NAPSON Corp.
Developing, manufacturing and selling measurement systems and software for silicon wafers/ingots and FPD process production
- +81-3-3636-0286
- +81-3-3636-0976
- 2-36-12, Kameido
Koto-ku,, Tokyo 136-0071
Japan
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Product
Non-contact Inline P/N Checker Module For Solar Wafer
PN-100BI
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*Principle: Photovoltaic effect with the laser diode*Suitable for production line and tranceportation system*Connect to host PC by LAN to send measurement command and data
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Product
Non-contact Inline Resistivity Measurement Module
NC-110 (NC-110PV)
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*Possible to measure sheet resistance without contact by Max. 3 types of probes*Suitable for production line and tranceportation system*Connect to host PC by LAN to send measurement command and data
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Product
4 Point Probe Sheet Resistance/Resistivity Measurement with Temperature Controled System
TCR-600
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*Controlled Thermo-chuck (room temperature～600℃/less than 20 minutes)*600C compatible probe head with 1mm linear*Controlled with vacuum sensor, digital thermo-meter, vacuum gauge and gas flow meter*Temperature measuring accuracy：±（0.5% + 1℃）
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Product
Non-contact Sheet Resistance Multi-points Measurement System With Wide Range
NC-80MAP
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*Possible to measure wide range of sheet resistance by installing Max. 4 probes*Min. 7 mm position from edge can be measured*User programable measurement pattern & programmable measuring pattern
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Product
Life-time Measurement System For Silicon Bulks/ingots By JIS Method
HF-100DCA
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*Global standard model for the lifetime test of silicon bulk*JIS direct current anodizing method*Data processing by digital oscilloscope and PC with software
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Product
Non-contact Sheet Resistance /resistivity Measurement Instrument
EC-80
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*Easy operation and compact design*Auto-measurement start by inserting a wafer under the probe*Easy set up to measurement condition by JOG dial*5 types of model for each measuring range
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Product
Semi-auto 4 Point Probe System for Solar Cell Substrate
RG-100PV
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*Measurement system for thin film on substrate samples for multi-points measurement*Even pitch and random pitch for Max.1,000 points*2-D/3-D square mapping software for even pitch
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Product
Non-contact Conductivity Type (P/N) Checker For Quick Check
PN-50α
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Photovoltaic effect by light pulse irradiationNo damage and no stain by Non-contact methodPossible to check even oxidized film on wafer surfaceInstantly discrimination by optical pulse illuminate
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Product
Fully Automatic Non-contact Sheet Resistance Measurement System For Flatpanel Display
NC-60F/RS-1300N
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*Global standard for non-contact measurement of ITO film, Metal thin films on flat panel*Automatic X-Y and Z (eddy current probe head) axis moving mechanism*Compatible with Loading robot for fully automatic measurementOption :*Integlate to combined system (film thickness meter, etc)*Add 4 point probe measurement unit : RT-3000
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Product
Fully Automatic 4 Point Probe System for Silicon Wafer
WS-8800
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*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
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Product
Non-contact Inline Sheet Resistance Measurement Module For Flat Panel Display
NC-600
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*Non-stop and non-contact sheet resistance measuring of thin film on glass runs through on conveyer*1 to 10 number of probe by sizes of glass is attachable*Glass collision prevention function*Continuous test data report to the host computer
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Product
Non-contact Sheet Resistance/resistivity Measurement Instrument With PC
NC-10 (NC-20)
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*Easy operation and data processing by PC*No damage measurement by non-contact eddy current method*Replaceable probes by meas. range (*Second or more probe is for the option)*1 point measurement of center position*5 types of model for each measuring range*Temperature correction for silicon wafer function
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Product
Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
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*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
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Product
Life-time Measurement System For Silicon Bulks / Ingots With Non-contact
HF-90R
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*Silicon bulk, Prismatic shape (JIS code), Ingot condition*Non-contact photoconduction vibration decay method*Data processing by digital oscilloscope and PC with software
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Product
Wafer Flatness Measurement System
FLA-200
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*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
