Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Electrical Receiver Conformance Test Application for IEEE 802.3bs/cd
M8091BSCB
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IEEE 802.3bs receiver test application for 200GAUI-4 and 400GAUI-8, covering chip-to-module, chip-to-chip, backplane, and copper cable interconnects.
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Product
Radio Module (2x2)
SX-PCEAC2
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The SX-PCEAC2 is powered by Qualcomm Atheros radio chip, the QCA6174-5, which features 2x2 wave 2 MU-MIMO technology. It is a dual-band 802.11 a/b/g/n/ac module with Bluetooth support which is designed for devices that require wireless connectivity in a small form factor combined with high performance with throughputs reaching up to 867Mbps.
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Attenuators
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The 01311 attenuator chip series is designed to achieve precision and tight flatness with an attenuation accuracy of ± 0.2 dB on our 1-10 dB pads and ± 0.3 dB on our 11-20 dB pads. SemiGen tests 100% of all attenuator chips prior to shipment to verify that they meet specifications.
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Product
Digital Input/Output Card
IOD-144
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This is a 144-bit full-size card. A Programmable Peripheral Interface chip, type 8255-5 provides three 8-bit ports (A, B, and C) for each 24-bit group. Each port can be independently programmed for either input or output. Port C can also be configured as two 4-bit ports. These cards fully implement Mode 0 of the 8255 PPI chip. (Consult the factory if you desire to operate in Mode 1.) Type LS245 bi-directional transceivers sink 24 mA (optionally 64 mA) and source 15 mA. These transceiver buffers provide hysteresis correction on inputs and added drive capability on outputs. The direction of the transceivers is set by software.
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Product
SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
Computer on Module
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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Product
Trace Evidence Workstation multi-examination
ffTATM
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Powerful and versatile, the ffTA provides the forensic scientist with a range of techniques, both new and old, for the examination of trace evidence including: Glass fragments, bodily fluids, gunshot residues, drugs and illicit substances, paint chips, pigments, organic and synthetic fibres.
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Product
High-Speed Analog Output
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High-speed analog output photocouplers (optocouplers) are optically coupled isolators containing a GaAlAs LED on the input side and a PIN photodiode and high-speed amplifier transistor on the output side in a single chip.
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Product
3U Processor Board
CP32001
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LinkedHope Intelligent Technologies Co.,Ltd.
CP32001 is designed based on the second generation Intel® Atom™ processor and D525, D455,.The processor has the advantages of low power consumption, high performance and other characteristics and also equipped with high performance Southbridge chips: the Intel® I / O Controller Hub 82801HBM (ICH8M).CP32001 memory controller supports up to 4 GB of DDR3 memory (2x 2GB).The maximum resolution of VGA display core is 2048x1536.CP32001 is a small PC, integrates many common interfaces, for example: USB, Gigabit Ethernet. SATA II and COM, and also equipped with high-performance sound card interface.
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Product
Wireless Test Solutions
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Adivic/Chroma Group has been in the development of RF & Wireless test solutions for more than a decade. Take RF Recorder as an example, it has been adapted by all major Japanese & Korean automotive brand names such as Mitsubishi, Honda, Hyundai,.. ,most of the global IC design houses with DTV chips, and also military entities in NATO. With the same customer-proved Software Defined Radio architecture, we have introduced Wi-Fi, Bluetooth tester since 2014. It will soon cover other current/future wireless standards such as 4G/LTE, 802.11ax, 802.11ah, etc.
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Product
Circuit Card Assembly
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Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes
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Data Acquisition & Control
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Blue Chip Technology have been designing and manufacturing data acquisition and control boards since 1986. The current range of boards have digital and analog IO and an excellent record for reliability in the harshest of environments.
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Product
Packaging Manufacturing
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KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Product
Electronic Ballast Analyzer
WT3000
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• It has 8 windows to display each parameter of input and output characteristics • Frequency response for testing input current up to 1MHz, suitable for precise testing of various kind of electronic ballast • WT3000 has expanding analysis for envelope wave. • Symmetry analysis for envelope wave’s crest factor of lamp current • Sampling at ultra-high speed, dynamic analysis single frequency curve, highest sampling frequency is up to 10MHz • Portable with built-in chip micro-processor, particular suitable for development and spot production • RS-232C standard interface can be connected to PC, English version software can run in WinXP or Win7
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Product
PXI-2536, 544-Crosspoint, 1-Wire PXI Matrix Switch Module
778572-36
Matrix Switch Module
544-Crosspoint, 1-Wire PXI Matrix Switch Module—The PXI‑2536 is a high-density 8x68 PXI matrix switch module that is ideal for routing low-power DC signals in validation test systems of mass produced devices such as semiconductor chips and printed circuit boards (PCBs). Featuring FET relays, the PXI‑2536 offers unlimited mechanical lifetime and switching speeds up to 50,000 crosspoints/s. It also features onboard relay counting for relay monitoring and deterministic operation with hardware triggers to improve test throughput.
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Product
Digital I/O Card w/CoS IRQ
PCIe-DIO-24HS
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This product is a x1 lane PCI Express digital I/O board available in two models. The PCIe-DIO-24H is the basic DIO and the PCI-DIO-24HS features advanced change-of-state (COS) detection capabilities. The card emulates an 8255 compatible chip, providing 24 DIO lines. The DIO lines are grouped into three 8-bit ports: A, B, and C. Each 8-bit port is configured via software to function as either inputs or outputs. Port C can be further broken into two 4-bit nybbles via software and configured as either inputs or outputs.
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Product
Ultra-Low Power Computing Module
CM22303
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LinkedHope Intelligent Technologies Co.,Ltd.
CM22303 uses Intel® 7th generation Kaby Lake-Y platform and Core M Ultra low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.6 GHz and the display output resolution can be up to 4K. CM22303 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. SPI BIOS is designed on board to support dual-channel low voltage on board memory (up to 16GB), Gigabit Ethernet, TPM module and other functions. With high-performance and low power consumption, it can be widely used in the field of low power embedded systems. Meanwhile, CM22303 adopts COM Express standard and is compatible with Type10 pin out definition, and also provides rich peripheral interfaces such as USB3.0/2.0, PCIe, SATA, HD Audio etc.
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Product
On-Off Controllers
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The STM6600 and STM6601 smart push-button on/off controller chips offer protection for battery-operated devices in many ways. These include minimizing the risk of powering up without sufficient battery energy to complete the sequence, which can damage the system. It can also prevent power-up if it detects a fault in the power supply.
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Product
Production Programmers
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eltek offers both traditional gang programmers and modern stand-alone models for production cluster setups. Traditional gang programmers come with four independent sockets that allow chips to be programmed concurrently.Recent trends have shifted from gang programming to cluster setups. Cluster setups consist of multiple stand-alone programmers operated by one operator for enhanced efficiency and cost-savings during production.
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Product
Probe Series
CAPELLA Series
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MPI Photonics Automation is the industry leading provider of turnkey test solutions for the LED / Mini LED manufacturing industry. With more than 10,000 MPI probers installed worldwide, the CAPELLA series of probers have a proven track record of superior performance and reliability. The CAPELLA series probers support electrical and optical characterization of all LED product types (Vertical chip, Lateral chip, Flip-chip) from wafer to packaged die level. Whether you need a high-performance, cost-effective or specialty prober system, MPI PA has the most comprehensive range of LED wafer/chip probers to meet your exacting requirements.
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Product
Data Loggers
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Data loggers are electronic devices which automatically monitor and record environmental parameters over time, allowing conditions to be measured, documented, analysed and validated. The data logger contains a sensor to receive the information and a computer chip to store it.
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Microcontrollers (MCUs)
8-bit
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An innovative 8-bit chip design provides a fully-integrated experience. Silicon Labs' 8-bit MCUs are ideal for IoT applications and beyond, delivering the industry's fastest speeds and lowest power.
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Product
Integrated Potentiostat and Multiplexer
EmStatMUX8
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Based upon the EmStat range, there are two types of multiplexers to suit most types of sensor array work. The MUX8 is the most flexible offering the ability to connect arrays made of up to eight working electrodes in two or three electrode cell types and chips sharing a reference electrode and/or counter electrode. The MUX16 is suitable for sensor arrays or chips with sixteen working electrodes all sharing a RE and/or a CE. Both instruments are suitable for laminated layer corrosion analysis.The potentiostat is controlled and powered by USB and is used with PSTrace allowing for simultaneous sampling of each channel at a rate of 25 ms/channel. Standard packaging includes a shielded cable with connections for a working, a counter and a reference electrode by means of 2 mm banana connectors and mini-crocodile clips, a stripped end, Dsub-37 terminated flat cable and a USB cable. To make connections to chips simpler the Connection Terminal is an optional extra providing clearly marked screw terminals to the electrodes and can be directly joined to the ESMUX via their D-Sub connectors.
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Product
6U VME 1/10/40 GbE Switch
ComEth4070e
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The ComEth 4070e is a cutting-edge 6U Layer 2/3 Ethernet switch for VME64x systems. Powered by the newest Marvell highly integrated system-on-chip (SoC) with programmable packet processors.
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Product
Arduino CAN Shield
IFB-10003-INP
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CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt line to the MCP2515 and two LEDS are also provided. The chip select and interupt lines are selected via zero ohm resistors and have several configuration options for flexibility stacking additional shields. A set of stackable headers is included with this board, not installed. An optional on-board voltage regulator may be used to supply 7.5V to the Arduino's 'Vin' pin (which is regulated to 5V by the Arduino's on-board LDO). The CAN shield regulator supports a wide input range of 9V to 32V. This makes it possible to cleanly build a stand-alone CAN node (remote sensor) without the need for a separate Arduino power supply!
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Product
Semiconductors
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Multiphysics Analysis Solutions for Chips and 3D IC Systems. Ansys cloud-native solutions provide unparalleled capacity to speed up completion times for even the largest finFET integrated circuits (IC) and 3D/2.5D multi-die systems. These powerful multiphysics analysis and verification tools reduce power consumption, improve performance and reliability, and lower project risk with foundry-certified golden signoff verification.
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Product
FPGA Card
VP869
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The VP869 is a high-performance 6U OpenVPX FPGA processing board featuring two Xilinx® UltraScale+™ FPGAs and a Zynq® 7000 Series multiprocessor system-on-chip (MPSoC). It is designed for the most demanding mission critical military, defense, and industrial applications where extreme FPGA processing and I/O bandwidth capabilities are needed. Applications include electronic warfare, signal intelligence, radar/sonar, and high performance embedded computing.
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Product
TMR Current Sensors
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MultiDimension Technology Co.,Ltd.
An open-close current transducer, high sensitivity and signal-to-noise ratio TMR chips are used in the design, which based on Tunneling magneto resistance effect. The transducer has a built-in temperature compensation and nonlinear compensation circuit, which can accurately measure DC, AC and pulse current. The transducer has many benefits ,such as high precision, wide bandwidth, low power consumption, excellent isolation performance and so on. Besides, the design of open-close structure makes it easier to install and unload.
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Product
Phototransistors
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Phototransistors are photodiode-amplifier combinations integrated within a single silicon chip. The phototransistor can be viewed as a photodiode whose output current is fed into the base of a conventional transistor. These photodiode-amplifier combinations are put together to overcome the major limitation of photodiodes: unity gain. The typical gain of a phototransistor can range from 100 to over 1500.
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Product
Saluki SEL7 Series Programmable DC Electronic Load (up to 6kW)
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The new SEL7 series programmable DC electronic load is a new generation product designed by Saluki Technology. Incorporating high-performance chips, the SEL7 series delivers high speed and high accuracy with a resolution of 0.1mV and 0.01mA (basic accuracy is 0.03% and basic current rise speed is 2.5 A/μs).SEL7 series have wide application from production lines for cell phone chargers, cell phone batteries, electronic vehicle batteries, switching power supplies, linear power supplies, and LED drivers, to research institute, automotive electronic, aeronautic and astronautic, maritime, solar cell and fuel cell etc. test and measurement applications.
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Product
Software
DPM-3
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Was developed to read and edit Plug and Play Smart Sensors that are compliant to the IEEE 1451.4 Standard. TEDS, or transducer Electronic Data Sheet, is a set of electronic data in a standardized format defined within the IEEE 1451.4 standard. This data specifies what type of sensor is present, describes its interface, and gives technical information such as sensitivity, bridge type , excitation, etc. This information is stored in an EEPROM chip attached to the sensor. By having this chip, the sensor can identify and describe itself to the network and or Smart Load Cell Meter (DPM-3), thereby easing automatic system configuration.
