Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
-
Product
Wafer Thickness Measuring System
WT-425
-
Contact type can measure any materials within 0.2 µm (2 σ at 20℃ ±1℃). The wafer floats positions while measurement points change and it does not damage even thin wafers. Best for the process control of compound wafers and oxide wafers. (SiC, GaN, LT, Sapphire and Bonded Wafers)
-
Product
Wafer Thickness, TTV, Bow and Warpage
-
ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
-
Product
Contactless One-Point Wafer Thickness Gauge
MX 30x
-
The MX30x series are manual one-point Thickness gauges for silicon wafers.
-
Product
Wafer Thickness Measurement System
MPT1000
-
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
-
Product
Backgrinding & Stress Relief
-
Grinding and Dicing Services, Inc.
GDSI delivers complete backgrinding solutions to the semiconductor, MEMS and biomedical industries. Backgrinding is a necessary process step to reduce wafer thickness prior to dicing and final assembly. By utilizing fully automated grinders staffed by highly qualified engineers, GDSI’s grinding procedures produce unsurpassed precision and repeatability.
-
Product
BT Imagine New wafer Thickness System
IS-T1
-
Measurement Technique Laser Triangulation1-3 Laser Sensor SpotsLaser Spot Size Optimized for Accuracy and Precision.
-
Product
Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
-
*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
-
Product
High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
-
The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
-
Product
Wide Measurement Range Model Of Semi-automatic 4 Point Probe Sheet Resistance/resistivity Measurement
RT-3000/RG-2000 (RG-3000)
-
*User programable measurement pattern & programmable measuring pattern*Tester self-test function, wide measuring range*Thickness, edge, temperature correction for silicon wafer*Film thickness conversion function from sheet resistance*2 types measuring tester (S version: Standard type, H version: High range resistivity measurement type)
-
Product
Automated Front & Backside Mask Aligner System
Model 6000
-
With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
-
Product
Wafer Sorter and Inspection
SolarWIS Platform
-
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
-
Product
Semiconductor Metrology Systems
-
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
-
Product
Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
-
The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
-
Product
Wafer Manufacturing
-
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
-
Product
Wafer Test
-
WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
-
Product
Thickness Gauges
-
Our digital thickness gauges offer a range of features for advanced performance. Explore different options to suit your application needs, from simple handheld gauges to advanced models. All Olympus ultrasonic thickness gauges can measure thickness from one side of a part.
-
Product
High Resolution Thickness & Surface Profiler for as-sawn Wafers
MX 70x
-
The MX 70x series measure Thickness, Warp, Waviness, Roughness and are usable for nanotopography.
-
Product
WAFER MVM-SEM
E3300 Family
-
The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
-
Product
Digital Thickness Gauges Ultrasonic Coating Thickness Meter
HC-220
-
Shenzhen Chuangxin Instruments Co., Ltd.
HC series of coating thickness gauge is a portable thickness gauge with eddy current thickness method and electromagnetic thickness method. It can be used to quickly and accurately measure the thickness of coating or cladding material withoutdamaging it. As an essential instrument for professional material protection, this coating thickness gauge is widely used in manufacturing industry, metal processing industry, chemical industry and commodities inspection etc. ,both in the laboratory and in the engineering field. It can measure the thickness ofnonmagnetic layer on magnetic metal substrate condition (such as steel, iron, alloy and hard magnetic steel, etc.) and the thickness of conductive layer on nonmagnetic metal substrate condition (such as rubber, paint, plastic, anodic oxidation film, etc.).
-
Product
Underwater Thickness Meter
Multigauge 3000
-
Large bright 10mm display. Integral battery with 55 hours runtime. Can be easily upgraded to a topside repeater. 500m depth rating.
-
Product
Thickness Tester
-
Shenzhen UYIGAO Electronic Technology Co., Ltd
The coating thickness gauge is designed for non-destructive, fast and precise coating thickness measurement.
-
Product
Wafer Probe Loadboards/PIB
-
DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
-
Product
Wafer Mapping Sensor
M-DW1
-
Panasonic Industrial Devices Sales Company of America
To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.
-
Product
Coating Thickness Meter
SI-1099
-
Coating Thickness Gauge SI 1099 is a highly intelligent and precise instrument used to quickly and accurately measure thickness of coating or plating on almost all kinds of metal surface. Technology – Magnetic Induction – (enables measurement of non magnetic coatings on magnetic substrates such as Steel, Mild Steel, Cast Iron &Magnetic Stainless Steel). Example coatings:- Paint,Zinc / Galvanising, Chrome, Copper, Enamel, Rubber, Paint, Varnish, Powder Coating, Plastic etc.
-
Product
Thickness Measurement
-
Thickness Tester is a high precision mechanical contact method thickness tester, which can be used to thickness measurement of films, sheeting, paper, corrugated paperboard, textiles, non-woven fabrics, and solid insulation materials, etc.
-
Product
Wafer Level Test Handler
Kronos
-
Wafer level test handler for 6/9DOF sensors with real stimulus. Very high UPH capacity and the lowest cost of test (COT). KRONOS is one of the only wafer level test solutions for motion sensors with real stimulus.
-
Product
Thickness Gauge
-
Hildebrand Prüf- und Meßtechnik GmbH
You can select a Thickness Gauge based on a specific standard, a specifiy material or foot diameter and weight/pressure.
-
Product
In-situ Wafer Temperature Monitoring
-
CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
-
Product
Wafer Bonder
AML
-
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
-
Product
Solar Wafer Transfer Tool
-
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Solar Wafer Transfer Tool
