mainstream lithium-ion batteries and batteries with a variety of material systems such as sodium batteries.
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ICs For Wireless Charging System
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The feature of power receiving and charge/discharge system IC RAA457100 is integrated all functions needed for a wireless chargeing, rectification, charging control for small Lithium-Ion battery and top level of power-efficiency DC-DC converter in a singl chip as 3.22mm x 2.77mm small package.
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Precision Shunt Chip Resistors
SMV
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*5W permanent power at 65C*High pulse power rating*Mounting: Reflow and wave-soldering
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Product
Development Kit
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The VP430 is 3U VPX RF processing system featuring the transformational Xilinx® Zynq® Ultrascale+™ RF system-on-chip technology (RFSoC). The ZU27DR device used on the VP430 includes eight integrated analog-to-digital converters at 4GSPS, eight digital-to-analog converters at 6.4 GSPS, a user-programmable FPGA fabric, and multi-core Zynq ARM® processing subsystem.
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Value Added Services
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For over three decades, Teledyne RF & Microwave has built a strong heritage delivering advanced value added services to the military, space and industry sectors of aerospace. With test capabilities up to 40 GHz, Teledyne offers chip and wire assembly of products ranging from single die through complex hybrids which can then be submitted to a combination of customer-specified RF and DC testing and environmental screening. We offer a complete portfolio of screening and testing services for device sorting, labeling, lead forming and tinning, and tape-and-reel packaging, as well as LAT services on packaged devices or bare-die, including diodes, transistors, and MMICs.
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SparkFun Pulse Oximeter And Heart Rate Sensor
MAX30101 & MAX32664 (Qwiic)
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The SparkFun Pulse Oximeter and Heart Rate Sensor is an I2C based biometric sensor, utilizing two chips from Maxim Integrated: the MAX32664 Biometric Sensor Hub and the MAX30101 Pulse Oximetry and Heart Rate Module. While the latter does all the sensing, the former is an incredibly small and fast Cortex M4 processor that handles all of the algorithmic calculations, digital filtering, pressure/position compensation, advanced R-wave detection, and automatic gain control. We've provided a Qwiic connector to easily connect to the I2C data lines but you will also need to connect to two additional lines. This board is very small, measuring at 1in x 0.5in (25.4mm x 12.7mm), which means it will fit nicely on your finger without all the bulk.
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OpenVPX SBC
SBC347D 3U
OpenVPX
The VPXcel3 SBC347D rugged single board computer is based on the highly integrated Intel® Xeon® D processor platform. The multiple core Xeon D brings the high performance of Intel Xeon processors into a dense, low power system-on-chip solution, ideal for High Performance Embedded Computing (HPEC) applications.
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Product
Copper Pillar Bump
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Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Resistors
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Panasonic Industrial Devices Sales Company of America
Panasonic offers a broad line of Resistors that include Chip Resistors, Power, High Power, Fuse, EMI Filters, and Arrays and Networks for all applications.Panasonic Resistors have a wide range of features and specifications including conventional Thick Film Chip Resistors or specialized types like Anti-Sulfur, 0201 to 0805 case sized Chip Resistor Arrays, three different types of Power Resistors, Surface Mount and Leaded EMI Filters and one of the smallest Chip Fuses in the industry.
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RF/Microwave Assembly Capability
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Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
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Product
Thermal Cycling Test Equipment
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Wewon Environmental Chambers Co, Ltd.
IC welding to PCB, IC is integrated in the chip general purpose circuit, it is a whole. Once the inside is damaged, the chip will be damaged. The goal of printed circuit boards (pcbs) is to connect IC and discrete components to form a larger working circuit. Thermal cycling equipment can detect the defects and hidden dangers of welding components in the production process, decreasing failure rate. When it fails, components can be replaced in timehttps://www.wewontech.com/thermal-cycling-test-equipment/
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XMC Display Control Card
XM26001
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LinkedHope Intelligent Technologies Co.,Ltd.
XM26001 is a graphics, image processing and computing single-board computer independently developed by Linghao Intelligent®. It uses the AMD G series APU GX-210HA by default, integrating the CPU, GPU, south bridge and north bridge on one silicon chip.
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Temperature Forcing System
ETF-SERIES
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Precise Temperature Accuracies with Reliable Test Results Temperature Limits: -40/-60 °C to 30 °C Temperature Accuracies: ±2-3°C Temperature Rate of Change: 20-25 deg /min (Non-linear) Maintenance Free Access to The System Self-Sufficient System Compact with small footprints suitable for any space constraint laboratories Low decibel system Suitable for testing electronic chips / devices Environmentally friendly refrigerants Efficient heating Microprocessor based single set point PID temperature controller with data logging Flexible hose up to 2.5-3.0m Interchangeable heads according to chip size. Inbuilt electrical control panel with switchgear system
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Product
8GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U8GE32-SE
Memory Module
8GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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20μm Silicon Interdigitated Electrode Chip
SBC1
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High-stability 20μm silicon IDE chip for MEMS, gas sensing, biosensing, and photoelectric applications.
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High Performance Embedded Development Kit
TySOM EDK
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The TySOM™ Embedded Development Kit is for the embedded designers who need a high-performance RTL simulator/debugger for their embedded applications such as IoT, Automotive, Factory automation, UAV and Robotics. The kit includes Riviera-PRO™ Advanced Verification Platform and a TySOM development/prototyping board. TySOM boards come with either a Zynq 7000 chip (FPGA + Dual ARM® Cortex™-A9) or with a Zynq® UltraScale+™ MPSoC device. These boards include memories, and various communication and multimedia interfaces in addition to FMC connectors for peripheral expansion. Reference designs for application such as IoT, ADAS, 4K UltraHD imaging and Robotics and a complete reference design, which contains the SW (Linux) and all the hardware blocks required to support the peripherals on the board, are provided.
