Sockets
receive conductors.
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Product
Aspen Sockets
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Ironwood Electronics’ Aspen line of sockets are designed in standardized stepped footprint configurations, incorporating industry standard high performance spring pins. Sockets can be designed to work with any type of IC package; BGA – LGA – QFN – DFN and even leaded devices where you have minimal space to fit a socket in place of your device to allow fast, easy testing and development.
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Product
Module Sockets
Ardent Optical Engine
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The scalability of SP connector technology is enabling the next generation of optical device IC manufactures to allow for solder-less high speed optical Electrical Module replace-ability. These connectors offer high speed input data rates in cost effective and real-estate friendly form factors.
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Product
Test Sockets
MEMS Device
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Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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Product
Test Sockets
BGA/LGA
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There are a lot of options when it comes to bench test sockets. Save yourself and your lab time, money and frustration by working with Ardent for truly customized test socket solutions to meet your needs and do the job with high performance, reliability and quick turnaround that you need and deserve.
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Product
Test Sockets
QFN/QFP
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For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
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Product
Evaluation Modules And Sockets
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Figaro USA offers a wide range of evaluation modules and sockets for test use.
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Product
Burn-In Test Sockets
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The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Product
Silver Ball Matrix Sockets
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SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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Product
BGA Sockets
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Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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Product
GHz Elastomer Sockets
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Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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Product
Near Zero Footprint SMT Spring Pin Sockets
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Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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Product
Qualification Hardware & Sockets
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Reltech Limited holds over 35 years’ experience in the design and manufacture of all types of qualification test hardware. Our advanced technology products include: HTOL Boards (Mother and Daughter cards) Burn-In Boards HAST Boards THB (humidity) Boards Burn-In Modules and frames Dynamic Driver cards (Digital, Analogue and Mixed signal) Back Planes Voltage regulator cards Custom electro-mechanical assemblies DUT Cassettes and test Fixtures
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Product
MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Product
Open Top BGA Sockets
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Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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Product
Blade Socket Tester
RV 7
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The RV 7-Blade Socket Tester offers a fast, easy way to isolate a lighting problem to the trailer or towing vehicle. A must have for anyone who deals with hitch and lighting hookup installations, it tests the output of towing vehicle’s RV 7-blade lighting socket.
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Product
Probe Tip Ground Lead with 0.8 mm Socket
PK007-024
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Probe Tip Ground Lead with 0.8 mm Socket.
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Product
19" Rackmount Rugged, Fanless AIoT Platform for Real-time Video/Graphics Analytics
AVA-5600
Video Analytics Platform
- Intel® Core™ i7-7820EQ Processor and Mobile Intel® CM236 Chipset- NVIDIA Quadro® GPU MXM 3.1 Type A/B module on PCIe x164x M12 GbE with PoE, 4x USB 3.0- Rich Storage Options: 2.5" SATA 6.0 Gb/s drive bay, 1x M.2 2280 slot, 1x CFast socket- GNSS/3G/4G/WLAN support via 2x Mini PCIe slots and 2x USIM slots- MVB/CAN bus support by Mini PCIe add-on module (BOM option)- Nominal Voltage: 110VDC (EN50155 compliant)
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Product
Fanless Embedded System With Intel® Celeron® J1900 2.0 GHz, HDMI, VGA, 2 GbE LAN, 4 USB And 2 COM
eBOX625-842-FL
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The eBOX625-842-FL industrial-grade, extreme slim, fanless embedded system is powered by quad cores Intel® Celeron™ J1900 2.0GHz SoC (system-on-a-chip). Through the use of Intel® Bay Trail-D type quad-core SoC and one 8 GB DDR3L-1066/1333 SO-DIMM socket, the energy-efficient embedded box computer offers outstanding performance, yet remarkably power efficient experience. Dramatically lighter and rugged enclosure enables the compact system to fit into limited space and withstand any harsh industry environment. The eBOX625-842-FL features dual displays and rich connection capability, including VGA, HDMI, 2 LAN ports, 2 COM ports, 4 USB 2.0 and 8-channel DI/DO, providing an ideal solution for variety applications from digital signage, transportation, kiosk, industrial control automation, medical equipment and IoT & M2M applications.
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Product
Ethernet To Modbus RTU Minibox™ Interface
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ICS's Model 9099 Ethernet to Modbus RTU Interface is a small Minibox™ Ethernet Modbus Converter that converts Modbus TCP/IP, VXI-11 and Raw Socket to control Modbus RTU Slave Devices. The Model 9099 does not require special drivers and is compatible with the following systems: LINUX, UNIX, SunOS, MAC OS X, HP-UX, IBM-AIX, Windows 2K or later and Modbus capable PLCs. ICS's 9099 uses VXI-11 RPC calls for secure communication with virtually any computer. Easily programmed on a PC by making VISA calls or on a MAC/UNIX/LINUX computer with RPC calls. Special drivers are not required. ICS Electronics is the premier VXI-11 device supplier with 100% VXI-11 compliance in every product. See our extensive Application Notes or download our VXI-11 Tutorial and the VXI-11 Specification for more information about the VXI-11 Standard.
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Product
IEC60884-1 Plug Socket Switch Life Tester With 3 Stations
CZKS-4
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Shenzhen Chuangxin Instruments Co., Ltd.
1. This test equipment is designed and manufactured according relevant requirement of Standard IEC60884-1,GB2099.1 and GB16915.1,Mainly used to test the service life of household and similar use plugs and sockets or switches. 2. This machine connect to load cabinet and conduct electrical life test ,normal operation and breaking capacity to plug socket and switch.
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Product
Measuring Small Antennas
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If you have a small PCB with a small antenna you can't use a thick cable and a large connector. Not only is this impractical (how to connect the connector?) but the metal bulk will also affect the antenna and grounding properties of your PCB. The measurement will be useless. MegiQ promotes the use of the small and popular UFL connector and its associated cables. The UFL socket fits on almost any PCB and it can be improvised on a board without a UFL footprint.
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Product
4 Digit LCD Voltmeter
DPM 160
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The DPM 160 is a 4 digit LCD voltmeter with 12.5mm (0.5") digit height. It features 200mV and 2V d.c. full scale readings, auto-zero, auto-polarity and a set of annunciators. The meter plugs directly into a SIL socket or can be panel mounted using the snap-in bezel and window
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Product
Interface Board for Gigabit Ethernet
40-965-910
Interface
The 40-965-910 is a converter card for the 40-201 Ethernet/AFDX Fault Insertion Switch. Adapts the 78-Pin D-type connector on the front of the module to 4 RJ45 sockets and one 9-way D-type connector for fault signals. Allows the fault insertion testing of Gigabit Ethernet signals.
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Product
RCD/LOOP/PAT Testers
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Kyoritsu Electrical Instruments Works, Ltd.
Custom microprocessor controlled for highest accuracy and reliability. 3 LEDs for checking correct wiring status. 0 and 180 degree phase angle switch permits quick tests and consistent readings. Digital read-out of tripping time. Constant current source circuitry ensures that a fluctuating mains voltage does not affect the accuracy of readings. Large custom digital display readout. Visual indication of reversed phase and neutral wiring at socket. Designed to IP54 Rating. Complies with IEC 61557 Test of a large kind of RCD''''s: Standard, Selective, AC and A (DC sensitive breakers)
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Product
Circbord
8023
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VECTOR Electronics and Technology, Inc.
3-hole solder pad for interconnecting multiple component leads. I/O area with square solder pads for connectors mounting. Circuit pattern etched onto both sides. Double sided with plated thru holes. Solder mount DIP sockets or IC devices with any lead spacing.
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Product
BGA SMT Adapters
Giga-snaP™
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Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Product
Open Pluggable Specification (OPS) Digital Signage Player With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170 And Intel® AMT 11.0
OPS500-501
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The OPS500-501 is a 4K resolution OPS compliant digital signage player supporting Intel® Active Management Technology (AMT) 11.0 for better remote management. The space-saving OPS signage module is powered by the 6th generation Intel® Core™ processor with Intel® Q170 chipset. It has one 260-pin DDR4-2133 SO-DIMM socket with up to 16GB memory capacity. Compliant with the Intel® OPS architecture, the 4K-ready signage player provides a high level of compatibility as well as simplified installation, maintenance and deployment for a lower total cost of ownership. The outstanding digital signage player, the OPS500-501, is connected to OPS-compliant display via a standardized JAE TX-25A plug connector that supports DisplayPort, HDMI 2.0, UART, audio, USB 3.0 and USB 2.0 signals. To meet various application needs, the powerful digital signage system offers rich I/O interfaces on its front panel, including one USB 2.0 ports, two USB 3.0 ports, one COM port, audio (in/out), HDMI and a Gigabit Ethernet port. This space-saving OPS signage player has one PCI Express Mini Card slot for WLAN connectivity and features one 2.5” SATA HDD for extensive storage needs.





























