Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Step Recovery Diodes
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SemiGen’s SSR series of Step Recovery Diodes are epitaxial silicon varactors which provide high output power and efficiencies in harmonic generator applications. Using custom epitaxial wafers, our process ensures high reproducibility. The silicon dioxide passivation process assures greater stability and low leakage currents over temperature. Uniform capacitance ensures repeatability from device to device. These diodes are available in chip or packaged form.
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Product
XMC Display Control Card
XM26001
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LinkedHope Intelligent Technologies Co.,Ltd.
XM26001 is a graphics, image processing and computing single-board computer independently developed by Linghao Intelligent®. It uses the AMD G series APU GX-210HA by default, integrating the CPU, GPU, south bridge and north bridge on one silicon chip.
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Product
High-Speed Digital Output
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High-speed digital output photocouplers (optocouplers) are optically coupled high-speed, totem-pole output isolators containing a GaAlAs LED on the input side and a photodiode and signal processing circuit on the output side in a single chip.
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Product
Video Signal Generator
MSPG-4600MT
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MSPG-4600MT is basically supporting the Teletext and Closed Caption as multi broadcast for the D-TV (NTSC, PAL), as well as V-Chip (Violence Chip) function to block the violence and sex etc. bad program to protect a person under age through the regulation grade.
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Data Loggers
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Premier Electrosystems has a wide range of data loggers to suit your needs. All our data loggers can be customized as per requirement. Data loggers are electronic devices which automatically monitor and record environmental parameters over time, allowing conditions to be measured, documented, analysed and validated. The data logger contains a sensor to receive the information and a computer chip to store it. Then the information stored in the data logger is transferred to a computer for analysis.
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Product
13MP MIPI Camera Module
e-CAM130_CUMI1820_MOD –
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e-CAM130_CUMI1820_MOD is a 13MP MIPI Camera Module. This small form factor 13MP camera module comes with S-Mount lens holder. It is based on AR1820HS – an 18MP CMOS Image sensor from Aptina™ / ON Semiconductor® and has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images and video and the optional MJPEG compression. Though the AR1820HS is an 18MP image sensor, the e-CAM130_CUMI1820_MOD supports only up to 13MP resolution.
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Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Radar Core Chips
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Macom Technology Solutions Holdings Inc.
Multifunction GaAs and Silicon MCM designed for communication radar and weather applications. MACOM Core Chips deliver a complete transmit/receive function with phase and amplitude control.
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Actuators, Adjusters, & Transducers
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We offer a wide range of adjustment screws, micrometers, and kinematic positioners, as well as stepper motor, DC servo, high-precision piezo inertia actuators, and voice coil actuators. Additionally, our piezoelectric offerings include modular, screw, and replaceable-tip piezoelectric actuators, as well as Langevin transducers for ultrasonic welding applications. A wide variety of piezoelectric chips and stacks are also available.
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cRIO Modules
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The cRIO technology (RIO = reconfigurable I / O) from National Instruments enables the creation of customized measurement and control hardware circuits based on FPGA chips using the NI LabVIEW graphic development tool. The cRIO core comprises an FPGA chip and surrounding circuits that allow LabVIEW to perform a hardware synthesis.
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STANAG3910/EFEX Modules
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AIM’s STANAG3910/EFEX test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. The latest versions also support avionics discrete I/O. Configurations with dual redundant concurrent HS/LS Bus Controller (BC), Multiple Remote Terminals, and Chronological/Mailbox Bus Monitor operation with full HS/LS protocol error injection/detection, multi-level triggering, advanced capture/filtering and real time bus recording, time stamping and physical bus replay ensure your bus integrity. Support for EFAbus Direct Digital Links (DDL), Fibre Optic DDL (FODDL) and EFAbus Express extensions (Mixed Mode and Dual Mode operation) are available. To support the French ‘Rafale’ aircraft, modules are available with an Electrical Front End. Single Function variants support cost effective solutions. Each module is delivered with a Board Support Package (BSP) containing the onboard driver software, a full Application Programming Interface (API) and detailed getting started and programming guides. Powerful PBA.pro databus test and analysis software is optionally available for all our STANAG3910 modules.
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64 Channel Multihit TDC
VX1190B-2eSST
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The VX1190B-2eSST is a 64 channel Multihit TDC, housed in a 1-unit wide VME64X 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB can be set at 100 ps (19 bit resolution, 52 µs FSR), 200 ps (19 bit, 104 µs FSR) or 800 ps (17 bit, 104 µs FSR).
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Product
Qseven Module with 4th Generation Intel Atom® Processor E3800 Series SoC (formerly codename: BayTrail)
Q7-BT
Computer on Module
The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Inductors
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Murata offers a broad lineup of chip inductors that fit diverse requirements such as compact size, large current, etc. across applications ranging from consumer use to automotive applications that require high reliability. We are also productizing inductors with superior mountability thanks to their SMD type that are suited to specific applications such as high-frequency circuits, power supply circuits, in-vehicle PoC, short-range wireless communication, etc.
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Wafer Probers
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Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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Product
Services
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For over three decades, Teledyne Microwave Solutions has built a strong heritage delivering advanced value added services to the military, space and industry sectors of aerospace. With test capabilities up to 40 GHz, TMS offers chip and wire assembly of products ranging from single die through complex hybrids which can then be submitted to a combination of customer-specified RF and DC testing and environmental screening. TMS offers a complete portfolio of screening and testing services for device sorting, labeling, lead forming and tinning, and tape-and-reel packaging, as well as LAT services on packaged devices or bare-die, including diodes, transistors, and MMICs.
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Product
Scalable Multi-Channel Active Thermal Control (ATC)
T-Core Thermal Control System
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Cohu’s proprietary T-Core thermal system’s controller provides precise, multi-site temperature management of power dissipation ICs, such as graphic chips and CPUs, optimizing test yield.The T-Core thermal control system optimizes test yield at cold, ambient, and hot temperatures and offers better than +/- 1°C accuracy with response speeds of >125°C/sec. The system’s flexibility to control air, liquid, and refrigerant based thermal heads gives semiconductor manufacturers excellent temperature control capability for high volume manufacturing.
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ARM LPC2364 Board
MS 1541
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- 128KB On chip Flash- 16*2 line LCD Module interface- Two CAN channel at 1MPBS- Ethernet interface which supports 10/100 MBPS- Full Modem RS232 interface- RS485 interface- RTC (Real Time Clock)- 2048 bits serial EEPROM with data protect and sequential read.- 24 ULN outputs of 12V level.- Eight 110V DC inputs interface.- Six digital inputs interface- Four on board keys interface- Power delay circuit for external use- ON board inspection circuit
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PIN Diodes
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The SemiGen SGP7000 series of PIN Diodes are processed with a high-resistivity epi that have intrinsic layers that range in thickness from 4 micron to 200 micron depending on performance specifications. These devices are typically manufactured with either a robust thermal-oxide passivation or ceramic glass for durable high-power applications. These diodes are made with a grown junction P++ layer that yields abrupt junction structures that provide low punch through voltages and minimize autodoping. They are available as chips or in your choice of packages.
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Product
Digital Color Camera for Microscopy
LC30
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The LC30 is a 3.1 megapixel digital color camera for microscopy that combines versatility with performance. The LC30 is the ideal entry-level microscope camera for quality bright-field imaging － suitable for material science applications. The Olympus LC30 color camera for microscopy combines versatility with performance. With up to 37 frames per second (fps), faithful color reproduction, full integration into Olympus imaging platforms, and an excellent cost-performance ratio, the LC30 is the ideal entry-level microscope camera for quality bright-field imaging － suitable for material science applications.. The sensitivity and frame rate of the 3.1-megapixel CMOS chip can be increased using various binning modes, resulting in easy observation and focusing. The LC30 camera can be quickly and easily mounted on all microscopes equipped with a standard C-mount adaptor, and requires only a single USB 2.0 cable for high-speed data transfer and power supply. Its complete integration into the OLYMPUS Stream imaging platforms helps ensure the seamless interaction of microscope, camera, and additional devices, delivering intuitive and efficient operation.
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Product
3D-IC Solution
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Consumer demand for increased bandwidth and low power in smaller form factor has forced design teams to pursue design and manufacturing alternatives to single system-on-chip (SoC) approaches. Moving to advanced geometries like 20nm/14nm is a natural progression; however, it has its own cost, yield, manufacturing, and IP reuse challenges.
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VIS-SWIR FPA's
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Imaging electronic sensors sensitive in visible, near infrared, short wavelength infrared spectral bands that generate two dimensional electronic images have found mass applications in industry, defense, security, science, environmental protection, medicine etc. Imaging sensors sensitive only in VIS/NIR range are almost exclusively silicon chips manufactured using a series of technologies: CCD, CMOS. ICCD, EMCCD, EBAPS, sCMOS in color or monochromatic versions. Color VIS/NIR sensors are sensitive to light only in visible range when monochromatic VIS/NIR sensors are sensitive up to about 1000nm.
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Ultra High Speed Programmers
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With superpro/7500 as the representative of the high-speed programmer, support chip comprehensive, burning faster, is adhering to the Superpro family's outstanding pedigree of the latest professional intelligent general programmer/burner/burner. Relying on Xeltek powerful device.
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High Precision Electronic Load
PEL-8000
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PEL-8000 series adopts high-performance chip high-speed and high-precision design, providing resolution of 0.1mV, 0.01mA (basic accuracy is 0.03%, basic current rise rate is 2.5A / US)
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Product
Lab Moisture Analyzer
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PC-Based laboratory/production Moisture Analyzer connects through the RS-232 Serial Port. For nuts, granules, powders, pellets, chips or flakes. Complete with:– MCPC-RS Test Chamber– Windows PC-Based Software– Two Sample Cups– Dial Thermometer– Standard Block– RS-232 Cable (10 Feet)– USB to RS232 Adapter– Operating Instructions Manual– 115VAC/60HZ Wall Transformer
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SMARC
ROM-5420 B1
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ROM-5420 SAMRC v1.1 Module integrates ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips to be OS support ready. NXP i.MX6 supports 2D, 3D graphics acceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
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Model MCPC: Lab Moisture Analyzer
AM-MCPC-RS
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PC-Based lab/production moisture analyzer connects through RS-232 Serial Port. Designed for nuts, granules, powders, pellets, chips, or flakes. Includes two sample cups, MCPC-RS test chamber, windows PC-based software, and more. See product link for complete features and minimum computer requirements.
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Optical Voltage Probe
400-02
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Srico’s optical voltage probe uses advanced, proprietary optical chip technology to achieve precise, interference-free measurement. Our sensor and optical fibers are made of dielectric materials. This facilitates a high degree of isolation between the voltage test point and the instrumentation system ⎯ at a safe distance of 100 meters and more. This system senses, measures, and transmits electrical data very accurately.
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GPIB PC/104 Interface Card & Cable
GPIB-PC104-XL
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The ines GPIB PC/104 interface card uses the enhanced features of the ines GPIB chip , resulting in a reliable solution for industrial measurement.
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SparkFun Cryptographic Co-Processor Breakout
ATECC508A (Qwiic)
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The SparkFun ATECC508A Cryptographic Co-Processor Breakout allows you to easily add strong authentication security to your IoT node, edge device, or embedded system. It includes two Qwiic ports for plug and play functionality. Utilizing our handy Qwiic system, no soldering is required to connect it to the rest of your system. However, we still have broken out 0.1"-spaced pins in case you prefer to use a breadboard. The ATECC508A chip is capable of many cryptographic processes, including, but not limited to:
