Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
16GB SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V16GN56-SB
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
3D Measurement
PSD-Array
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The PSD array consists of 16 parallel one-dimensional PSD elements on the same chip. By utilizing the triangulation technique the reflection of a laser line or multiple laser spots onto the PSD array will provide information about the contour of the illuminated object. The possibility for simultaneous readout of the 16 elements together with the fast response of each element makes the PSD array suitable for applications like high speed 3D contour measurements and measurements of parallel, moving objects such as cantilevers.
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Product
64 Channel Multihit TDC
V1190B-2eSST
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The V1190B-2eSST is a 64 channel Multihit TDC, housed in a 1-unit wide VME 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB can be set at 100 ps (19 bit resolution, 52 µs FSR), 200 ps (19 bit, 104 µs FSR) or 800 ps (17 bit, 104 µs FSR).
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Product
NVIDIA Jetson Solutions
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Edge AI Inference computers have NVIDIA Jetson chips for video image applications in surveillance, transportation, and manufacturing sectors.
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Product
3.4 MP Custom Lens Low Light Camera Module
e-CAM30_CUMI0330_MOD
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e-CAM30_CUMI0330_MOD is a high performance, small form factor, 3.4 MP pluggable Low Light Camera Module with S-Mount lens holder. It is based on AR0330 - a 3.4MP CMOS Image sensor from ON Semiconductor®. It has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs the entire Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the optional MJPEG compressions.
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Product
DIP Test Clips
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Low-profile fine-pitch chips, desnely populated boards, or vertical boards, Pomona test clips connect you with confidence.
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Product
Enhance Transactional Universal Verification Methodology (UVM) testbenches
TrekUVM
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TrekUVM automatically generates self-verifying test cases that run in existing transactional testbenches, including those compliant with the Universal Verification Methodology (UVM) standard. This verifies your chips more quickly and more thoroughly than using UVM alone to generate transactions. TrekUVM's generated test cases target all aspects of full-chip verification and work in a variety of different environments.
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Product
2000-6000W AC power source
CX-P2KW
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Shenzhen Chuangxin Instruments Co., Ltd.
The AC power source is made by adopting microcomputer processing chip and high power device. It provides a stable pure sine wave and has voltage, over current, over temperature, overload protection. It can output 0-300V adjustable voltage, and 45-70Hz adjustable frequency as well as fixed frequency as 50 Hz or 60 Hz, 100 Hz and 200 Hz and 400 Hz. This AC power source can simulate power grid of different countries, provide a stable voltage, frequency, waveform which can be used to test and age the exprot products and provide kinds of precision tests for laboratory, measuring room, etc.
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Product
Low Light USB Camera With Microphone
Conversa
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Conversa, camera for conversation (See3CAM_CU38), is a 3.4 MP low light USB 3.1 Gen1 camera with built-in stereo microphone providing 16bit audio @48KHz. This low-light USB camera is the next advanced version of our flagship product See3CAM_CU30, with built-in stereo microphone for crystal clear sound. It is a plug-and-play (UVC and UAC) compliant USB 3.1 Gen1 SuperSpeed camera and is also backward compatible with USB 2.0 host ports. It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement. It has a dedicated, high-performance Image Signal Processor chip (ISP) that performs all the Auto functions (Auto White Balance, Auto Exposure control).
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Product
STANAG3910/EFEX Modules
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AIM’s STANAG3910/EFEX test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. The latest versions also support avionics discrete I/O. Configurations with dual redundant concurrent HS/LS Bus Controller (BC), Multiple Remote Terminals, and Chronological/Mailbox Bus Monitor operation with full HS/LS protocol error injection/detection, multi-level triggering, advanced capture/filtering and real time bus recording, time stamping and physical bus replay ensure your bus integrity. Support for EFAbus Direct Digital Links (DDL), Fibre Optic DDL (FODDL) and EFAbus Express extensions (Mixed Mode and Dual Mode operation) are available. To support the French ‘Rafale’ aircraft, modules are available with an Electrical Front End. Single Function variants support cost effective solutions. Each module is delivered with a Board Support Package (BSP) containing the onboard driver software, a full Application Programming Interface (API) and detailed getting started and programming guides. Powerful PBA.pro databus test and analysis software is optionally available for all our STANAG3910 modules.
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Product
Inductor Tester
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An impulse can be applied to the coil of a chip power inductor to perform insulation tests (surge tests) within the windings.
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Product
Spectrometer - OSA
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HighFinesse optical spectrometers LSA and HDSA are designed to analyse the multi-line or broadband spectrum of (un-)known light sources like cw and pulsed lasers, gas discharge lamps, super luminescence diodes, semiconductor laser diodes and LEDs. They are suitable to analyze the spectrum of telecom signals, resolve Fabry-Perot modes of a gain chip, and produce a spectral measurement of gas absorption.
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Product
Arduino CAN Shield
IFB-10003-ANP
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CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt line to the MCP2515 and two LEDS are also provided. The chip select and interupt lines are selected via zero ohm resistors and have several configuration options for flexibility stacking additional shields. A set of stackable headers is included with this board, not installed. An optional on-board voltage regulator may be used to supply 7.5V to the Arduino's 'Vin' pin (which is regulated to 5V by the Arduino's on-board LDO). The CAN shield regulator supports a wide input range of 9V to 32V. This makes it possible to cleanly build a stand-alone CAN node (remote sensor) without the need for a separate Arduino power supply!
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Microcontrollers
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Frontgrade offers highly integrated, full-featured SPARC and Arm®-based Rad Hard microcontrollers ideal for system-on-chip (SoC) applications. These small footprint, low power devices are augmented with integrated analog front-end components making them ideal for mixed signal processing.
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Product
32 Channel Multihit TDC (25 ps)
V1290A-2eSST
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The V1290A-2eSST is a 32 channel Multihit TDC, housed in a 1-unit wide VME 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB is 25 ps (21 bit resolution, 52 µs FSR). The module accepts both ECL and LVDS inputs.
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Product
Pressure Sensors
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ST’s tiny silicon pressure sensors use innovative MEMS technology to ensure extremely high-pressure resolution in ultra-compact and thin packages. The devices implement proprietary technology for the fabrication of pressure sensors on monolithic silicon chips, which eliminates wafer-to-wafer bonding and maximizes reliability.
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Image Sensor/Fingerprint-on-Display Testing
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Enli Tech provides the most advanced optical and non-destructive inspection technology, which can de-convolute the digital images back to the analog properties, such as quantum efficiency, spectral response, system gain K, Dynamic Range (DR), PRNU, DRNU, Linearity Error LE, and Chief-Ray-Angle (CRA). The testing solution can be applied to CCD and CMOS image sensors in aerospace, defense, and scientific camera field. Image sensor packages that can be tested by Enli Tech’s systems include bare wafers, dies, chips, or camera modules. Our image sensor testers can help users reduce the sensor-modules or camera-modules development time and RD budget.
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Signal Integrity Products
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Renesas' signal integrity products provide a 300% reach extension over passive copper solutions, and consume 80% less power than competing optical solutions. Renesas lane extender chips with analog equalizers are the perfect solution for DisplayPort™ USB-C long active cables.
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Product
System Level Test
SLT
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As technology nodes continue to evolve and with a more aggressive time to market to bring devices to their end applications, full test coverage of such chips is possible only with System Level Testing.
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Product
Precision Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
Video Signal Generator
MSPG-4600MT
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MSPG-4600MT is basically supporting the Teletext and Closed Caption as multi broadcast for the D-TV (NTSC, PAL), as well as V-Chip (Violence Chip) function to block the violence and sex etc. bad program to protect a person under age through the regulation grade.
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Product
Step Recovery Diodes
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Macom Technology Solutions Holdings Inc.
MACOM’s Silicon and GaAs varactor multiplier diodes provide broadband performance ranging from 10 MHz to 70 GHz. They are ideal for multiplier circuits and are available in die form, plastic and ceramic packaging. These diodes boast a flip chip series for higher frequency millimeter wave applications; plastic packaged series for microwave frequency surface mount applications; ceramic packaged series for high power waveguide and coaxial applications.
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Product
Probe Series
AVIOR Series
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The MPI AVIOR series offers a broad lineup of high performance prober systems targeting the Optical Communications market. Our prober systems are available in Top emitting (TP), Flip chip (FP) emitting and Die/Package (DP) configurations to meet your specific test requirements. Whether it be R&D or mass production, MPI has a solution that will meet your needs for accurate and reliable measurements in conjunction with a reduced cost-of-test.
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Product
Advanced SoC Test System
3680
Test System
The Chroma 3680 is an advanced SoC test system with data rate up to 1Gbps. The Chroma 3680 is capable of conducting parallel tests on multiple chips to meet the digital and analog IC testing requirements, with applications including MCU, digital audio, digital TV, set-top box, DSP, network processor, field programmable gate array (FPGA) and consumer electronics.
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Product
Dummy Test Wafers/Chips
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Advanced Dummy Test Wafers/Chips available with over 35 different chip designs and choices of 11 different material configurations as well as kits complete with test vehicles. Custom-make test production of TEG wafer/glass (TEG=Test Element Group). Design and provide custom-make test kit.
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Product
Copper Pillar Bump
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Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Product
1D/2D Barcode Reader
UTC-510P-B
Barcode Scanner Module
1D/2D:752x480 CMOS2D Barcode Decoder Chip 72MHzRed LED 625±10 nm. 1D Linear:20% minimum reflective differenceTypical 3 mil (Code 39, PCS 0.9)Up to 24 inches on 100% UPC/EAN symbolsUp to 31.5 inches on 20 mil Code 39630nm visible red LED.
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Product
Chip Tester
TL2000
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ficonTEC’s series of testing machines is focused on automated electro-optical characterization ofsemiconductor chips. The ficonTEC TL2000 is a fully automated test and inspection system for unmountedlaser diode bars, single chips and chips on submounts.
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Product
Cut Susceptibility Tester
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King Design Industrial Co., Ltd.
Equipment conforms to IEC61730 MST12 specification. Pre- or post-round can be selected for control wiring connection. With weights block’s positioning pin is removed before test; and is inserted in the rear positioning hole for the remaining time. Equipped with rings at both front and rear end; used to connect a rope and control the driving direction. Use replaceable special cutting chip.
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Metrology
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KLA’s metrology systems address a range of chip and substrate manufacturing applications, including verification of design manufacturability, new process characterization and high volume manufacturing process monitoring. By providing precise measurement of pattern dimensions, film thicknesses, layer-to-layer alignment, pattern placement, surface topography and electro-optical properties, our comprehensive set of metrology systems allows chip manufacturers to maintain tight control of their processes for improved device performance and yield.
