Wafer Failure Analysis
Defines the failure mode and then through additional testing determine it's cause.
See Also: Wafer, Wafer Thickness, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
Wafer Prober Networking System
PN-300
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The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
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Product
Gas Analysis
Si-CA 130
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The Si-CA 130 features a touch-screen display and comes with PC-based management software (in addition to the smartphone app) for more in-depth combustion gas analysis. The three field-replaceable cells and sensors offer expanded measurement capability.
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Product
Code Analysis
Kiuwan
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Identify code defects & vulnerabilitesto manage your remediation effortsBlazingly fast analysis in a collaborative and unlocalized environment.
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Product
Thermal-Optical Analysis
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As with other current organic carbon and elemental carbon (OC/EC) procedures, Thermal-Optical analysis is method-defined. However, this unit has been designed to specifically address some of the problems observed in other methods in assigning carbon to either the organic or the elemental fraction.
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Signal Analysis
Harmonic Distortion Analysis
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The software is used for automatic measurement of the harmonic distortion factor and voltage r.m.s. of signals coming to the input channels of FFT spectrum analyzers. Adjustment to the frequency of the main component is performed automatically. The program is based on the measurement of the voltage r.m.s. of higher components by an external or internal reference signal.
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Product
WAFER MVM-SEM® E3300 Series
E3310
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The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Product
Fuel Analysis
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The GRABNER INSTRUMENTS MINISCAN IR Vision is a truly portable and fully automated FTIR fuel quality tester that allows fast and highly precise analysis of gasoline, diesel and jet fuels directly in the field. The ParaFuelTM analyzer is used specifically for process applications.
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Protocol Analysis
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GL's protocol analyzer provides monitoring a communication link in accordance with industry protocol standards by non-intrusively tapping the network under test. The simple framework of the protocol analysis software helps you easily identify the improper sequence of protocol messages, and filter out frames causing the protocol violation.
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Product
Thermal Analysis
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Thermal Analysis is important to a wide variety of industries, including polymers, composites, pharmaceuticals, foods, petroleum, inorganic and organic chemicals, and many others. These instruments typically measure heat flow, weight loss, dimension change, or mechanical properties as a function of temperature. Properties characterized include melting, crystallization, glass transitions, cross-linking, oxidation, decomposition, volatilization, coefficient of thermal expansion, and modulus. These experiments allow the user to examine end-use performance, composition, processing, stability, and molecular structure and mobility.
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Acoustics Analysis
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The sounds a product makes directly impact on user experiences. Sounds create strong emotions — positively or negatively — that reinforce brand identity. The difficulty of predicting acoustic results means that a single engineering mistake can prove costly to the final product, making Ansys Acoustics Analysis a powerful solution to ensure optimal acoustics and a successful end product.
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Product
Trace Sulfur Analysis
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Some sulfur compounds are known to be not only hazardous but also catalytic poisons. ppb sulfur analysis is conducted by gas chromatography. The Nexis SCD-2030 is a next-generation sulfur chemiluminescence detection system. The dramatically enhanced sensitivity and reliability, the excellent maintainability, and the automation functions, a first for the industry, will improve laboratory productivity.
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Gas Analysis
HPR-20 EPIC
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The Hiden HPR-20 EPIC gas analysis system is configured for continuous analysis of gases and vapours at pressures near atmosphere in standard form, alternative inlet systems being offered for applications requiring direct sampling from higher pressures to 30 bar.
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Product
XRF analysis
X-Supreme8000
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XRF analysis (X-ray fluorescence) with the highly flexible and powerful energy-dispersive X-ray fluorescence (EDXRF) spectrometer X-Supreme8000 for quality assurance and process control requirements across a diverse range of industries.
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Product
Wireless Protocol Analysis
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GL's protocol analyzer provides monitoring a communication link in accordance with industry protocol standards by non-intrusively tapping the network under test. The simple framework of the protocol analysis software helps you easily identify the improper sequence of protocol messages, and filter out frames causing the protocol violation.
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Product
CS/ONH-Analysis
G4 ICARUS Series 2
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The combustion analyzer G4 ICARUS Series 2 with high frequency (HF) induction furnace and HighSense™ detection sets new standards in for a rapid and precise carbon (C) and sulfur (S) analysis in inorganic solids.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
Stack Analysis Tool
GNATstack
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GNATstack is a software analysis tool that enables Ada/C/C++ software development teams to accurately predict the maximum size of the memory stack required to host an embedded software application. GNAT Pro add-on.
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Time-Domain Analysis
S95010B
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Measure the time-domain response of a device; transform frequency-domain data to the time domain or time-domain data to the frequency domain
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Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Product
Fat Analysis
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Unlike standard x-ray systems which use a single x-ray energy spectrum to scan products, DEXA technology uses two energy spectrums to discriminate between high and low energy x-rays. A patented software algorithm uses the differential x-ray energy absorbance of these two energies by the meat to determine the fat content.
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Automated Analysis Software
RevospECT Pro
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RevospECT Pro is the industry’s first commercially available high-powered, adaptable and scalable automated analysis system. It provides end users the power and control to perform comprehensive automated analysis of eddy current data. RevospECT has a proven track record in the field and meets rigorous industry standards for flaw analysis from bobbin, rotating and array inspection techniques. Once configured for an inspection, RevospECT Pro will process and analyze data at an extremely fast rate utilizing its robust distributed processing power, often outpacing data acquisition rates and generating results that can be verified immediately by the reviewing data analyst. More importantly than system speed is the consistency of the results that are delivered using computer-aided analysis.
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Network Analysis
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Network analysis includes a powerful set of analytical tools that allow for simulation, prediction, design and planning of system behavior utilizing an intelligent one-line diagram and the flexibility of a multi-dimensional database.
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Signal Analysis
CPB (Constant Percentage Bandwidth) Analysis
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The program is used for transfer fractional octave (1/1, 1/3, 1/12, and 1/24 octave) spectral analysis of signals coming from the input channels of FFT spectrum analyzers (in real time or recorded time realization view mode), as well as for viewing various spectral characteristics of signals.
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Wafer Internal Inspection System
INSPECTRA® IR Series
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An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Product
Measurement Analysis Equipment
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Facility fault diagnosis measuring instrument with technology that accurately tracks the heating part and abnormal noise generating part during operation of machinery using thermal imaging camera and microphone
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Signal Analysis
Synchronous Accumulation (Order Analysis)
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Order analysis is one of the most convenient and efficient methods for diagnostics and balancing of rotating mechanisms and transmission gears. With an RPM sensor and a vibration sensor, it is possible to study the time characteristics of gear vibration signals. It is a well-known fact that a signal from a vibration sensor is affected by signals from other sources. To tune out from the disturbing signals, the synchronous signal accumulation method is used. For each shaft rotation, the RPM sensor provides a rotation mark. This signal serves as a triggering strobe for the vibration sensor signal sweeping. The obtained signal sweeps are combined. All the sources of the signals related to the shaft frequency (frequency of rotation) are accumulated and increased in the accumulator linearly proportionally to the N number of rotations. All other signals that are not correlated with the shaft frequency are accumulated proportionally to N1/2 and in case of a greater number of averagings, the useful signal exceeds the interference level.
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Surface Analysis
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A UHV surface analysis system for thin film depth profilingMeasures the surface composition of the first few nanometers and/or micrometers depth of solid samples.
