Test Sockets
provide electro mechano connection between DUT and ATE in hand testing applications.
See Also: BGA Test Sockets, Burn-In Sockets
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Custom Test Sockets
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RTI specializes in producing custom test sockets We work with your engineering team from prototype to production, ensuring your product meets your test requirements. Contact us for a free quote.
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Test Sockets
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socket design as per customer specificationsquick + easy socket changehigh-performance spring probesdesigned for high frequency up to 16 GHz-55C/-67F to 150C/302F temperature rangemanual/automatic application optionssmall socket footprintone socket base for each insert (3x3 to 9x9 QFN)one-click switch from engineering to production socket modedevice dependent standard socket frame with changeable insertmore than 500,000 compression cyclesKelvin test applicabilitytool-free insert + actuator exchanges0.3 mm minimum lead pitchQFP extender available
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Test Sockets
Non Standard
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Chances are good Ardent can help you with that. We can adapt our technology to just about any package, device or module. Small volumes of custom sockets for higher bandwidth applications are a niche all in their own, and our engineering team has many years of experience designing custom sockets for all kinds of applications.
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Test Sockets
BGA/LGA
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There are a lot of options when it comes to bench test sockets. Save yourself and your lab time, money and frustration by working with Ardent for truly customized test socket solutions to meet your needs and do the job with high performance, reliability and quick turnaround that you need and deserve.
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High Performance Chipscale Test Sockets
SC
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Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.
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MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Burn-In Test Sockets
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The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Test Sockets & Interposers
Silmat
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Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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Test Sockets
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Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
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Grypper G35 / G40
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*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*Oxide cutting wipe action: The contact design wipes the side of the solder ball during insertion, breaking through solder oxides ensuring a good electrical connection between contact and solder ball*Signal integrity: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection*Test socket has solder balls attached: The G40 contacts have solder balls reflowed onto the contacts to ensure reliable solder volume at the PCB to test socket solder interface.
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Fixture Design
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TestEdge offers quick, cost effective test fixture design services for low-speed, full-speed, and high-speed devices. Based on our experience in developing high performance test fixtures for a wide variety of devices, test sockets, and tester platforms, we provide a premium quality test and engineering validation environment for everything from high power (40W) to high pin count to high speed ECL to high speed SerDes (3.25Gb) devices.
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Semiconductor
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With ultra-multi pin count and fine pitch, our general-purpose IC socket lineup corresponds to every need. For semiconductor burn-in sockets for thermal acceleration tests, and test sockets for semiconductor electrical testing, we continue to hold a high market share all over the world.
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PCB Test Points
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Test Socket 2mm. Plug 2mm. Measuring Socket 2mm . 2 Pin Test Socket 2mm. Miniature Test Socket 2mm
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Universal SOIC-to-0.600 [15.24] DIP Adaptor
Series 647
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Universal SOIC to .600 [15.24] DIP Adapter. 44 pin adapter for mounting Aries Series 547 Universal SOIC ZIF (zero insertion force) Test Socket to .600 [15.24] DIP PCB layout. Consult Data Sheet No. 10015 for test socket information.
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Test Sockets
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Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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EV Charging Station Tester
EV : ChargeCheck
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The EV Industry’s Charging Station Tester of Choice. • Simulates an electric vehicle • Tests J1772 (type 1) tethered leads • Tests IEC62196 (type 2) sockets • Tests IEC61851-1 mode 3 communication compliance • Tests for correct polarity • Tests for earthing presence • Tests contactor actions.
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TEST SOCKET
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IC Package It is a device to install INTERFACE between TESTER and DEVICE during TEST to check electrical defects such as O / S (Open, Short) test, mounting test, BURN-IN TEST and RLC TEST, The device
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High Speed Thermal Printer
6041
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• RS232C serial interface via a 6-pole RJ12 socket• Tested to comply with FCC Standards• Designed for use with Associated Model 6044 and similar devices• Four AA Batteries included• Imported
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Universal ZIF (Zero-Insertion-Force) DIP Test Socket
Series X55X
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Universal Zero Insertion Force DIP Test Socket. All pin count sockets go into PCB with either .300 or .600 [7.62 to 15.24] centers. Sockets can be soldered into PCBs or plugged into any socket. Socket fits into Aries or any competitive test socket receptacle.
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Semiconductor Test
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Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
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Quick-Release Universal ZIF
Series X57X
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Quick-Release Universal Zero Insertion Force Dip Test Socket. Aries Universal Test Socket accepts devices on .300 to .600 [7.62 to 15.24] centers. Swing quick-release handle down to open contacts and insert device. Release and handle automatically returns as contacts close onto device leads.
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Passive Component ATS
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Test and packing speeds from 80ppm to1,800ppmStandard functions - Inductance/quality factor test - Winding resistance test - Polarity testOptional functions - Layer short test - Insulation resistance test - Bias current testCircular vibrating plate design feeds inductors steadily and rapidlyIndex disc design eliminates dropped inductorsFour-wire measurement test socket designAutomatic discharge mechanism when feeding errors occurEach test station has an independent NG (No Good) product collection boxTest without packaging function provided, good products gathered in bulk collection boxExclusive data collection software designed for monitoring product quality in real timeReserved stations for number spraying and automatic optical inspectionSwitchable Chinese/English/Japanese operating interfaceEquipment is fast, stable and safe
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Boundary-Scan DIMM Socket Tester
ScanDIMM
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Maximizing test coverage is an important piece in test procedure development. Unfortunately, not all designs have the necessary requirements in place to accommodate boundary-scan test methods on memory devices. ScanDIMM digital socket test modules are designed to overcome such limitations when testing DIMM sockets utilizing boundary-scan test techniques.ScanDIMM modules provide the capability to instantly turn any DIMM socket into a fully compliant IEEE-1149.1 device. Integration is as simple as assigning the included BSDL file to the reference designator of the target socket and compiling test vectors.In multi-socket systems, multiple ScanDIMM modules can be linked to provide even greater boundary-scan test depth.
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Test Block & Plug Systems
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Test Block system is an evolution of the 14 test circuit versions widely employed in the power utility sector. The primary difference is the incorporation of ‘finger safe’ test sockets which allow the use of shrouded 4mm banana plugs.
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Fuel Display Unit Tester
MS 1125
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Fuel Display Unit Test Bench is a compact table-top test bench with front panel controls, indications, built-in signal simulator and necessary power supply for testing the serviceability of Fuel Display Unit of Helicopter. FTB operates on 230 V AC and supplies 28 V DC power to FDU. FTB is housed in a metallic cabinet FTB interfaces with both 61 Pin connector and 6-pin socket mounted on the rear panel of FDU by means of the cable connected to the unit. FTB is fabricated utilizing off-the-shelf standard industrial/commercial components like rotary switches, toggle switches, press switches, test sockets, fuse holders, potentiometer etc. The Frequency generation circuit is integrated into FTB for the simulation of Fuel probe and flow rate signals. The frequency of the signal can be selected by means of a rotary switch Low amplitude sine wave signal is simulated for testing flow rates. Variable voltage DC power supply with a voltage range of 24 to 29 Volts is provided within FTB to power-up FDU. 5 V DC is provided for the operation of signal generating circuit (PIC Frequency Controller Board). An off-the-shelf Hand held battery operated Digital Multimeter (DMM) procured from the prominent manufacturer (FLUKE) is supplied with FTB for setting up and measurement of various parameters like Resistance, Voltage, Frequency etc.
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Film Frame Test Handler
4170-IH
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High throughput ・High withstand load, and high thrust table ・Expansion of the strip attachment area ：260(L) X 300(W) [Withinφ300mm for WLCSP]・LOT control by barcode/2D code reader ・Easy device type exchange only test socket and display screen setting・Auto-cleaning function unit is installed to clean the socket at any desired timing.・8/12 inches ring conversion ・S2/S8 regulation compliance・SEMI G85 compliance・SECS/GEM compliance
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Transformer Rated Pre-Wired Meter Enclosures
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TESCO Transformer-Rated Pre-Wired Meter Enclosures are built with the TESCO tradition of quality and durability. TESCO enclosures are designed for use in commercial and industrial metering installations where voltage ratings of 480 and above are required. The enclosures are available with ringless, single piece or two piece covers and can be pre-wired between the test switch and socket to meet your exact specifications.
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Grypper G80 / G80 LIF
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*Package-size PCB footprint: Since the PCB footprint of G80 is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*No lid required: The package snaps directly without a lid, enabling easy probing, scoping and troubleshooting the topside of the device*Excellent signal performance: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection
