3D
three dimensions.
-
product
3D Point Cloud Data Viewing, Cleaning, Editing, Leveling, and Alignment Software Package for BV5000 3D Data Processing
QuickStitch Powered by EIVA
QuickStitch is an easy-to-use 3D point cloud data viewing, cleaning, editing, leveling and alignment software package designed specifically for BV5000 3D data processing. The intuitive controls and user interface allows operators to quickly learn cleaning and alignment techniques. QuickStitch provides customers a fast and simple way to produce clean and aligned data sets to their customers.
-
product
Swing Sensor
GSA Zone
Drop your score by uncovering hidden dynamics of your swing. Simply plug the 3Bays Zone into the top of your club and swing away. 3Bays' state-of-the-art technology digitizes your stroke into 10,000 data points then instantly shows you accurate, valuable stats that matter along with 4-sided 3D playback. Eliminate doubt and illuminate your game.
-
product
I-Pi SMARC Development Kit based on MediaTek® Genio 1200 platform
I-Pi SMARC 1200
The I-Pi SMARC 1200 is a SMARC-based, AI and graphics-centric solution development kit powered by MediaTek® Genio 1200 (Octa-core Arm Cortex-A78 x4 + A55 x4) processor with a 5-core Arm Mali-G57 GPU for advanced 3D graphics and an integrated APU (AI Processor Unit) system delivering up to 5 TOPS.
-
product
Electrical Impedance Tomography
Electrical Impedance Tomography (EIT) is an imaging technique that visualizes conductivity or impedance distributions both in 2D and in 3D. Sciospec is partnering with world leading scientists in the field to deliver solutions that enable using EIT both in research and in practical applications.
-
product
ATX Industrial Motherboard With LGA1150 Socket Intel® Xeon® E3-v3 Processor, Intel® C226, ECC DDR3, USB 3.0, SATA 3.0, Dual LANs, DisplayPort/DVI-I/HDMI And CFast™
IMB210
The IMB210 is an advanced ATX industrial motherboard based on the 4th Generation Intel® Xeon® E3/ Core™ i7/i5/ i3/ Pentium®/ Celeron® processors (codename: Haswell) in LGA1150 socket with Intel® C226 PCH. The optimized IMB210 is specially designed for workstations through better computing and visual performance ideally used in every major industry for tasks ranging from financial modeling to designing complex buildings and vehicles. With its built-in Intel® HD Graphics P4000, this industrial grade motherboard delivers great 3D visual performance with triple display capability through DisplayPort, HDMI and DVI-I ports demanded by professional-grade CAD and media/entertainment fields. In addition, the IMB210 supports Intel® Turbo Boost 2.0 technology, Intel® Hyper-Threading technology, Intel® HD Graphics with DX11 support, 3-D Tri-Gate transistors, 32 GB ECC DDR3 1600/1333 memory, and PCI Express 3.0 x16 slot. It also features Intel® Active Management Technology 9.0 (iAMT), Trusted Platform Module 1.2 (TPM), SATA RAID, as well as PCIe x4 expansion making it ideal for applications with added security features.
-
product
Sapphire 3D Microscope
WDI-2000
The Sapphire 3D Microscope: HS-WDI-2000 was designed with high quality lighting parts and a good optical system design,can get a very clear image.with the digital camera,it can provide the image in time, widely used in LED,Solar,SEMI…
-
product
Alternate 2.52 (71.00) - 6.50 (184.00) General Purpose Probe
EPA-3D-1
Current Rating (Amps): 6Average Probe Resistance (mOhm): 35Test Center (mil): 125Test Center (mm): 3.18Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cyles): 2,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
-
product
Partial Discharge Expert Diagnostic and Location System
PDExpert
Power Monitoring and Diagnostic Technology Ltd.
The PDExpert is PMDT's third level of Partial Discharge (PD) Expert Diagnostic and Location System. It is a powerful, portable, multi-channel system of impeccable design used to analyze and pinpoint PD signals coming from a power asset within centimeters while the power system is energized. The system consists of UHF, AE, HFCT and ultrasonic sensors, one advanced UHF/PD signal processing unit, one oscilloscope, filters and other accessories.The system employs ultra-high speed data acquisition and advanced digital signal processing technologies, compares the UHF, AE and HFCT signals of different frequency ranges to determine if it is PD or noise, and locates the source in power assets accurately by utilizing Acoustic-Electromagnetic Combination Location Technique, time Difference of Signals' Arrivals (TDOA), and 3D Positioning Technology.
-
product
Pinhole Detector
NOVOTEST ED-3D
NOVOTEST ED-3D Pinhole Detector was designed for rapid non-destructive testing of the continuity of coating (e.g. porosity of film) with thickness up to 500mkm according to ASTM G62-A.Pinhole Detector is designed for testing the porosity of partially painted places and other discontinuities of protective dielectric coatings on metal products by putting low voltage through a sponge which is soaked in a liquid electrolyte with high penetrating properties.
-
product
Standard 1.60 (45.00) - 4.50 (128.00) General Purpose Probe
EPA-3D
Current Rating (Amps): 6Average Probe Resistance (mOhm): 35Test Center (mil): 125Test Center (mm): 3.18Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cyles): 2,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
-
product
Measurement Of Straightness, Flatness, Positioning Uncertainty Of Round Tables
ELCOLEVEL - Software For 3D-straightness Measurement
Optik Elektronik Gerätetechnik GmbH
ELCOLEVEL is a software with interfaces to electronic autocollimators and inclination levels of different manufactureres. This allows for example the 3D-Straightness measurement (twist-, roll- and yaw-angle) of slides in one and the same measuring procedure.
-
product
Software for Current & Water Quality Monitoring Data Analysis
DataStudio 3D
Aanderaa, a Xylem brand, is a technology provider of oceanographic sensors, instruments and systems which are able to measure environmental parameters such as wave, current andwater quality (Dissolved Oxygen, Salinity, Temperature, Depth and Turbidity) over long deployments, several years.Data analysis is an important stage in all environmental monitoring campaigns. In many situations, users have to download and filter through large data quantities for analyses. DataStudio3D is a free data analysis software available to Aanderaa SeaGuard and SmartGuard users.To aid in data analysis, Aanderaa has developed their own propriety software, DataStudio3D which allows users to download field data and plot them on different graphical plots. This mode of data analysis can be carried out within minutes to help user to compare parameters, view trends, anomalies, and to control the data quality.
-
product
Ultra High 4.18 (119.00) 11.70 (332.00) General Purpose Probe
EPA-3D-2
Current Rating (Amps): 6Average Probe Resistance (mOhm): 35Test Center (mil): 125Test Center (mm): 3.18Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cyles): 2,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
-
product
Video Detection Boards
VIP-3D Series
The VIP series offers multi-functional Video Image Processing modules for traffic control. These boards can monitor single or dual cameras and provide accurate data traffic volume, speed, gap-time, headway, occupancy, concentration, and classification. Data is stored on-board, using non-volatile memory.
-
product
SIMRC - 16 x Uncommitted Reed Relay, SPDT
1010-R-16-1-5/3D
Our small format embedded switching (SIM relay) cards offer a choice of switching configurations using low cost industry standard SIM connectors. They free the designer from the detail of routing complex switching circuits, you may select from a wide range of cards using the built in RS-232 and I2C interfaces. These low-cost embedded switching cards are intended to be mounted on to a simple motherboard. They may be used to construct very high density switching networks. SIM based switching cards also allow for very simple in-field maintenance.
-
product
Transformer Turn Ratio Instrument
ART-3D
The ART-3D is high precision instrument designed to measure ratios, magnetization currents, phase-shifting in power transformers, distribution transformers, potential and current transformers, in conformity to IEEE C57.12.90 and CEI/IEC 60076.
-
product
3D Surface Texture Analysis Software
TrueMap 6
Rendering styles: solid, wireframe, wireframe + pointsFull control of surface lighting, including direction, and ambient shadingRendering options including side walls, grid lines, and countour linesEdit the z exaggeration to help visualize surface deviationsRender the axes labels relative to the surface mean, maximum, minimum, or unchanged from the values stored in the fileRender the surface using a gradient to represent the surface heights, or use a solid color, or even use the true color values from the data file if they are availableMultiple options for gradients and even an optimization feature to use the height distribution
-
product
In-Line Vision & Rejection
Customizable 3D, full color, 360-degree Product Quality Inspection Solution that integrates seamlessly into existing production lines to measure multiple quality parameters at speeds of up to 100 objects per second. For advanced process control, each system is equipped with a conveyor, cameras selected for your specific application, and a choice of rejection options.
-
product
Portable Video Signal Generator
VG-882-A
Multi-interface signal generator for TV production line. Best cost performance. HDMI x 4 ports, PC analog and TV interfaces. HDMI ARC (Audio Return Channel) and 3D functions are supported as an option. HDCP / EDID / CEC testing of individual HDMI ports (Option) Remote box operation (RB-1870 or RB-1871) Program edit by software SP-8870 (USB communication)
-
product
Basic Heating Module
Microwave heating analysis including loads rotation and translation, frequency tuning, heat flow and material parameters modification as a function of dissipated power. QW-BHM (Basic Heating Module) for QuickWave 3D provides a novel regime of operating the FDTD solver: the possibility of simulating microwave heating problems.The software has been prepared to work in sophisticated regimes, modelling rotation and movement of the heated load(s) even along complicated trajectories, etc. Transfer of the heat generated by electromagnetic fields can be modelled with external or internal Heat Transfer Module or by coupling QuickWave 3D simulations to external computational fluid dynamics packages.
-
product
Universal Automated Programming System
4900
The 4900 is powered by the newest BPM 9th generation technology, which delivers the fastest programming speeds in the industry for MCU’s, eMMC HS400, NAND, NOR and Serial Flash devices. BPM 9th generation technology produces 200 MHz signals, allowing each byte of data to transfer in up to 2.5 ns. Up to 9 times faster than competing programmers. 3D Vision option inspects BGA, CSP, QFP, TSOP, SOIC and J-Lead devices for coplanarity, bent lead, pitch, width, diameter, standoff and XY errors.
-
product
Solder Paste Inspection
3D SPI
Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
-
product
Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
-
product
SparkFun GNSS-RTK Dead Reckoning Breakout
ZED-F9K (Qwiic)
The SparkFun ZED-F9K GNSS Breakout is a high precision, sensor fusion geospatial board with equally impressive configuration options and takes advantage of u-blox's Automotive Dead Reckoning (ADR) technology. The ZED-F9K module provides a highly accurate and continuous position by fusing a 3D IMU sensor, wheel ticks, a vehicle dynamics model, correction data, and GNSS measurements.
-
product
Medium-size Compact Antenna Test Range
H-Series CATR
The H-Series CATR chamber provide complete 3D performance assessment for 5G OTA devices and antennas including gain, efficiency, directivity, polarization and beam characteristics for frequencies from 3 up to 110 GHz, capable of supporting forthcoming 5G Sub-6 GHz (from 3 to 6 GHz) and mmWave (24 to 110 GHz) standardized testing including TRP/TIS, EIRP, EIS, IBB and emissions in accordance to 3GPP TR38.810 and TR37.842.
-
product
Atomic Force Microscope
3DM Serirs
Park Systems has introduced the revolutionary Park 3DM Series, the completely automated AFM system designed for overhang profiles, high-resolution sidewall imaging, and critical angle measurements. With the patented decoupled XY and Z scanning system with tilted Z-scanner, it overcomes the challenges of the normal and flare tip methods in accurate sidewall analysis. In utilizing our True Non-Contact Mode™, the Park 3DM Series enables non-destructive measurement of soft photoresist surfaces with high aspect ratio tips.
-
product
Semiconductors
Multiphysics Analysis Solutions for Chips and 3D IC Systems. Ansys cloud-native solutions provide unparalleled capacity to speed up completion times for even the largest finFET integrated circuits (IC) and 3D/2.5D multi-die systems. These powerful multiphysics analysis and verification tools reduce power consumption, improve performance and reliability, and lower project risk with foundry-certified golden signoff verification.
-
product
3D And 2D Visualization Software
3DViz
The 3DViz software provides intuitive 2D and 3D visualization of high-definition sensor data. Software allows strain or temperature data from an ODiSI system to be visualized directly on a 3D CAD model or a 2D image.
-
product
Global Standard Model For 4 Point Probe Sheet Resistance Automatic Measurement System
RT-3000/RG-1000F
*Fully automatic system for large sizes of flat panel with glass loading robot*Tester self-test function, Measurement position correction function, wide measurement range*Min. 0.1 mm meas. resolution and user programmable test pattern*Host (CIM) communication and 2-D/3-D Mapping software
-
product
3D Inspection Software
Metrolog X4
Metrolog X4 architecture is designed not only to benefit from current computer and OS technologies (Windows 64-bit, and multiprocessor PCs) that significantly increase the performances and throughput of your Metrology software, but is also aimed at simplifying your day-to-day measurement work. Metrolog X4 is a perfect Point Cloud software able to analyze large data size. High Performances in Point Cloud analysis: Large Data file import (CAD files, Point clouds, ...)
