3D
three dimensions.
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Product
EM & Thermal Simulation Software
SEMCAD X
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Schmid & Partner Engineering AG
SEMCAD X is the latest generation of 3-D FDTD full-wave simulation software offering unprecedented levels of user-friendliness, speed & memory efficiency. Its application range has been further greatly extended by incorporating the world's first EM ADI-FDTD solver.
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Product
Simulation Software and Test Solutions
Simcenter Software
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Siemens Digital Industries Software
The Simcenter portfolio uniquely combines 1D simulation, 3D CAE and test to help you predict performance across all critical attributes earlier and throughout the entire product lifecycle. By combining physics-based simulations with insights gained from data analytics, Simcenter helps you optimize design and deliver innovations faster and with greater confidence.
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Product
PDS Motion Scan
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Allows a 3D Scanning sonar user to collect motion compensated 3D point clouds from a moving platformTeledyne PDS MotionScan system allows a 3D Scanning sonar user to collect motion compensated 3D point clouds from a moving platform. The MotionScan system is comprised of: an RTK capable dual antenna GPS with precision heading output, a heave, pitch and roll sensor, a topside control console. In combination with a BlueView 3D Multibeam Scanning Sonar this creates a full survey package.
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Product
Robot Guidance
Single Spot
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Point applications, such as handling, welding, bolting, adhesive spots etc. often need precise positioning of the tool. Only this way the specified product quality can be achieved. The Single Spot Solution measures local part tolerances prior to the application and delivers the 3D data for correction of the application points.
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Product
Hardware Platform
SmartScan 3D
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SmartScan-3D is another hardware platform that allows 3D scan using a six axis robot and DUT holder. A DUT is placed on a 360 degree rotating DUT holding jig. Vertical scanning without rotating DUT holder is one variation of SmartScan-3D for any DUT that is standing up, rather than laying flat on X-Y plane. Any scan technology can be integrated to the SmartScan-3D.
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Product
BIM Consulting Services
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Being Revit BIM outsourcing company, our consultants facilitate 3D Modeling (Architectural, Structural, and MEP), 4D BIM Construction Scheduling, 5D Cost Estimation, Clash Coordination, Scan/PDF/CAD to BIM Conversion, Shop drawing, Construction Documentation . Tejjy Integrated project delivery with Autodesk Revit software for Architecture, Structure, MEP workflow allows smooth execution through a quality assured BIM Management lifecycle.
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Product
Solid Edge
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Maya Heat Transfer Technologies Ltd.
Solid Edge® is an industry-leading mechanical design system with exceptional tools for creating and managing 3D digital prototypes. With superior core modeling and process workflows, a unique focus on the needs of specific industries, and fully integrated design management, Solid Edge® guides projects toward an error free, accurate design solution.
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Product
Permanent Bonding Systems
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The introduction of EVG's wafer-bonding approach, which separates the bond alignment from the bonding step, immediately revolutionized the market. Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process standard, with EVG holding the dominant market share for both semi- and fully automated wafer bonders and a growing installed base of more than 1500 chambers. EVG's wafer bonders offer optimal total cost of ownership (TCO), as well as multiple design features to optimize bonding yield. Multiple modules for bond alignment are optimized for different market requirements in MEMS, 3D integration or advanced packaging. Industry-leading alignment accuracies of less than 100 nm and a high-volume-proven modular platform enables the combination of EVG’s wafer bonding technologies in various applications.
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Product
Eyepiece-less Stereo Microscopes
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Vision Engineering’s eyepiece-less stereo microscopes are better for users and for business. Their ergonomic design lets the operator sit back in a comfortable position, and the expanded pupil technology delivers an enhanced 3D view of the subject. The relaxed natural posture makes it easy and to work with tools and to manipulate the subject. Greater comfort and ease of use directly translate into greater productivity and quality.
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Product
CAD Drafting Services In USA
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CAD design service providers for architectural, electrical, mechanical, plumbing, and structural drafting jobs are available to support your CAD drawing requirements. We provide impressive 3D outputs in combination with 2D orthographic projections and detailed shop drawings to felicitate your pre-construction operations.
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Product
Vibration Visualization
VCS
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The 3D Model Reconstruction software produces 3D geometric models of complex test structures from a batch of 2D photos.
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Product
X-ray Microscopy
Xradia Family
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✔ Characterize the properties and behaviors of your materials non-destructively.✔ Reveal details of microstructures in three dimensions (3D).✔ Develop and confirm models or visualize structural details.✔ Achieve high contrast and submicron resolution imaging even for relatively large samples.
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Product
System Design and Prediction Tool
MAPP 3D
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MAPP 3D, a free software application for macOS and Windows, is a powerful, multipurpose sound system design tool that delivers precise, high-resolution predictions of sound energy distribution in a three-dimensional sound field. From preproduction to post-show analysis, work faster and smarter with the ability to streamline processes and consolidate designs in one simple, accurate 3D model.
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Product
PC Edition Ynit
RH-2000
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"RH-2000" is a digital microscope which can evolve and customize. 2D Measurement, 3D Measurement, and Tilting. "RH-2000" enables you to make a high performance observation and analysis.
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Product
DSP-Based 4/8-Axis Advanced Pulse-Train Motion Controllers
AMP-204C/AMP-208C
Motion Controller
ADLINK"s new AMP-204C/AMP-208C DSP-based 4/8-axis advanced pulse-train motion controllers incorporate up-to-date floating-point DSP and FPGA technology, enabling high pulse output and encoder input frequency up to 6.5 MHz and 20 MHz respectively. Leveraging ADLINK" s Softmotion technology, the AMP-204C/AMP-208C offer impressive comprehensive and application-oriented motion functionality to reduce development time while maintaining superior throughput and accuracy. Superior synchronous motion control performance combines with point-table function integrating multi-dimensional interpolation, such as 3D linear/circular/spiral interpolation with enhanced trajectory and velocity planning, for contouring applications in semiconductor, display and conventional manufacturing industries. The AMP-204C/AMP-208C also support PWM control with three different control modes for frequency or duty cycle, benefiting laser engraving/marking/cutting applications. Moreover, hardware-based position comparison and trigger output are applicable in AOI applications.
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Product
Scanning Probe Microscopy/Atomic Force Microscopy (SPM/AFM Analysis)
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Rocky Mountain Laboratories, Inc.
Scanning probe microscopy (SPM) refers to a family of measurement techniques that utilize a scanning probe. The most common measurement is Atomic Force Microscopy (AFM Analysis), which measures surface topography. Imaged areas can be from the nm scale to as large as 100 µm X 100 µm. Heights and depths of features can be measuredand many surface roughness parameters, e.g Ra, can be calculated. 3-D images can also be produced for dramatic data presentation. Magnetic and electrical response can also be measured with SPM.
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Product
Antenna Measurement Software
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Raymond RF's Antenna Measurement Software performs 2-D (polar/rectangular) and 3-D (spherical) antenna pattern measurements for passive antennas and active wireless mobile stations (cell phones). Insertion loss of passive devices is included as part of the calibration component. Data management and reporting of antenna properties such as half power beam-width, directivity, gain, radiation efficiency, total radiated power, and total isotropic sensitivity. AMS performs and reports all measurements required by the CTIA Over-the-Air Performance Test Plan.
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Product
PHOTRON 6D-MARKER
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Traditional 3D measurement techniques require a minimum of two cameras, precisely located through a complex calibration procedure, to produce multiple data streams that must then be crunched to produce precise 3D or 6D data. The new holographic 6D-Marker from Photron, a world leader in high-speed photo instrumentation, provides engineers with the ability to record and plot true 6DOF (six-degree of freedom) coordinate data from a single camera.
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Product
Multibeam Profiler Sonar
MB1350-N
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At 1.35 MHz, the MB1350 delivers 3D profile data at levels more akin to a laser line scanner than today' low frequency bathymentry systems. Mountable on Boats, ROVs, UUVs, and Tripods, BlueView's MB1350 is the right tool to take your operation into the next generation of 3D bottom and structure mapping.
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Product
Mems-Based Probe Cards
MEMSFlex
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Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
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Product
Stylus Profilometers
Tencor™
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KLA Instruments™ Alpha-Step®, Tencor P- and HRP®-series stylus profilometers deliver high-precision, 2D and 3D surface metrology, measuring step height, surface roughness, bow and stress with industry-leading stability and reliability for your R&D and production requirements.
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Product
EPIC SBC With AMD G-Series APU, AMD A50M FCH, Dual DisplayPort/VGA/LVDS, Dual LANs And Audio
EP100
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The EP100 EPIC board, supporting either the AMD G-Series APU dual core T56N with Radeon™ HD 6320 graphics or AMD G-Series APU single core T40R with Radeon™ HD 6250 graphics, combined with the AMD A50M FCH, is ideal for graphics-intensive applications such as high-end medical imaging, digital signage, kiosks/POI, thin clients, and gaming machines. The onboard SO-DIMM socket supports maximum up to 4 GB of DDR3 1333 memory. Integrated AMD HD graphics with DirectX 11 technology, the small foot print embedded board offers stunning 3D visual effects and dynamic interactivity. The EP100 comes with three display outputs with two combinations: two DisplayPort and one VGA or one DisplayPort plus a VGA and 18/24-bit single/dual channel LVDS. Additionally, it provides dual gigabit LAN ports for high-speed wired communication and two PCI Express Mini card expansion interfaces, one with SIM slot, for seamless wireless communication (WiFi + 3/4G).
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Product
One-Piece Optical Sensor Head
OP
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Sciences et Techniques Industrielles de la Lumière
OP series consists of a one-piece optical sensor head for dedicated applications (e.g. long distance).The performance and specifications are dedicated to various applications in the industry.Typically integrated as OEM for measuring 3D shapes, glass thickness, autofocus, OP series fits a wide range of applications.
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Product
Cutting-edge 3D GPR array solution for efficient subsurface imaging cart solutions
Raptor
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The Raptor system covers a wide range of applications and can be configurated with 450 MHz or 800 MHz antennas. Raptor 3D Arrays are based on Real-Time sampling (RTS) technology and the unique antenna design is a milestone in the evolution of the GPR. A Raptor Antenna can be arranged in different ways, which allows for both standard and more advanced GPR measurements. These include common mid-point (CMP), wide-angle reflection and refraction (WARR) and Tomography.
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Product
WAFER MVM-SEM
E3300 Family
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The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Product
First Article Inspection Services
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API’s, on-site, first article measurement services provide inspection data on parts and assemblies with direct comparison against CAD models or drawings. Generated 3D measurement data from our portable metrology equipment and 3D scanners offers a comprehensive analysis of the physical part under measurement. Inspection reports can include 3D color maps or generated 3D models for detailed computer analysis.
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Product
Metra Scan 3D
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The most accurate scanning and probing solutions, whether in lab or on the shop floor.Highly accurate measurementDynamic referencingComplete metrology solution
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Product
Safety Radar System
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Leuze electronic GmbH + Co. KG
The world's first safe 3D radar system, LBK from Inxpect S.p.A., was developed for the monitoring of hazardous areas in harsh industrial environments. It detects the bodies of persons and in doing so monitors the protected area for access and presence. Using the controllers, up to 6 sensors can be combined in one application.
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Product
Digital Automated Fiber & Ferrule Interferometer For Single Fiber Connectors
DAFFI SF
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The latest interferometer from Data-Pixel is a cost effective solution for high volumes production, without compromising on accuracy or performance. Based on our extensive interferometer manufacturing experience we designed the DAFFI SF to be robust, fast and accurate in order to meet all manufacturing or laboratory environments. With the Blink software platform, DAFFI is able to measure the end face geometry on single fiber connectors in a very short time. The Daffi interferometer accessories (flange and adapters) are fully compatible with the Daisi range, allowing the user to limit the costs of the 3D geometry measurement units.
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Product
Geometry
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EDM Modal Geometry/ODS/Animation is the primary EDM Modal software module, and is required for every EDM Modal system. This option provides fast and efficient structural model generation and full 3D visualization of test and analysis results.
