3D
three dimensions.
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Product
Coaxlink Quad 3D-LLE
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Laser line extraction with zero host CPU usageSingle and Dual Laser Line Extraction into a depth mapReal-time generation of 16-bit 3D height mapsChoice of algorithms: Maximum, Peak, Center of Gravity (COG)Precision: up to 1/256 pixel (with Peak and COG algorithms)Performance: 19,000 profiles/s from 1024 x 128 images. 38,000 profiles/s from 1024 x 64 imagesMemento Event Logging Tool
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Product
Reverse Engineering Services
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Whether for global manufacturers or small custom shops, API’s measurement expertise, combined with advanced metrology equipment, can execute convenient and fast reverse engineering projects. Our Laser scanning services can create data from an existing part or compare captured data to a CAD model. Reverse engineering services include scan as-built parts to creation of a 3D digital point cloud and CAD Model.
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Product
SEE Web Catalogue
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SEE Web Catalogue is an essential addition for SEE Electrical, SEE Electrical Expert and 3D Panel designers, enabling professionals to work efficiently and accurately with the latest manufacturers data.
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Product
Scanning & Inspection
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API’s offers a range of portable measuring and laser scanning solutions together with robot or tripod mounted 3D structured light scanner.
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Product
Solder Paste Inspection System
KY8030-3
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The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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Product
Structured Light
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Structured light systems from ams enable 3D imaging applications to achieve extremely high accuracy. Accurate structured light technology is behind the user face recognition being implemented in smartphones. Structured light products and design expertise from ams help customers get to market quickly and scale up production rapidly.
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Product
Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Product
Time-of-Flight Camera
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The Basler Time-of-Flight (ToF) Camera provides high resolution 3D images at a very attractive price/performance ratio. It delivers 20 frames per second with VGA resolution and has a working range of 0 to 13 meters.
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Product
Digital Automated Fiber & Ferrule Interferometer For Single Fiber Connectors
DAFFI SF
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The latest interferometer from Data-Pixel is a cost effective solution for high volumes production, without compromising on accuracy or performance. Based on our extensive interferometer manufacturing experience we designed the DAFFI SF to be robust, fast and accurate in order to meet all manufacturing or laboratory environments. With the Blink software platform, DAFFI is able to measure the end face geometry on single fiber connectors in a very short time. The Daffi interferometer accessories (flange and adapters) are fully compatible with the Daisi range, allowing the user to limit the costs of the 3D geometry measurement units.
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Product
Full Bundle
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Cost effective bundle of eVision 2D librariesIncludes EasyImage, EasyGauge, EasyFind, EasyMatch, EasyObject, EasyColor, EasyOCR, EasyOCR2, EasyBarCode, EasyMatrixCode and EasyQRCodeDoes not include 3D and Deep Learning libraries
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Product
Sensors
3D Fiber Probe
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Ultra high precision 3D measurements2D image processing combined with a laser distance sensorSelf illumination modeLowest contact force of 1 µNProbe sphere diameters from 0.040 mm to 0.250 mmControl and evaluation software for fully automatic measurements
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Product
Inline 3D-CT Automated X-ray Inspection Systems (3D-AXI)
3Xi Series
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Saki's 3D-AXI (X-Ray) series adds significant inspection capability. The system utilizes Planar Computed Tomography (PCT) providing high precision CT imaging at high speed.
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Product
Intel® Atom™ Processor E3845 Fanless Expandable Embedded Computer with PCI/PCIe Slots
MXC-2300
Industrial Computer
Featuring the latest Intel® Atom™ E3845 processor, the Matrix MXC-2300 series excels with minimal power consumption, exceptional 3D graphics, and powerful media acceleration, delivering a leading improvement in performance and cost-efficiency over any previous generation Atom-based system.
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Product
Solution Services
GeoIntrepid
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To maximise the business benefits from your software purchase, we specialise in providing power-user solutions, including: geophysical data processing, interpretation, quality control and 3D geological and geophysical modelling.Our team of geologists and geophysicists has extensive experience and expertise with a wide range of geological and geophysical data.
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Product
MEMS Spring Probe
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MEMS Spring Probe is developed by NIDEC-READ original ultra-fine 3D processing technology and enables our customer to supply advanced and innovative test solutions at PCB & semiconductor testing market.
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Product
Hybrid And Fusion Bonding Systems
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Hybrid bonding extends fusion bonding with embedded metal pads in the bond interface, allowing face-to-face connection of wafers. The main application for hybrid bonding is advanced 3D device stacking.
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Product
3D Metrological Software
InnovMetric PolyWorks
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Powerful metrological software which can effectively process vast amounts of data from 3D scanners in real time. Due to its modular architecture the software covers a large number of applications: one-point inspection by touch measurement systems, scanned data processing and data comparison to CAD models or complete reverse engineering – CAD model creation.
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Product
Large Surface Defect Gauge
4D InSpec® XL Surface Defect Gauge
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The 4D InSpec XL Surface Defect Gauge expands 4D Technology’s 4D InSpec product line—they’re the first handheld, precision instruments for 3D non-contact surface defect measurement.
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Product
RZ/G1 32-bit MPUs
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The RZ/G1 high-performance 32-bit processors have 1GHz+ Arm® Cortex®-A cores, a 3D graphics engine, a full high-definition (HD) video engine, secure IP, high-speed interfaces such as PCIe, SATA and Gigabit Ethernet, and other functions necessary for embedded devices in the industrial segment.
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Product
Magnet Testing
magtrack
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The magtrack makes it possible to detect the absolute 3D position in space as well as the orientation of a magnetically marked particle over a course of time. The magtrack system is modular and can therefore be adapted to any installation and system.
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Product
Surface Profilers
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Taylor Hobson offers a world leading range surface form, surface finish and metrology solutions for 3D contour,ideal for the most demanding applications.
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Product
PANELMAP
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PANELMAP is a software package used to collect, edit, analyze and visualize measured physical parameters on rectangular semiconductor panels. PANELMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.
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Product
Universal 3D Metrology Software Platform
PolyWorks
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Defining the cutting edge of 3D metrology, the PolyWorks software suite maximizes productivity, quality, and profitability when integrating 3D measurement technologies into an industrial manufacturing process. From part and tool design and prototyping down to final inspection of assembled products, PolyWorks offers advanced solutions to cover the complete product development cycle. Interfacing directly with major brands and technologies of single-point and point cloud 3D measurement devices through plug-in extension modules, this universal platform also supports a wide array of native point cloud and polygonal model file formats.
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Product
SUNTEST
XXL+
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Atlas Material Testing Solutions
The Atlas SUNTEST XXL+ is a large xenon lamp weathering and lightfastness test chamber meeting various ISO, ASTM, and ICH industry standards. Its horizontal 3000 cm2 exposure area is best-in-class for 3-D specimen testing.
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Product
Dissolved Ammonia Delivery System
DI-NH3
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MKS' DI-NH3 is a compact, stand-alone system providing dissolved ammonia water. With Semiconductor 3D IC architectures using new materials like Cu-Co and Si-SiGe, the ability to wet clean with precise alkaline chemistries is growing in frequency and importance. The DI-NH3 delivers dissolved ammonia, providing optimal cleaning capability in an alkaline chemistry, minimizing material loss and contamination and inhibiting Electrostatic Discharge (ESD). Using closed-loop control, conductivity and pressure are kept stable under changing flow conditions. The dissolved ammonia concentration is monitored and adjusted, delivering the specific NH4OH concentration needed. Dissolved ammonia’s alkaline chemistry provides ESD protection during rinsing, particle lift-off, and residual photoresist removal in middle-of-line (MOL) and prevents corrosion of cobalt/copper interfaces.
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Product
SparkFun GPS-RTK Dead Reckoning Breakout
ZED-F9R (Qwiic)
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The SparkFun ZED-F9R GPS Breakout is a high precision, sensor fusion GPS board with equally impressive configuration options and takes advantage of u-blox's Automotive Dead Reckoning (ADR) technology. The ZED-F9R module provides a highly accurate and continuous position by fusing a 3D IMU sensor, wheel ticks, a vehicle dynamics model, correction data, and GNSS measurements.
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Product
Inspection Microscope
Z-NIR
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The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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Product
Automated Optical Inspection
K Series3D
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K Series and K Series3D are the reference in Automated Optical Inspection (AOI), allowing 2D and 3D inspection with very low false calls rate, for both pre-reflow and post-reflow. They are the most powerful gatekeepers to guarantee high quality level for the assembled PCB.
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Product
SUNTEST
XXL+ FD
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Atlas Material Testing Solutions
The Atlas SUNTEST XXL+FD is an extra-large light stability test chamber especially tailored towards the needs of consumer goods, food and beverage testing. Its 3000 cm2 flatbed exposure area and tall chamber height is best-in-class for 3-D specimens testing and can accommodate all types of bottles and packaging.
