Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Phototransistors
Phototransistors are photodiode-amplifier combinations integrated within a single silicon chip. The phototransistor can be viewed as a photodiode whose output current is fed into the base of a conventional transistor. These photodiode-amplifier combinations are put together to overcome the major limitation of photodiodes: unity gain. The typical gain of a phototransistor can range from 100 to over 1500.
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High Performance Embedded Development Kit
TySOM EDK
The TySOM™ Embedded Development Kit is for the embedded designers who need a high-performance RTL simulator/debugger for their embedded applications such as IoT, Automotive, Factory automation, UAV and Robotics. The kit includes Riviera-PRO™ Advanced Verification Platform and a TySOM development/prototyping board. TySOM boards come with either a Zynq 7000 chip (FPGA + Dual ARM® Cortex™-A9) or with a Zynq® UltraScale+™ MPSoC device. These boards include memories, and various communication and multimedia interfaces in addition to FMC connectors for peripheral expansion. Reference designs for application such as IoT, ADAS, 4K UltraHD imaging and Robotics and a complete reference design, which contains the SW (Linux) and all the hardware blocks required to support the peripherals on the board, are provided.
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EMV Training
Barnes regularly provides EMV chip card implementation training and hands-on chip consultancy for both business and IT personnel. Whether migrating to chip cards for the first time, introducing new personnel to chip technology or implementing a new chip product, it is important that key staff receive a thorough grounding in the technology and the way it impinges on other aspects of the business.
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IC Test Clips
Low-profile fine-pitch chips, desnely populated boards, or vertical boards, Pomona test clips connect you with confidence.
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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PCIe Gen 4.0 RAID Adapter
MegaRAID 9580-8i8e
The MegaRAID 9500 series is the industry’s first PCIe Gen 4.0 RAID adapter family, offering PCIe Gen 4.0 host and storage interfaces. The MegaRAID 9580-8i8e adapter, based on the SAS3916 high-port count PCIe 4.0 x8 RAID-on-Chip (RoC), delivers twice the performance of previous generations.
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Wireless Test Solutions
Adivic/Chroma Group has been in the development of RF & Wireless test solutions for more than a decade. Take RF Recorder as an example, it has been adapted by all major Japanese & Korean automotive brand names such as Mitsubishi, Honda, Hyundai,.. ,most of the global IC design houses with DTV chips, and also military entities in NATO. With the same customer-proved Software Defined Radio architecture, we have introduced Wi-Fi, Bluetooth tester since 2014. It will soon cover other current/future wireless standards such as 4G/LTE, 802.11ax, 802.11ah, etc.
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Mobile Forensics Tool-Chip off
Mobile phone forensics-chip-off data recovery -system verifydebug and internal-analyzequality review.etc
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Fixed Clamp-on Flowmeter
D116
Gentos Measurement & Control Co.
D116 Series Ultrasonic Flowmeter is a state-of-the-art universal transit-time flowmeter designed using FPGA chip and low-voltage broadband pulse transmission.
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High Performance Netlist Debugging and Netlist Viewing
GateVision PRO is the third generation of graphical gate-level netlist analyzers and netlist viewers from Concept Engineering. Please check out the Demo Video: Basic Features. Completely rewritten to run on modern 32/64bit platforms, GateVision PRO provides the designer of even the largest chips and SoCs with intuitive design navigation, netlist viewing, waveform viewing, logic cone extraction, interactive logic cone viewing for netlist debugging and design documentation.
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P/N 1110087 144-Pin VQFP-to-PGA Adaptor
1110087
144 Pin VQFP to PGA Adapter. Convert surface mount VQFP packages to a 13 x 13 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact. Consult factory for panelized form or for mounting of consigned chips.
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68-Pin PLCC with Die Flipped-to-68-Pin PGA for 87C196 IC and Others
68-304538-10
68P PLCC WITH DIE FLIPPED TO 68 PGA FOR 87C196 IC AND OTHERS. Correct-A-Chip technology solves problems associated with the use of alternative ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs.
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Wafer Test
Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
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Analyze RTL
ASICs and FPGA routinely have millions of gates with memories, transceivers, third party IP and processor cores. Problems can be time consuming and complex to debug in the lab and through simulations. Designers need verification tools that can identify problems quickly to reduce their verification and debug time before simulation, before synthesis, and definitely before burning chips in the lab.
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Impulse Voltage Generator
GDCY
The impulse voltage generator is mainly used to the field of impulse voltage tests by lightning impulse voltage full wave, lightning impulse voltage chipped wave and operate impulse voltage wave for such test products as electrical instrument.
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Software
SSI-TRES
Was developed to read and edit Plug and Play Smart Sensors that are compliant to the IEEE 1451.4 Standard. TEDS, or transducer Electronic Data Sheet, is a set of electronic data in a standardized format defined within the IEEE 1451.4 standard. This data specifies what type of sensor is present, describes its interface, and gives technical information such as sensitivity, bridge type , excitation, etc. This information is stored in an EEPROM chip attached to the sensor. By having this chip, the sensor can identify and describe itself to the network and or Smart Load Cell Meter (DPM-3), thereby easing automatic system configuration.
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ARM LPC2364 Board
MS 1541
- 128KB On chip Flash- 16*2 line LCD Module interface- Two CAN channel at 1MPBS- Ethernet interface which supports 10/100 MBPS- Full Modem RS232 interface- RS485 interface- RTC (Real Time Clock)- 2048 bits serial EEPROM with data protect and sequential read.- 24 ULN outputs of 12V level.- Eight 110V DC inputs interface.- Six digital inputs interface- Four on board keys interface- Power delay circuit for external use- ON board inspection circuit
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32+2 Channel 12bit 5 GS/s Switched Capacitor Digitizer
V1742
12 bit @ 5 GS/s, 1-unit wide 6U VME64 module, Switched Capacitor technology based on the DRS4 chip (designed at Paul Scherrer Institute) 1024 capacitor cells per channel (acquisition window of ~ 200 ns @ 5 GS/s)
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RF Power Generators
MKS RF Power Generators provide reliable solid state power for thin films processing equipment. They are vital components of semiconductor fabrication systems, which produce the integrated circuits (ICs) or chips required by modern computers and electronic equipment. MKS RF Generators, combined with our Impedance Matching Network and our V/I Probe form a complete RF Delivery System.
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Probe Cards
PICOPROBE® PROBE CARDS by GGB Industries, Inc., allows for more chip design flexibility because each probe card is custom configured to your circuit for testing wafers on either manual or automatic probe stations. Probe cards with complex layouts consisting of numerous DC contacts and multiple microwave probes with operating frequencies of 40, 50, 67, or 110 GHz can be custom fabricated quickly and inexpensively.
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RTOS
LynxOS
The embedded market is exploding with the dawn of the “Internet of Things”. The basic idea being that almost everything will ultimately be connected to the internet and these embedded devices are becoming more complex. This means they need to run more full functioned operating systems, with connectivity and popular human interfaces, require more processing power, including multi-core chips, and are likely to be exposed to the same types of cyber attacks that we are facing in our corporate and personal computers.Lynx Software Technologies addresses these needs with our high performance LynxOS operating systems and tools based on open standards. Our new powerful RTOS security features allow embedded developers to design their systems to be more secure before they are connected to the internet.
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Receivers
SDR receivers (Software Defined Radio) perform all signal processing in software, offering multi-standard support, access to all data in the channel, and advanced RF measurements.DekTec's other receivers are based on standard demodulator chips and therefore do not take cycles from the host CPU. These can be used if the SDR features are not required.
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SMARC
ROM-7421
ROM-7421 Qseven Module integrates ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips to be Linux support ready. NXP i.MX6 supports 2D, 3D graphicsacceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
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60 GHz WR-15 Waveguide Tx Module
PEM010
The PEM010 is a highly integrated millimeter wave transmitter that covers the 60 GHz global unlicensed spectrum allocations packaged in a standard waveguide module. Transmitter architecture is a double conversion, sliding IF with wide bandwidth capability through the up-conversion chain from baseband to carrier. The I/Q interface accepts analog baseband signals which provides for flexibility in design and applications. The baseband input optionally supports FSK/MSK modulation for non-coherent applications. The transmitter incorporates a complete waveguide interface with low-loss transition between the chip and the WR15 waveguide port. The integrated package is small and lightweight, with a simple to use multi-pin ST4 connector for power, reference clock, digital control port and baseband signals. Either of two reference clocks can be used for setting 540 MHz or 500 MHz channel spacing.
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Hot Electron Bolometer (HEB) Mixers/ Receivers In Terahertz Range
Insight Product Company offers Hot Electron Bolometer (HEB) mixers, receivers, and chips made from NbN or NbTiN thin film. The HEB mixers can operate at frequencies of up to several terahertz.
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High Power DC Electronic Load
M97XX series
The new M97XX series programmable DC electronic load is a new generation product designed from Maynuo Electronic Co.,Ltd. Incorporating high-performance chips, the M97XX series delivers high speed and high accuracy with a resolution of 0.1 mV and 0.01 mA (basic accuracy is 0.03% and basic current rise speed is 2.5 A/μs). M97XX series have wide application from production lines for cell phone chargers, cell phone batteries, electronic vehicle batteries, switching power supplies, linear power supplies, and LED drivers, to research institute, automotive electronic, aeronautic and astronautic, maritime, solar celland fuel cell etc.test and measurement applications.
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Image Sensor/Fingerprint-on-Display Testing
Enli Tech provides the most advanced optical and non-destructive inspection technology, which can de-convolute the digital images back to the analog properties, such as quantum efficiency, spectral response, system gain K, Dynamic Range (DR), PRNU, DRNU, Linearity Error LE, and Chief-Ray-Angle (CRA). The testing solution can be applied to CCD and CMOS image sensors in aerospace, defense, and scientific camera field. Image sensor packages that can be tested by Enli Tech’s systems include bare wafers, dies, chips, or camera modules. Our image sensor testers can help users reduce the sensor-modules or camera-modules development time and RD budget.
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AFDX®/ARINC664P7 Modules
AIM’s AFDX®/ARINC664P7 test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. Versions are available to support the Boeing specific ARINC664P7 extensions.
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Step Recovery Diodes
SemiGen’s SSR series of Step Recovery Diodes are epitaxial silicon varactors which provide high output power and efficiencies in harmonic generator applications. Using custom epitaxial wafers, our process ensures high reproducibility. The silicon dioxide passivation process assures greater stability and low leakage currents over temperature. Uniform capacitance ensures repeatability from device to device. These diodes are available in chip or packaged form.
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SMARC
ROM-5420 B1
ROM-5420 SAMRC v1.1 Module integrates ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips to be OS support ready. NXP i.MX6 supports 2D, 3D graphics acceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
