3D
three dimensions.
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Product
Hardware
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Verisurf hardware is configured with the right functionality for your application and budget. We invite you to review our products and contact us to see a Verisurf 3D measurement system first hand or to help configure and quote the right system for your application and budget.Let Verisurf Software, Inc. be your measurement consultant ready to provide full implementation support of your chosen hardware-Verisurf software combo!
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Product
Microelectronics And Packaging AOI
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Machine Vision Products, Inc. has extensive experience in a wide range of Microelectronics and Packaging applications. MVP works with the world’s leading manufacturers on a global basis. From multiple die and wire technologies to leadframe, ball grid array and surface inspection applications, MVP has the widest applications toolbox of any AOI provider. MVP takes pride in the fact that they supply many complex inspection solutions to diverse industries such as Automotive, Telecoms, Medical Devices, Military, and Space. MVP’s 900 Series is the base platform upon which all Microelectronics and Packaging inspection solutions are based. The 900 series 2D capabilities provide metrology and defect detection using a propriety Quad-Color lighting, Telecentric optics and resolutions down to 1um. 3D height measurement capabilities allow for in-line high speed inspection of Dies, paste deposition, positional accuracy, volume and height with a resolution down to 1.13um.
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Product
SUNTEST Family
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Atlas Material Testing Solutions
SUNTEST instruments are compact material test chambers for accelerated lightfastness and weathering testing based on filtered xenon lamp technology. All SUNTEST chambers offer a horizontal test plane which is particularly useful for testing 3-D specimens. Lightfastness testing aims at testing a material under solar radiation and temperature only – Weathering testing adds water and moisture to the test.
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Product
ATX Motherboard With LGA1151 Socket 9th/8th Gen Intel® Core™ Processor, Intel® Q370, USB 3.1 Gen2, SATA 3.0, Dual LAN, VGA, DisplayPort++, DVI-D, And HDMI
IMB520R
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The IMB520R is powered by the LGA1151 socket 9th and 8th generation Intel® Core™ i7/i5/i3 (code name: Coffee Lake Refresh), Intel® Pentium® or Intel® Celeron® processor with the Intel® Q370 chipset. The industrial motherboard is designed with rich functionality and offer high processing powers, multiple expansion interfaces, security feature, and stunning graphical performance to deliver true customer value and quick deployment in a broad range of high-performance applications such as industrial automation, gaming, AI-related server, self-service kiosks, medical, and digital signage. It features one PCIe x16 slot, four PCIe x4 slots, one PCIe x1 slot and one PCI slot for future expansions such as motion control cards, frame grabber cards or data acquisition cards. It also has two USB 3.1 Gen2 and four USB 3.1 Gen1 ports for faster data transfer. In addition, the industrial-grade ATX motherboard is integrated with the Intel® HD Graphics to deliver stunning 4K resolution, as well as fast 3D and video playback for graphics-intensive applications. It supports three independent displays with DisplayPort++, DVI-D, HDMI, and VGA.
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Product
Laser Scanning Microscope
OLS4100
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The LEXT OLS4100 is a Laser Scanning Microscope to perform non-contact 3D observations and measurements of surface features at 10 nanometer resolutions. It also features a fast image acquisition and a high-resolution image over a wider area.
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Product
High Current Comparators And Power Supplies
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Designed in 3D, this custom unit fills the gap between the comparator manufacturers and the production floor. Vidac Solutions does not manufacture CT Comparators, but this unit (and others like it) are used to provide the complex high-current switching, buss-work, source current supply into an enclosure that fits into the production line and provides a safe, ergonomic and easy to use machine for the operators.
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Product
Hybrid And Fusion Bonding Systems
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Hybrid bonding extends fusion bonding with embedded metal pads in the bond interface, allowing face-to-face connection of wafers. The main application for hybrid bonding is advanced 3D device stacking.
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Product
Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
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The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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Product
USB 3.0 Stereo Vision Camera
Tara
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Tara is a UVC- compliant 3D Stereo camera based on MT9V024 stereo sensor from ON Semiconductor which supports WVGA((2*752)x480) at 60fps over USB 3.0 in uncompressed format. This Stereo camera provides two synchronized sensor frame data interleaved side by side to the host machine over USB 3.0 interface.
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Product
Full 3D Inline Metrological & Imaging AOI
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Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
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Product
MPO/MTP Multi-Fiber Interferometer
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Anfkom International Co.,Limited
It is an automatic and non contact fiber endface interferometer for both multi fiber and single fiber connectors. It can measure the geometry parameters of multi fiber connector such as fiber height,core dip, X and Y angel, radius of curvature with white light and measure geometry parameters of single fiber connector with red light. The software can display the surface of the connector in 3D image for a very short time, it need only 8s to test 12-core MT connector. It is intelligent , efficient,stable and accurate and very helpful in improving the quality of the product.
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Product
Solder Paste Inspection System
KY8030-3
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The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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Product
Global Standard Model For 4 Point Probe Sheet Resistance Automatic Measurement System
RT-3000/RG-1000F
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*Fully automatic system for large sizes of flat panel with glass loading robot*Tester self-test function, Measurement position correction function, wide measurement range*Min. 0.1 mm meas. resolution and user programmable test pattern*Host (CIM) communication and 2-D/3-D Mapping software
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Product
SHORT-RANGE RADAR
GIRAFFE 1X
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GIRAFFE 1X is a small and lightweight yet highperforming 3D radar that is easily integrated in almost any type of mobile platform, fixed structure or C2 system. The system is designed to deliver key capabilities as part of short-range surveillance and Ground Based Air Defence (GBAD).
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Product
BlueViewer Software
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Quickly view .xyz 3D point clouds filesTake accurate point-to-point measurementsSupports a variety of color maps including jet, gradient, and intensityOverlay multiple point clouds
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Product
Articulating Measuring Arms
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Aberlink 3D measurement software can be retrofitted to a huge range of portable measuring arms, including Faro, Romer, Cimcore and others.
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Product
Medium-size Compact Antenna Test Range
H-Series CATR
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The H-Series CATR chamber provide complete 3D performance assessment for 5G OTA devices and antennas including gain, efficiency, directivity, polarization and beam characteristics for frequencies from 3 up to 110 GHz, capable of supporting forthcoming 5G Sub-6 GHz (from 3 to 6 GHz) and mmWave (24 to 110 GHz) standardized testing including TRP/TIS, EIRP, EIS, IBB and emissions in accordance to 3GPP TR38.810 and TR37.842.
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Product
Post Wire and Die Bond Inspection Machine
IV-E1700
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IV-E1700 is a post wire and die bond inspection machine that is known for having a proven, effective and patented 2D+3D Inspection system. This product is best used to weed out defects with data collection for process improvement and reports for SPC quality Control.
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Product
Simple 3D Measurement & Inspection
XG-X Series Vision System
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Abundant processing power is available even with multiple camera connections, including the 21 megapixel color camera, line scan cameras, or 3D cameras. XG-X Series offers high-speed, high-resolution cameras for high-accuracy inspection, providing powerful solutions for a variety of problems that arise in manufacturing.
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Product
PDS Multibeam Survey and Processing/Charting
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Teledyne PDS for Multibeam Surveys provides the functionality for survey planning, data acquisition, data processing, editing, volume calculations and chart production. This turnkey solution offers the surveyor and helmsman a strong tool to carry out the multibeam survey efficiently. Progress is shown real time in top, profile, and 3D views using a color-coded digital terrain model (DTM). Various filter settings can be applied to the multibeam data online, thus providing real-time data processing. Quality control displays reassure the operators that the data is of the desired quality.
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Product
Video Signal Generator
MSHG-600 Plus
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MSHG-600Plus supports a exclusive HDMI 1.4a Signal and output signal to five(5) channels. It is also built-in CEC function according to current market request. *3D video Format Support *It can be On/Off Audio Return Channel with ARC switch separately.
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Product
Digital Automated Fiber & Ferrule Interferometer For Single Fiber Connectors
DAFFI SF
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The latest interferometer from Data-Pixel is a cost effective solution for high volumes production, without compromising on accuracy or performance. Based on our extensive interferometer manufacturing experience we designed the DAFFI SF to be robust, fast and accurate in order to meet all manufacturing or laboratory environments. With the Blink software platform, DAFFI is able to measure the end face geometry on single fiber connectors in a very short time. The Daffi interferometer accessories (flange and adapters) are fully compatible with the Daisi range, allowing the user to limit the costs of the 3D geometry measurement units.
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Product
Color - Capture, Build & Testing App
Pantone Studio
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Explore a universe of color Subscribe and enjoy thousands of colors across 15 guides. Discover color harmonies, values, and cross references Including RGB, CMYK, HEX and Extended Gamut references. Extract Pantone Colors from your phone’s camera and images Turn your inspiration into workable palettes anytime, anywhere. Mix and Test palettes in your color studio Visualize colors on graphics, interiors and 3D materials before you design.
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Product
Intelligent Checked Baggage Security
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We offer advanced technology for checked baggage screening in our portfolio of explosives detection systems. We provide high resolution, 3D images of passenger bags and parcels to rapidly identify prohibited and dangerous items in real time.
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Product
Revopoint MetroX: Blue Laser Line and Full-field Structured Light 3D Scanner
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4 Flexible Scanning Modesꔷ Metrology-grade Accuracy: Up to 0.03 mmꔷ Volumetric Accuracy: Up to 0.03 mm + 0.1 mm × L(m)ꔷ Up to 7,000,000 Points/s in Full-field Structured Light Modeꔷ Up to 800,000 Points/s in Multi-line Laser Mode
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Product
Enhanced Vision Systems
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Elbit Systems of America’s Degraded Visual Environment (DVE) solution uses intuitive 3D grid symbology along with a helmet tracker to provide critical helicopter/tilt-rotor cues during brownout operations. This system, which is an upgrade to the head-up display installed on many military helicopters, removes weight or drag penalties by eliminating nose-mounted sensors. The helmet tracker provides numerous ancillary benefits such as depicting the other pilot’s Line of Sight (LOS) for improved crew coordination, as well as providing the ability to slew weapons or optical payloads to the pilot’s LOS, hands-free and heads-up.
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Product
EM Solver System Level Solver
EMA3D
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Electro Magnetic Applications, Inc.
MA3D is a powerful 3D numerical solution of Maxwell’s curl equations based on the time-domain finite-difference method in rectangular coordinates. The code has application to nearly any EM coupling, radiating, or interaction problem. EMA3D’s FDTD approach is the only EM tool capable of capturing the detail of entire aerospace or ground systems down to individual electronics interfaces in a computationally accessible manner. Computational advances and parallelization allow for fidelity once only dreamed possible.
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Product
PDS Bar Sweep Survey Software
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Teledyne PDS Bar Sweep supports different ways to monitor your leveling operation. Teledyne RESON provides the software as well as the sensors to accompany the system.Teledyne PDS visualizes the bar in top, profile, and 3D views indicating where the leveling has taken place. The position and depth of the bar is logged to a digital terrain model (DTM) which is color-coded for depth. It is possible to display a design depth in the profile views, indicating whether the bar has to be lowered or hoisted.
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Product
Optical 3D Measuring Systems & Devices For Your Quality Assurance
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As a manufacturer of optical industrial metrology, we offer a broad portfolio of optical 3D measuring systems & devices to support companies in various industries with precise quality assurance in production. Based on Focus Variation technology, our measuring systems not only enable surface roughness measurement, but also the detection of micro-geometries, shapes and structures.
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Product
Easy3DObject
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Detection of 3D objects in point clouds or ZMapsMetric detection criteriaCompatible with arbitrary regionsComputation of precise 3D measurements, like size, orientation, area, volume…Automatic extraction of object local support plane2D and 3D graphical display of the resultsFull-featured interactive demo application
