Interconnects
Links between systems, networks,nodes, equipment, devices, components and circuits.
See Also: Mass Interconnect, Connectors, Cable Assemblies, Interfaces
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Product
Tilera GX72 Processor AMC, 72 Core
AMC740
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The AMC740 is ideal for packet filtering, intelligent networking, multimedia, video transcoding, cloud and other applications. The device includes 72 identical processor cores (tiles) interconnected with Tilera’s iMesh™ on-chip network. Each tile consists of a full-featured, 64-bit processor core as well as L1 and L2 cache and a non-blocking Terabit/sec switch. The high processing density and high internal bandwidth of the GX72CPU make it ideal for intensive computing tasks.
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Product
DIP Program Header
Series 675
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DIP Program Headers. Aries DIP programmable headers offer unusual versatility for programming within the header itself. They can be individually programmed using cutters or Aries programming tool, Part No. T-675, available separately, to remove the interconnecting sections. Consult Data Sheet No. 22002 for Aries programming tool.
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Product
Tool, Extraction, 90 Series Modules, Interconnect Adapters
910109111
Extraction Tool
Tool, Extraction, 90 Series Modules, Interconnect Adapters
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Product
12-Port PCI Express
PEX 8648
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The ExpressLane™ PEX 8648 device offers 48 PCI Express Gen 2 (5.0 GT/s) lanes, capable of configuring up to 12 flexible ports. The switch conforms to the PCI Express Base Specification, rev 2.0. The 48-lane switch enables users to add scalable, high bandwidth, non-blocking interconnection to a wide variety of applications including servers, communications, storage, blade servers, and embedded systems.
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Product
USB-8506 , LIN Interface Device
784664-01
LIN Interface
1- or 2-Port, USB LIN Interface Device—The USB‑8506 is a Local Interconnect Network (LIN) interface for developing applications with the NI‑XNET driver. The USB‑8506 is powered over the USB bus and does not require external power. The USB‑8506 excels in applications requiring logging or manipulation of hundreds of LIN frames and signals, such as in-vehicle data logging, bus monitoring, automation control, and more. The NI‑XNET device-driven DMA engine enables the onboard processor to move LIN frames and signals between the interface and the user program without CPU interrupts, minimize message latency, and free host processor time. The USB‑8506 is available with a three‑pin COMBICON synchronization connector for triggering and synchronizing the internal hardware timebase with other devices.
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Product
Molded Interconnect Subtrate
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A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
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Product
Vehicle Communication Buses
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Vehicle Communication Buses provide native support for Controller Area Network (CAN), Local Interconnect Network (LIN), and FlexRay frames and signals. Use these products for hardware-in-the-loop simulation, bus monitoring, automation control, and more.
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Product
PXI Test Instrumentation
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The Yelo Pixi general purpose tester is a PXI based functional test system with in-circuit and continuity capability. Built into a free standing 19” rack is a PXI chassis, mass interconnect fixture interface, PC, flat screen and space for additional user selectable instrumentation.
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Product
Manual Fixture Kit With Mass Interconnect Cassette Interface, Max number of probes (2N) 1000 units, Max UUT 580 x 250 mm (wxd)
CMCSK-03-01
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Linear click system with ball bearings, using gas springs.10 mm ESD-proof top cover with aluminum reinforcement bars.Steel base cabinet with detachable aluminum back and bottom panels.Detachable interchangeable case system with an 8 mm spring-loaded probe protection cover.Base cabinet fitted with a telescopic guide rail and catch.
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Product
Plugbord
3795-1
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VECTOR Electronics and Technology, Inc.
44 Gold plated edge contacts (22 each side) on 0.100"(2.54mm) centers. 3-Hole Solder Pads One Side Only. 3-hole solder pads (0.28” x 0.080”) for interconnecting multiple component leads. All pad and bus surfaces solder coated for user convenience. No pattern on reverse side, edge contacts only. Convenient easy-to-read hole marking legend on wiring side.
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Product
Digital/Pattern/PE Card
PA32S
Interface Card
The PA32S represents a new level of performance and capabilities for PXI-based digital instrumentation. Based on the proven architecture of the PE32, the PA32S offers high performance pin electronics and an enhanced timing generator in a compact, 3U PXI form factor. Each card can function as a stand-alone digital subsystem or if required, multiple cards can be interconnected, supporting up to 512 bi-directional pins (16 boards). The PA32S also supports deep pattern memory by offering= 32 M of on-board vector memory with dynamic per pin direction control and with test rates up to 33 MHz. With new 32M capture/log memory, PA32S can capture 32 channels fail log.
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Product
6TL29 Semi-Automated Test Platform
AQ377
Test Platform
- Compact, transportable and modular test platform.- Ready for ICT, FCT, Boundary Scan, HiPot, Vision or any combination of the previous technologies.- Mass interconnect 9025 Receiver from Virginia Panel.- 100% Compatibility with Inline Test Fixtures (P/N: AT799, AN133 and EB773).- Free available rack space: 47U height- Multi-stage pressure at 3 levels.- FastATE Technology & YAV Modules compatible.- Phi6 Dispatcher Interface.- CE Compliant.
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Product
Interconnection
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The data center is the nexus of the modern enterprise. Instantly connect with a diverse marketplace of network carriers and leading cloud providers for your hybrid IT infrastructure
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Product
64x64 Matrix
TS202A
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Universal Switching Corporation
Designed from scratch to improve on the legacy Precision Filters Model 4164, the TS202A uses the absolute latest in component technology. Many engineers still use manual patch cords & patch panels to interconnect sensors, recorders, scopes and other instrumentation in test & evaluation labs.
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Product
PCI Express
PCIe
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PCI Express (PCIe) has become the leading interconnect technology to succeed the Peripheral Connect Interface (PCI) architecture. The PCI Express(PCIe) architecture retains the PCI usage model and software interfaces for investment protection and smooth development migration. The technology is aimed at multiple market segments in the computing and communication industries, and supports chip-to-chip, board-to-board and adapter solutions. PCI Express 5.0 currently runs at 16GT/s or 32Gbps per lane in each direction, providing a total bandwidth of 128GBps in a 16-lane configuration which is the largest size in use.
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Product
Digital/Pattern/PE Card
PEMU32
Interface Card
The PEMU32 represents a new level of MULTIFUNCTION for PXI-based instrumentation. Based on the proven architecture of the PE32, the PEMU32 offers high voltage PMU/DPS and pin electronics in a compact, 3U PXI form factor. Each card can function as a stand-alone digital subsystem or if required, multiple cards can be interconnected, supporting up to 256 bi-directional pins (8 boards). The PEMU32 also supports deep pattern memory by offering 32 M of on-board vector memory with dynamic per pin direction control and with test rates up to 10 MHz.
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Product
4x IDC to 192 Pin Quadrapaddle
YAV90Q04
Interface
The interface YAV90Q04 permits to connect two YAV90096 boards to one 192-Signal contacts Quadrapaddle module. As the Mini-D 50 connectors let 2 free pins (1 and 26), these pins are interconnected to a test point, with the possibility of be grounded. Cable P/N J6200540: Mini-D-50 to Mini-D-50 IDC connectors with 400 mm flat cable.
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Product
BGA SMT Adapters
Giga-snaP™
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Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Product
Signal, Contact, ITA, QuadraPaddle, 5 Amp, 22-24 AWG
610138109
Signal Contact (ITA)
Primary mating contact 610138216. (May mate with other ITA contacts, as well.)Available in twin-female, crimp/solder, twin male, and wire-wrap design, QuadraPaddle contacts are engineered for flexible interconnect options. Rated at 5 amps continuous (1250 VAC) with a 2-ounce insertion force, QuadraPaddle contacts provide 4 reliable points of contact per pin, outstanding electrical performance, and low mating force.
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Product
Induced Signals Test
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The test relates to interfering signals that may be generated by interconnected equipment. Induced signal testing is used to determine if equipment will withstand various signals, such as might be introduced by failures in other equipment to which the test unit is connected.
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Product
Lightwave Mainframes
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The Keysight Technologies Lightwave solution platform addresses different measurement needs for passive and active Lightwave components. The platform is the key component to combining the Keysight Lightwave modules and their interconnection by providing features like clocking and triggering and the required software control for test solutions.
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Product
ENA Vector Network Analyzer
E5071C
Vector Network Analyzer
9 kHz to 4.5/6.5/8.5/14/20 GHz2- or 4-port, 50 ohm, S-parameter test set Improve accuracy, yield and margins with wide dynamic range 130 dB, fast measurement speed 8 ms and excellent temperature stability 0.005 dB/CObtain design confidence through complete characterization of high-speed serial interconnects with enhanced time domain analysis option Protect your investment with upgradability across all of the options Every spec verified, adjustments included Lock in support & peak performance from the start
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Product
USB
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The introduction of USB 3.2 and USB4 along with the Type-C connector ushers in a new era of unprecedented performance for consumer electronics that can now utilize this universal interface for power, data and display. Positioned as the primary high-performance interconnect for the next decade, developers are ramping up their USB3.2 / USB4 expertise. From engineering validation to compliance test, trust the experts at Teledyne LeCroy to help ensure product compatibility for next generation USB systems.
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Product
18-Port PCI Express
PEX 8733
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The ExpressLane™ PEX 8733 is a 32-lane, 18-port, PCIe Gen 3 switch device developed on 40nm technology. PEX 8733 offers Multi-Host PCI Express switching capability that enables users to connect multiple hosts to their respective endpoints via scalable, high-bandwidth, non-blocking interconnection to a wide variety of applications including servers, storage, communications, and graphics platforms.
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Product
Phase Sequence Indicator
PHS 863
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Two Functions in one unit including open phase and phase sequence. Large Size alligator clips can easily clip on switch-board terminal. Highly Reliable : Identifies 3 phase sequence and open phase check. Functional design : This model is ideal for installing conveyor lines, pump systems and interconnected drivers. Safety approval : CE marks EN 6101-1 CAT. III. EN 61010-2-031
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Product
Switching Matrix
MUX
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The Analog Signal Switch Unit serves as a 6-bus interconnect for 128 pins each to the Analog Measurement Unit (AMU05) for the In-Circuit test.
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Product
sbRIO-9866, Non-Enclosed, 1-Port C Series LIN Interface Module
785965-01
LIN Interface
Non-Enclosed, 1-Port C Series LIN Interface Module—The sbRIO‑9866 is a Local Interconnect Network (LIN) interface for developing applications with the NI‑XNET driver. The sbRIO‑9866 excels in applications requiring real-time, high-speed manipulation of hundreds of LIN frames and signals such as hardware‑in‑the‑loop (HIL) simulation, rapid control prototyping, bus monitoring, automation control, and more. You can perform this manipulation while taking other DAQ measurements in the same CompactDAQ hardware platform or while performing low-level FPGA control and embedded monitoring in the same CompactRIO Chassis. Non-enclosed modules are designed for OEM applications.
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Product
Analyzer System
Ruggedized Test Systems (RTS)
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This analyzer is a rugged, field deployable system that detects and locates faults and detects degradation in electrical interconnect systems ranging from simple to complex.
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Product
3-Port PCI Express
PEX 8712
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The ExpressLane™ PEX 8712 is a 12-lane, 3-port, PCIe Gen 3 switch device developed on 40nm technology. PEX 8712 offers Multi-Host PCI Express switching capability that enables users to connect multiple hosts to their respective endpoints via scalable, high-bandwidth, non-blocking interconnection to a wide variety of applications including servers, storage, communications, and graphics platforms.
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Product
Test Services
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D-Coax offers RF/Microwave test services for your researchprojects, as well as, production quantities tests. We have available resources and expertise in the high frequency interconnects testing that will benefit your research and products. We will work with you to make your requested tests the most accurate and reliable and we'll complete them in a timely fashion. The following parameters can be characterized or tested to specifications with our test services: Time Domain: Impedance, Impedance profile, rise time, propagation delay, skew and more. Frequency Domain: S21 - Insertion loss, S11- Return loss, S12 - Reverse Insertion loss (port 2 insertion loss), S22 - Reverse Return loss (port 2 return loss) and more.
