Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Extreme Rugged PC/104-Plus Single Board Computer with Intel® Atom™ Processor System-on-Chip
CM2-BT2
The CMx-BTx is a PC/104-based, Single Board Computer (SBC), fully compliant with the PCI-104 Specification, Version 1.1 and partially compliant with the PC/104 Specification, Version 2.6. PC/104 SBCs are very compact and highly integrated computers. This SBC features the 22nm, Intel® Bay Trail SoC. The board provides a DDR3L SO-DIMM socket, a PC/104 connector, a PCI-104 connector, two USB 2.0 ports, one USB 3.0 port, up to two Gigabit Ethernet ports, up to two SATA 3 Gb/s ports, one dedicated HD-Audio panel connector, one VGA port, one LVDS port, up to four COM ports, one mini-PCIe slot (with one USB 2.0 port included). The CMx-BTx can be run with only 5 volts and is capable of running operating systems like DOS, Windows XP/7/8 in either 32-bit or 64-bit configuration, Linux, VxWorks, and others. Another feature included on the board is a fail safe BIOS that enables the user to start the module even if the original BIOS is corrupted.
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Ultra-Low Power Computing Module
CM22303
LinkedHope Intelligent Technologies Co.,Ltd.
CM22303 uses Intel® 7th generation Kaby Lake-Y platform and Core M Ultra low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.6 GHz and the display output resolution can be up to 4K. CM22303 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. SPI BIOS is designed on board to support dual-channel low voltage on board memory (up to 16GB), Gigabit Ethernet, TPM module and other functions. With high-performance and low power consumption, it can be widely used in the field of low power embedded systems. Meanwhile, CM22303 adopts COM Express standard and is compatible with Type10 pin out definition, and also provides rich peripheral interfaces such as USB3.0/2.0, PCIe, SATA, HD Audio etc.
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Inspection Microscope
Z-NIR
The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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Emulation Platform
Veloce
The Veloce® Emulation Platform dramatically reduces risk in the verification of today’s complex SoCs and is a core technology in the Mentor Enterprise Verification Platform™ (EVP). Mentor’s software and application solutions and continual enhancements enable a comprehensive verification environment for IP, chip, and system level verification.
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Converter
Converter and driver chips ensures data rates above 1 MBaud and therefor reliable data transmission also with highest rates.
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Alchitry Au+ FPGA Development Board (Xilinx Artix 7)
The Alchitry Au+ is the "gold" standard for FPGA development boards and it's possibly one of the strongest boards of its type on the market. The Au+ substitutes a more robust & scalable FPGA chip (Xilinx XC7A100T) that allows for more complex application circuits. The number of Configurable logic blocks (LABs/CLBs), Logic Elements, and total RAM bits are all nearly 3x that of the standard Au; see "Features" for more details.
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BSDL File Validation
Corelis offers services to validate the accuracy of Boundary-Scan Description Language (BSDL) files that characterize the boundary-scan functionality of semiconductor devices. These services include validation of a device's BSDL file while the chip is still in development and BSDL file accuracy verification against actual silicon.
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Pyroelectric Detectors
Pyroelectric detectors are thermal detectors; i.e. they create an electric signal due to temperature changes in the chip. This temperature change is caused by absorption of light. We do use LiTaO3 and DLaTGS as pyroelectric materials. Basically such detectors cover the whole spectra. However, they are mainly used for mid-wave and long-wave infrared detection (MWIR and LWIR). In addition, the usage in the THz region seems to become more popular these days.
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Wideband Transceiver IC
Analog Devices wideband transceiver ICs offer a complete, high performance RF and mixed-signal system on a chip. ADI’s ISM transceivers for short range wireless systems and wideband transceivers for wireless applications such as UMTS, LTE, and 3G/4G are highly integrated and deliver best-in-class performance and significant BOM savings.
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Digital I/O Board
P104-DIO-96
Each I/O line of this card is buffered and capable of sourcing 32mA, or sinking 64mA. The board simulates Programmable Peripheral Interface chips (PPI) to provide a computer interface to digital I/O lines. Each PPI supports two 8-bit ports (A, B) and two 4-bit ports (Chi, Clow). Each port can be configured to function as either input or output latches. The I/O line buffers (types 74ABT240 and 74ABT245) are configured automatically by hardware logic for input or output according to the PPI Control Register direction software assignment.
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MEMS Tunable Filter
Optoplex’s MEMS Tunable Optical Filter is based on a patented micro-optic design with MEMS tuning technology. It is an integrated module consisting of a MEMS chip, micro-optics and control electronics and interface. When receiving a stream of optical signals of a plurality of wavelengths from the Input-Port (IN), the 2-port tunable optical filter directs a selected channel to the Output-Port (OUT). Wavelength (frequency) tuning is achieved by changing driving voltage applied to the MEMS chip, via the control electronics and the built-in firmware.
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Automotive Audio Bus (A2B®)
Analog Devices Automotive Audio Bus (A2B®) technology provides critical support to the vehicle infotainment systems of tomorrow. Our A2B products deliver high fidelity audio while increasing fuel efficiency, thanks to upward of 75% less cabling weight. The A2B portfolio helps enables multiple applications such as voice recognition and active noise cancellation. A2B is a single-master, multiple-slave system where the transceiver chip at the host controller is the master.
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Mezzanine System
5158
The 5158 Electrical Conversion Module (ECM) provides eight (8) RS-232 outputs and eight (8) RS-232 inputs. Built around Maxim 1488 & 1489 chips for true RS232 levels and voltage tolerance, all outputs come up in the 1, mark or idle state. Electrically this is a negative output voltage, the start bit is always a 0 or a positive voltage level.
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PXI-2536, 544-Crosspoint, 1-Wire PXI Matrix Switch Module
778572-36
544-Crosspoint, 1-Wire PXI Matrix Switch Module—The PXI‑2536 is a high-density 8x68 PXI matrix switch module that is ideal for routing low-power DC signals in validation test systems of mass produced devices such as semiconductor chips and printed circuit boards (PCBs). Featuring FET relays, the PXI‑2536 offers unlimited mechanical lifetime and switching speeds up to 50,000 crosspoints/s. It also features onboard relay counting for relay monitoring and deterministic operation with hardware triggers to improve test throughput.
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Ultra Low Power Radios
IoT
IEEE 802.11b/g/n-compliant Wi-Fi Radio (2.4 GHz)Ultra-low-power hostless Wi-Fi IoT Module features QCA4010 RadioSingle Stream System (1x1), 20 MHzIntegrated RF front end and PCB trace antennaHostless IoT application development platform with large internal memoryUART AT command set for optional external MCU hostAllJoyn supportWi-Fi Protected Setup SupportIPv4 / iPv6, TCP and UDP Protocol Supported on Chip, Offloading the Host ControllerIdeal for cost effective Internet of Things (IoT) Applications
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Dual H.264 HD Encoder For PCIe
DTA-2182
Dual-channel version of the DTA-2180: Two H.264 HD encoders on a single compact PCIe card. Robust video encoding based on the field-proven Magnum encoder chip. No CPU cycles are spent for encoding.
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SMT Rework Station
RW1210
Safely and precisely rework SMD, BGA, or LED chips. This all-in-one solution covers rework needs for even the most complex, densely populated PCBAs. Yet it is easy to use, enabling technicians to quickly master delicate alignment, placement, and heating controls.
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Semiconductor Test Equipment
Wewon Environmental Chambers Co, Ltd.
Probe card manufacturing need the semiconductor test equipment. When we designed the thermal testing equipment, Only some commonly used test items are packaged into the IC tester, and the logic function of the verification chip is implemented in a fixed test mode. But as chip products diversify, Some thermal inducing system can no longer do it alonehttps://www.wewontech.com/semiconductor-test-equipment/
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Reliability Testing
ELES Semiconductor Equipment SpA
ELES designs and manufacturers reliability test solutions to verify the performance of integrated circuits from concept validation to high volume production during all the test phases. No other company can provide universal equipment for all the reliability tests, or can guarantee a seamless data flow between phases or can apply on chip embedded reliability engineering for data tracking and failure investigation. Clients use our functional test data to proactively analyse variations between lots, between temperature extremes and during lifetime (often these defects escape ATE). The improvements to products and processes needed to arrive at zero defects cannot be driven by the quantity of Big Data alone, the quality of reliability data is a strategic advantage that only ELES can provide.
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Chip Inspection System
GEN3000T
GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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Diode Arrays
a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100 % Tin terminations. All Bourns® diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.
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Channel Analyzer
WifiMETRIX
WifiMETRIX is a new diagnostic tool used to analyze and test Wi-Fi networks. It is a handheld device that operates in stand-alone mode -- that is, it does not associate or connect with an AP. WifiMETRIX implements two important features -- AirHORN and WifiPROBE. The built-in Wi-Fi chip can perform both signal generation / packet injection (AirHORN) and throughput diagnostics (WifiPROBE) on each channel.
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Universal Programmer Superpro 6100N
Until now,Support 401 IC manufacturer, 103004 pcs devices and keeps growing.Features:Supports 87454 types of devices from 305 IC manufacturers (by 3/15/2013) and keeps growing.Supports EPROM、Paged EPROM、Parallel and Serial EEPROM、FPGA、PROM、FLASH(NOR & NAND)、BPROM、NVRAM、SPLD、CPLD、EPLD、Firmware HUB、Microcontroller、MCU；Supports devices with Vcc as low as 1.2V. Socket Adaptors available for DIP、SDIP、PLCC、JLCC、PGA、LGA、SOIC、SOJ、SOT、QFP、TQFP、PQFP、VQFP、MQFP、LQFP、TSOP、SOP、TSOPII、PSOP、SSOP、TSSOP、SON、EBGA、FBGA、FTBGA、VFBGA、μBGA、CSP、SCSP、QFN、HVQFN etc.High programming speed.Built with 144 universal pin-drivers. Universal adaptors are available for varies packages up to 144 pins. Quick new device support. Popular NAND FLASH Platform supported including Samsung (XSR1.0/1.6), QualComm, HYNIX（HIFFS）, MTK(Solution V1.1), ICERA (v1.0/2.0), ST （7162、7141等）, AMLOGIC(IF2/0), REALTEK, PICOCHIP, DataLight ( Flash FX Pro), Marvell(310/303/920/935…), BroadCom, ZTE, Intel (CE4100)，UBI, LEADCORE(L1809OG), MSATR etc. Customer-specific NAND solution available.PC hosted mode and stand-alone dual modes. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via a 6-KEY keypad and a 20 character by 4 line LCD display. A CF card is used to store the project files.User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode. IC manufacturer approved programming algorithms are used for high reliability.Testing functions for logic devices.Advanced and powerful software functions.Production mode starts chip operation at the moment the chip is inserted in the socket properly.Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.Password can be set for project files and production volume controlBatch command combines device operations like program, verify, security into a single command at any sequence.Dynamic buffer makes it possible that each chip is programmed with different data file. Applications including serial number, MAC address etc.Log file is useful for quality tracking.Many safety mechanisms are built including self-diagnosis, wrong chip placement detection, poor-pin-contacting detection, ID checking, over-current and over-voltage protection etc.Windows XP/Vista/Win7/ Win8/Win10 compatibility.
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Digital Oscilloscope
MSO/DS7000
The MSO/DS7000 series digital oscilloscope is a mid-end mixed-signal digital oscilloscope based on RIGOL's proprietary intellectual property ASIC chip and UltraVision II technology platform.
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Rectifier Diodes
Chip Diodes from Bourns has emerged that offers the capability to provide a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100% Tin terminations. All Bourns® diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.
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High Speed Ethernet DAQ
Ultraview's ethernet based acquisition boards bring low noise, large channel count solutions to common open-source platforms. The flexibility of being able to combine a large number of publicly available firmware/software modules with laboratory quality data acquisition chips makes many previously difficult project integrations possible at a fraction of the cost of developing the entire system.
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RF & Wireless Test Solutions
Adivic/Chroma Group has been in the development of RF & WIreless test solutions for more than a decade. Take RF Recorder as an example, it has been adapted by all major Japanese & Korean automotive brand names such as Toyota, Mitsubishi, Honda, Hyundai, Daewoo...etc., most of the global IC design houses with DTV chips such as Broadcom, Marvell, MTK...etc., and also defense entities around the world.
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Mems-Based Probe Cards
MEMSFlex
Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
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Fibre Channel Modules
AIM’s Fibre Channel test, simulation and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with one dual core RISC processor per port, massive and scalable DDR3 memory and IRIG-B time encoder/decoder functions are standard. The new ultra high performance intelligent 4-lane PCIe 2.0 interface modules offer 2 ports with full function test, simulation, monitoring and analyzer functions for Fibre Channel networks. The dual core processor provides onboard processing and data transfer capabilities for the most demanding Fibre Channel applications including upper layer protocol support done on board level. Large and high data throughput DDR3 RAM is accessible for the onboard processor as is a high performance FPGA implementing the customized Fibre Channel interfaces enabling the board to analyze incoming and modify outgoing data in real time. Each module provides 2 Fibre Channel compliant full duplex ports, implementing the full link level services. SFP cages make it suitable for different media types as optical or electrical network technologies. Ports operate either in Traffic Simulator or Analyzer/Monitor mode with support for port related Frame Statistics. Sophisticated packet capturing mechanism and monitoring features are complimented with powerful triggering and filtering capabilities.
