Package Probe

Test Socket - MICRONICS JAPAN CO.LTD. (MJC)

Jigs for testing the electrical characteristics of devices in the final testing stage after LSI package assembly.
To match the increasingly high functionality of LSIs for communications and networks, such as mobile phones and mobile devices, we provide two types of test sockets: The "J-Contacts" series suited for high-frequency, high-performance devices, and the "BeeContacts" series, spring probes with a unique structure that delivers excellent contact stability.