Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Semiconductor Test Equipment
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Wewon Environmental Chambers Co, Ltd.
Probe card manufacturing need the semiconductor test equipment. When we designed the thermal testing equipment, Only some commonly used test items are packaged into the IC tester, and the logic function of the verification chip is implemented in a fixed test mode. But as chip products diversify, Some thermal inducing system can no longer do it alonehttps://www.wewontech.com/semiconductor-test-equipment/
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Product
48-CH DIO & Timer/Counter Cards
cPCI-7248/7249R
Counter/Timer Module
- PICMG 2.0 Rev 2.1- 48-CH digital TTL/DTL input/output- Emulates 4/2/1 industry standard 8255 PPI (mode 0)- Direct interface with OPTO-22 compatible I/O modules Output port status read back- On board 8254 timer/counter chip
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Product
COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
Computer on Module
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Product
Ground Leads Continuity Tester
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Weshine Electric Manufacturing Co., Ltd
1. The new power supply technology is adopted in the grounding down lead conduction tester.2. It has the characteristics of small size, light weight, large output current, good repeatability, strong anti-interference ability and protection function. 3. The whole machine is controlled by single chip microcomputer, which has a high degree of automation. 4. The instrument has high precision and easy operation. The maximum current is 10A.
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Product
Ultra-compact Photoelectric Sensor
EX-20 Ver.2
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Panasonic Industrial Devices Sales Company of America
Using a single chip optical IC, Panasonic created the powerful EX-20 Ultra-Compact Photoelectric Sensors, which are among the smallest Photoelectric Sensors worldwide and in spite of their miniature size, the Sensors incorporate a sensitivity adjuster. Since a red LED dot light source is used, alignment and confirmation of the sensing position is easy, even if very tiny objects have to be detected.
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Product
Compact Goniophotometer
LSG-1200A
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The compact goniophotometer of LSG-1200A is used to measure the luminous intensity distribution curve, intensity data, spread angle and other parameters for Chip LED, LED Module, LED Spotlight and all other light which beam angle is no more than 180 degree. • Meets the requirements of IEC, CIE and LM-79 standards • Measures beam angle automatically: staple half intensity angle as well as 1/4 intensity angle, 3/4 intensity angle and 1/10 intensity angle which meets the special requirements. • Measured data is matched with international standard form (IES) and can be applied for lighting design by other lighting design software such as DiaLux • LSG-1200A has included a dark room, measures the maximum size of lamps: 180mm • Test range of luminosity: 0.1～30,000lx. Test accuracy of detector: Class 1 • The distance between the tested lamp and detector is 316mm/1000mm • Angle interval: Horizontal angle: 1°/5°/10°/15°/22.5°/30°/45°/90°, Vertical angle: 0.5°/2°/1.5° • The LSG-1200A horizontal automatic rotating on 0°~360° and Vertical automatic rotating on -90°~+90° • Test accuracy of angle: ±0.2° Work with the follow instruments as a System
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Product
.13u ESD diode
Impulse TSMC
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The Impulse TSMC .13u ESD diode was made to provide ESD discharge paths when integrating third party IP in an integrated circuit design for total ESD protection. The Impulse ESD diode has been successfully used with Dolphin Technologies, Artisan/ARM, TriCN/Synopsis I/O libraries, as well as popular IP blocks from RAMBUS, Chip Idea and other quality IP vendors. A 5.5 volt reverse bias anode to cathode operational specification enables the Impulse TSMC .13u ESD diode to be the device of choice for 5 volt tolerant designs.
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Product
SMARC
ROM-7421
Computer-on-Module
ROM-7421 Qseven Module integrates ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips to be Linux support ready. NXP i.MX6 supports 2D, 3D graphicsacceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
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Product
Low Constant Temperature Trough
DRK6691
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Shandong Drick Instruments Co., Ltd.
Drk6691 small low constant temperature trough is a special product designed for small Abbe refractometer, supporting the use of. It has many advantages such as constant speed, constant temperature, small volume, low noise and convenient operation and so on , so it is a higher price products. This product adopts the technology of the one chip computer, PID selftuning regulation technology;adopts imported platinum resistance temperature (Pt100), so it has high precision of temperature control and temperature fluctuation is small; adopts the semiconductor refrigeration technology, so that it consists of advantages of fast refrigeration, no noise.
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Product
Inspection Microscope
Z-NIR
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The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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Product
Receiver Conformance Test Application for IEEE 802.3bm
M8091BMCA
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IEEE 802.3bm Receiver Test Application for 25GAUI-1 Chip-to-Module, Chip-to-Chip, Cable and Backplane.
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Product
Computer-On-Module
CM12001
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LinkedHope Intelligent Technologies Co.,Ltd.
CM12001 integrates the complete functionality of vertex86DX,offering a CPU, system BIOS, 16bit DRAM up to 512MB, keyboard controller, real-time clock, and IDE compatible onboard Flash hard disk up to 16GB. The solution includes a highly integrated embedded CPU chip made by DMP. It has x86 Compatible Processor Core.This module is designed for embedded applications. The pin out of its’ Dimm-pc bus connector corresponds in large part to the pin out of a standard ISA bus. It offers peripheral functions such as USB, PS2, LPT, COM interface...
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
Computer on Module
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
PANAVIA Modules
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AIM’s PANAVIA test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core design with one processor for real time bus protocol support, massive memory and IRIG-B time code encoder/decoder functions are standard. AIM delivers versions of our modules with extended temperature range and conformal coating. With 8 Tx and 8 Rx channels per module, functions include autonomous transmit sequencing, continuous clock and data transmissions, host controlled double buffering, programmable interrupts, data selection on specific tag identifier, selectable triggers on data and/or tags with full protocol error injection/detection, real time bus recording and time stamping to ensure your bus integrity. Each module is delivered with a Board Support Package (BSP) comaptible to the legacy PCI and cPCI hardware modules.
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Product
Flexible Pick & Place Machine W/ 64-feeder Capacity
MC400
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The MC400 Pick and Place machine places an enormous range of components, quickly and accurately, from 0201s through 100 x 150 mm SMDs, including BGAs, MBGAs, CSPs, µBGAs, MLFs, flip chips, odd form components and ultra-fine-pitch parts down to 15 mil. The system is easy to program and operate and comes standard with universal CAD conversion and teach-in capability.
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Product
GPIB PC/104 Interface Card & Cable
GPIB-PC104-XL
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The ines GPIB PC/104 interface card uses the enhanced features of the ines GPIB chip , resulting in a reliable solution for industrial measurement.
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Product
Up Converters
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Macom Technology Solutions Holdings Inc.
MACOM's upconverters are widely used in point-to-point radio, broadband communications, and RADAR applications. Operating up to a frequency of 86 GHz, our upconverters feature an integrated image reject (balanced) mixer, LO buffer, and RF buffer. Some products also include LO multiplication and variable gain, all within a single chip. Available in die, or SMT lead-free QFN and LGA packages, our upconverters boast excellent performance with adjustable bias, high linearity and image rejection with low LO leakage
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Product
Electronic Inspection Systems
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Intego's knowhow even makes it possible to identify challenging defects that may be located under the surface. One system is the inspection of chips by means of lock-in thermography, which visually represents the IR radiation intensity signal of electronics. Special lasers and flash lamps generate a very short heat impulse (10 ms) on the chip, which generates a measurable heat flow. In most cases, a resolution of < 1 μm can be achieved.
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Product
Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Product
Chip Rings
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Panasonic Industrial Devices Sales Company of America
Extremely robust Chip Rings for signal measuring terminals featuring a metal sheet structure for high reliability.
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Product
Imaging
SLA64 (Preliminary)
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A 1 x 64 element silicon-based thermopile array. Each active area is 0.45mm x 2.0mm with a time constant of 42ms and a low Temperature Coefficient of Responsivity of -0.06%/C. It is packaged in a 68-pin QIP. Includes internal 30k 5% NTC chip thermistor provides ambient package temperature measurement. See Thermistor Options p/n: MT04.
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Product
Memory Interface Chips
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Providing memory bandwidth and capacity to unleash the power of multicore processors
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Product
Probe Series
CAPELLA Series
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MPI Photonics Automation is the industry leading provider of turnkey test solutions for the LED / Mini LED manufacturing industry. With more than 10,000 MPI probers installed worldwide, the CAPELLA series of probers have a proven track record of superior performance and reliability. The CAPELLA series probers support electrical and optical characterization of all LED product types (Vertical chip, Lateral chip, Flip-chip) from wafer to packaged die level. Whether you need a high-performance, cost-effective or specialty prober system, MPI PA has the most comprehensive range of LED wafer/chip probers to meet your exacting requirements.
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Product
Arduino CAN Shield
IFB-10003-AWP
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CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt line to the MCP2515 and two LEDS are also provided. The chip select and interupt lines are selected via zero ohm resistors and have several configuration options for flexibility stacking additional shields. A set of stackable headers is included with this board, not installed. An optional on-board voltage regulator may be used to supply 7.5V to the Arduino's 'Vin' pin (which is regulated to 5V by the Arduino's on-board LDO). The CAN shield regulator supports a wide input range of 9V to 32V. This makes it possible to cleanly build a stand-alone CAN node (remote sensor) without the need for a separate Arduino power supply!
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Product
3U Processor Board
CP39101
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LinkedHope Intelligent Technologies Co.,Ltd.
CP39101 is a 3U CompactPCI 4-channel independent isolated serial communication board, designed for industrial communication applications, compliant with PICMG R3.0 2.1 specification.CP39101 adopts EXER 17D158 communication processor as the master control chip. Each of the on-board 4-channel serial port can be individually configured as RS232, RS485 or RS422, and in any mode, CP39101 can be operated properly in extended temperature ( -40℃ to +85℃ ) range.
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Product
MIL-STD-1553 Interface Board
EXC-4000VME/MCH-x / EXC-4000VXI/MCH-x
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The EXC-1553VME/MCH and EXC-1553VXI/MCH cards are based on a MIL-STD 1553 certified "Summit" chip used in many flight critical systems. Each dual redundant channel supports both MIL-STD-1553A and MIL-STD 1553B protocols. Up to eight channels may be programmed individually to operate as a Bus Controller, Remote Terminal, Bus Monitor, or Remote Terminal / Concurrent Bus Monitor. The 32 K x 16 of RAM allotted to each channel for the storage of data and control parameters may be updated in real time.
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Product
16G DDR5-4800 288Pin 2GX8 1.1V Registered Samsung Chip
AQD-D5V16GR48-SB
Memory Module
Samsung Original Chip, Dual 32-bit Subchannels. Increased Banks and Burst Length, DDR5 4.8GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Cloud And Networking
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From laser chips (EMLs, DMLs, and VCSELs) and pluggable coherent transceivers to pump lasers and TrueFlex® colorless/directionless/contentionless ROADMs, Lumentum’s comprehensive, vertically integrated portfolio lowers costs and speeds time-to-market. We optimize our components for best-in-class performance, creating flexible and scalable platforms that address ever-changing market conditions and product migrations. To ensure field reliability, Lumentum uses only the best materials and processes including stringent, proprietary burn-in processes during laser manufacturing.
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Product
Resister
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Our ARFC type Film Flat Chip Resistor & ARFCN type Thin Film Chip Resistor Network are high precision Metal Film resistors produced with high purity. Alumina Substrate and Ni-Cr-Si Resistor Film based on high precision Etching Technology. The electrode Terminals are made with Spattering Film and Nickel-Solder Plating, and solderability is very good in all Flow, Reflow and Dipping type soldering for Hybrid IC, SMT, PCB etc. Our ARFC Metal Film Resistor & ARFCN type Thin Film Chip Resistor are being produced under the thorough quality control, and are being used widely in high precision and high reliability electronics circuit such as Measuring Instrument, Medical Instruments, Communication and other Industrial Instruments.
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Product
16 Channel Multihit TDC
VX1290N-2eSST
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The VX1290N-2eSST is a 16 channel Multihit TDC, housed in a 1-unit wide VME64X 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB is 25 ps (21 bit resolution, 52 µs FSR). The module accepts NIM inputs.
