Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Anti-Sulfurated High Power Wide Terminal Chip Resistors
Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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OpenVPX SBC
SBC347D 3U
The VPXcel3 SBC347D rugged single board computer is based on the highly integrated Intel® Xeon® D processor platform. The multiple core Xeon D brings the high performance of Intel Xeon processors into a dense, low power system-on-chip solution, ideal for High Performance Embedded Computing (HPEC) applications.
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3D-IC Solution
Consumer demand for increased bandwidth and low power in smaller form factor has forced design teams to pursue design and manufacturing alternatives to single system-on-chip (SoC) approaches. Moving to advanced geometries like 20nm/14nm is a natural progression; however, it has its own cost, yield, manufacturing, and IP reuse challenges.
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High Voltage Thick Film Chip Resistors
HVTK (HVR)
*Highly reliable multilayer electrode construction*Higher component and equipment reliability*Excellent performance at high voltage*Reduced size of final equipment
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PXI-2535, 544-Crosspoint, 1-Wire PXI Matrix Switch Module
778572-35
544-Crosspoint, 1-Wire PXI Matrix Switch Module—The PXI‑2535 is a high-density 4x136 PXI matrix switch module that is ideal for routing low-power DC signals in validation test systems of mass produced devices such as semiconductor chips and printed circuit boards (PCBs). Featuring field-effect transistor (FET) relays, the PXI‑2535 offers unlimited mechanical lifetime and switching speeds up to 50,000 crosspoints/s. It also features onboard relay counting for relay monitoring and deterministic operation with hardware triggers to improve test throughput.
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Chip Resistor Networks
Panasonic Industrial Devices Sales Company of America
Chip Resistor Networks by Panasonic
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Isolated Input Card
mPCIe-II-16
The mPCIe-II-16 consists of a type F1 PCI Express Mini Card (mPCIe) interface board that connects to a Mobile-ITX-sized, DB-37M Isolation Module via an included 9” cable. That module is designed to be easily panel-mounted in any application environment. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program.
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Universal Programmers
Xeltek engineers work around the clock to maintain the largest device library in the industry, so new devices are being added on a daily basis for EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, and MCUs. The majority of SuperPro universal programmers come equipped with a ZIF socket supporting up to 144 pins for programming a wide range of DIP devices; other chip package supported includes SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, and SCSP.
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AMC GBit link card/VITA 57 FMC carrier
SIS8100
The SIS8100 will be a single width mid height AdancedMC card. It will interface with a single PCI Express lane over a PLX Technology PEX811 PCI Express to local bus bridge chip and have an on board Virtex IV FPGA. The default stuffing option has a Small Form Factor (SFF) optical link medium that can be operated at 1, 2.5 and 4 GBit/s.
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128 Channel Multihit TDC
VX1190A-2eSST
The VX1190A-2eSST is a 128 channel Multihit TDC, housed in a 1-unit wide VME64X 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB can be set at 100 ps (19 bit resolution, 52 µs FSR), 200 ps (19 bit, 104 µs FSR) or 800 ps (17 bit, 104 µs FSR).
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Clock Generation Devices
Analog Devices offers ultralow jitter clock generation products for wireless infrastructure, instrumentation, broadband, automatic test equipment, and other applications demanding subpicosecond performance. Our clock products are ideal for generating the high speed, low noise clock signals required to clock high performance analog-to-digital converters (ADCs) and digital-to-analog converters (DACs). ADI clock ICs integrate PLL cores, dividers, phase offset, skew adjust, and clock drivers in small chip scale packages.
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RF/Microwave Assembly Capability
Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
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Low Light USB Camera Board (Color)
See3CAM_CU30 - 3.4 MP
See3CAM_CU30 is a 3.4 MP UVC-compliant Low Light USB camera board based on AR0330 sensor from ON Semiconductor®. This Low Light Board Camera is backward compatible with USB 2.0 and supports compressed MJPEG formats at frame rates equal to USB 3.0. This sensor enables a superior low light performance. It has a dedicated, high-performance Image Signal Processor chip (ISP) that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the MJPEG compressions.
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Ultra-compact Photoelectric Sensor
EX-20 Ver.2
Panasonic Industrial Devices Sales Company of America
Using a single chip optical IC, Panasonic created the powerful EX-20 Ultra-Compact Photoelectric Sensors, which are among the smallest Photoelectric Sensors worldwide and in spite of their miniature size, the Sensors incorporate a sensitivity adjuster. Since a red LED dot light source is used, alignment and confirmation of the sensing position is easy, even if very tiny objects have to be detected.
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Imaging
SLA64 (Preliminary)
A 1 x 64 element silicon-based thermopile array. Each active area is 0.45mm x 2.0mm with a time constant of 42ms and a low Temperature Coefficient of Responsivity of -0.06%/C. It is packaged in a 68-pin QIP. Includes internal 30k 5% NTC chip thermistor provides ambient package temperature measurement. See Thermistor Options p/n: MT04.
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RF/Microwave Assembly Capability
Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
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Inductor Products
Macom Technology Solutions Holdings Inc.
They provide uniformity, durability and repeatability in circuit fabrication. The coils are polyimide coated to protect from ambient contaminants, and to eliminate the need for conformal coating. Quartz substrates are rugged and reduce dielectric losses. Chips may be bonded using either conductive or non conductive epoxies, and wire bonded with gold wire or ribbon by thermocompression bonding.
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6in1 Sensor (6DoF Automotive Inertial Sensor)
Panasonic Industrial Devices Sales Company of America
Panasonic’s 6in1 Sensor For Highly Accurate, Flexible And Sensitive Automotive And Industrial Applications Panasonic’s 6in1 (6DoF) Inertial Sensor is designed for highly accurate motion detection for automotive, industrial and commercial sensing applications. It provides highly sensitive and accurate linear acceleration (3-Accelerometers) and angular position detection (3-Gyroscopes) all in one (1) single MEMS chip (4.5mm x 4.5mm x 1.1mm)! This enables the 6in1 Intertial Sensor to be compact, highly accurate, easy-to-install and highly reliable.
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Clock Distribution Devices
Analog Devices offers ultralow jitter clock distribution products that fan out given signals for wireless infrastructure, instrumentation, broadband, ATE, and other applications demanding subpicosecond performance. Our clock products are ideal for clocking high performance analog-to-digital converters (ADCs) and digital-to-analog converters (DACs). ADI clock ICs integrate PLL cores, dividers, phase offset, skew adjust, and clock drivers in small chip scale packages.
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Patented DPEM Process for Die Removal
DPEM (Decapsulate Plastic Encapsulated Module) is DPACI’s patented Turn-Key Solution to replacement of obsolete high reliability devices in legacy systems. From dissolving the plastic encapsulation of a semiconductor device to re-bonding new wires onto a chip or package lead frame, complete solutions are offered. DPACI retains reliability test data as well as customer testimonials for the process and can share this information on a need-to-know basis.
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Semiconductor Thermal Transient Tester
T3Ster®
T3Ster (pronounced "Trister") is an advanced thermal tester from Mentor Graphics MicReD Products for thermal characterization of semiconductor chip packages. Superior to all other thermal characterization equipment on the market due to its speed and ease of use; its extremely accurate temperature measurements (0.01oC); and its 1 micro-second measurement resolution in time.
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Inductor Tester
An impulse can be applied to the coil of a chip power inductor to perform insulation tests (surge tests) within the windings.
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Solid State Power Amplifiers
Skylink SSPAs incorporate state-of-art DPD and well-done Heat Dissipation technologies with available LDMOS, GaN & GaAs Chips. Solutions of SSPA frequency range from 9kHz to 50GHz and output power up to kilowatts and includes basic PA modules to integrated chassis with embedded software for local and remote control and monitoring.
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SparkFun Dev Board
ESP8266 Thing
This is the SparkFun ESP8266 Thing Dev Board – a development board that has been solely designed around the ESP8266, with an integrated FTDI USB-to-Serial chip. The ESP8266 is a cost-effective, and very capable WiFi-enabled microcontroller. Like any microcontroller, it can be programmed to blink LEDs, trigger relays, monitor sensors, or automate coffee makers, and with an integrated WiFi controller, the ESP8266 is a one-stop shop for almost any Internet-connected project. To top it all off, the ESP8266 is incredibly easy-to-use: firmware can be developed in Arduino, and uploaded over a simple, serial interface. The ESP8266 Thing Development Board breaks out all of the module’s pins, and the USB-to-serial converter means you don’t need any peripheral components to program the chip. Just plug in a USB cable, download the Arduino board definitions, and start IoT-ing.
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2000-6000W AC power source
CX-P2KW
Shenzhen Chuangxin Instruments Co., Ltd.
The AC power source is made by adopting microcomputer processing chip and high power device. It provides a stable pure sine wave and has voltage, over current, over temperature, overload protection. It can output 0-300V adjustable voltage, and 45-70Hz adjustable frequency as well as fixed frequency as 50 Hz or 60 Hz, 100 Hz and 200 Hz and 400 Hz. This AC power source can simulate power grid of different countries, provide a stable voltage, frequency, waveform which can be used to test and age the exprot products and provide kinds of precision tests for laboratory, measuring room, etc.
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Cloud And Networking
From laser chips (EMLs, DMLs, and VCSELs) and pluggable coherent transceivers to pump lasers and TrueFlex® colorless/directionless/contentionless ROADMs, Lumentum’s comprehensive, vertically integrated portfolio lowers costs and speeds time-to-market. We optimize our components for best-in-class performance, creating flexible and scalable platforms that address ever-changing market conditions and product migrations. To ensure field reliability, Lumentum uses only the best materials and processes including stringent, proprietary burn-in processes during laser manufacturing.
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5MP MIPI Camera Module
E-CAM55_CUMI0521_MOD
e-CAM55_CUMI0521_MOD is a small form factor, 5 MP fixed focus camera module based on AR0521 CMOS image sensor from ON Semiconductor® has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images and video. This low light camera module can stream uncompressed VGA (640 x 480) at 75 fps, HD (1280 x 720) at 100 fps, 1280 x 960 at 75 fps, FHD (1920 x 1080) at 65 fps, 2560 x 1440 at 38fps, 2592 x 1944 at 28 fps.
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Isolated Digital I/O Card
mPCIe-IDIO-8
The mPCIe-IDIO-8 consists of a type F1 PCI Express Mini Card (mPCIe) interface board that connects to a Mobile-ITX-sized, DB-37M Isolation Module via an included 9” cable. That module is designed to be easily panel-mounted in any application environment. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program.
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Reflection Meter
RC-088
This instrument is a special equipment for measuring the reflectivity of rearview mirror (or similar product) of motor vehicle. The product composes intelligent measuring instruments, optical integrating sphere, parallel lamp, standard light source, constant current source etc. It is easy to operate，it can measure the reflectivity quickly and accurately. On instrument structure, it adopts standardized modulation design. It takes latest single chip as its digital central processing element. After the measuring signal is converted by modulus, CPU will do some computation and compensation. The instrument can display the reflectivity of device which is measured in rear time. It operates simply and quickly, the indication is direct and accurate. It’s good for quality examination &control in the production scene as well as laboratories. This product has the convenience &quick demarcation way, can meet requirement of different occasion. It is applicable for measuring light reflection on mirror and not mirror parts.
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Thermal Test Vehicles
TTV
Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
