Interconnects
Links between systems, networks,nodes, equipment, devices, components and circuits.
See Also: Mass Interconnect, Connectors, Cable Assemblies, Interfaces
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Product
Digital IO
PA64IX
Digital I/O Module
The PA64IX represents a new level of performance and capabilities for PXI-based digital instrumentation. Each card can function as a stand-alone digital subsystem or if required, multiple cards can be interconnected, supporting up to 1024 bi-directional pins (16 boards). The PA64IX also supports dee pattern memory by offering 32 M of on-board vector memory with static per pin direction control and with test rates up to 33 MHz.
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Product
24 Block Desktop Receiver
VGR24
Receiver
VG Mass Interconnect products provide a common Universal interface for your custom test rack and simplifies functional test across your product line. Mass interconnect bench-top and rack mount receiver Plug and play interface blocks for signal, coax, high current, pneumatic controls, and more Stable proven products with 25 years in service Best cost of ownership Fast delivery next day on key products! Compatible to currently available test instrumentation and platformsThere are a number of different block types: Coax up to 26 GHz Power up to 150 Amps Coax and power combined Signal: up to 170 pins, @250 VAC/5 Amps Pneumatic: up to 13 fittings Vacuum: port modules High speed: USB 3.0, HDMI, RJ45
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Product
Compute Express Link (CXL)
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Compute Express Link (CXL) is a new high-speed CPU-to-Device and CPU-to-Memory interconnect designed to accelerate next-generation data center performance. CXL technology maintains memory coherency between the CPU memory space and memory on attached devices, which allows resource sharing for higher performance, reduced software stack complexity, and lower overall system cost. This permits users to simply focus on target workloads as opposed to the redundant memory management hardware in their accelerators. CXL is based on a PCI Express 5.0 Physical layer with speeds up to 32GT/s. Teledyne LeCroy provides protocol analysis test equipment to support development and debug of CXL based devices.
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Product
SIM 90 Series Modules
The SIM Modules
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Snap-In-Modular (SIM) modules delivers a flexible, high‑density interconnect solution that supports multiple high‑performance contact technologies within a single module. The VTAC, Micro Coax, and QuadraPaddle SIM modules.
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Product
Time Domain Reflectometer / TDR
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For testing cables and interconnects, we offer the ideal tool: A time domain reflectometer (TDR). Time domain reflectometry/transmission can be used to test network return loss (S11), propagation loss (S21), and crosstalk.Moreover, it can provide the impedance profile of an electrical channel. MultiLane supplies semi-automated solutions for the testing of direct-attach cables and TIAs.
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Product
USB-8506 , LIN Interface Device
784664-01
LIN Interface
1- or 2-Port, USB LIN Interface Device—The USB‑8506 is a Local Interconnect Network (LIN) interface for developing applications with the NI‑XNET driver. The USB‑8506 is powered over the USB bus and does not require external power. The USB‑8506 excels in applications requiring logging or manipulation of hundreds of LIN frames and signals, such as in-vehicle data logging, bus monitoring, automation control, and more. The NI‑XNET device-driven DMA engine enables the onboard processor to move LIN frames and signals between the interface and the user program without CPU interrupts, minimize message latency, and free host processor time. The USB‑8506 is available with a three‑pin COMBICON synchronization connector for triggering and synchronizing the internal hardware timebase with other devices.
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Product
System-Level Interconnect Solution For ScanExpress Boundary-Scan Tools
ScanExpress Merge
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Combine Multiple Assembly Test Files Corelis ScanExpress Merge, a member of the ScanExpress suite of boundaryscan test tools, is a software application designed to import and join test files for multiple independent assemblies and assist in configuration of a combined test procedure.Using completed ScanExpress TPG test files and module interconnection data, ScanExpress Merge quickly combines combined test plan files for system testing with minimal user effort.
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Product
1149.6 Boundary Scan Feature, GTE 10.00p
K8213B
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Keysight’s Interconnect Plus Boundary Scan 1149.6 feature enables all the tools required to develop and execute this test method on the board under test. Compared to the 1149.1 standards, the 1149.6 standards define test methods for the boundary scan devices that are designed with AC coupled signals or differential nets needed for high-speed operations of the device.
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Product
Ethernet Switch/Router
VME-682
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Curtiss-Wright Defense Solutions
Enabling the vision of inter-networked heterogeneous military and aerospace systems in the Global Information Grid (GIG), Curtiss Wright's VME-682 FireBlade provides Systems Integrators with a fast, secure and unified approach to interconnect subsystems, chassis, cards, and compute nodes within any given platform using 1 and 10 Gigabit Ethernet links.
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Product
Receivers / ITAs
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Receivers and ITAs are the primary building blocks of an interconnect solution. Determining the amount of Input/Output (I/O) needed is one of the first steps required when designing a system.
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Product
9050 - 50 Module, 2-Tier Solution
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The rack mountable 9050 50 Module Receiver is designed to accept 9025 and 9050 ITAs and is ideal for systems with advanced mass interconnect requirements. The 9050 can be adapted to accommodate vacuum or mechanical fixturing. Connector modules can be intermixed for creating custom interfaces ideal for functional and system testing applications.
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Product
6TL08 Benchtop Test Platform
H710008
Test Platform
The 6TL-08 base platform was designed to cover the most common testing and in-system programming (ISP) needs with a reduced initial budget. The system includes a robust manual linear push mechanism allowing a low-cost fixture strategy thanks to the exchangeable cassettesThe platform enclosure features an 8-Slot fixture receiver, compatible with VPC 90 Series Mass Interconnect Module, as well as 6TL intelligent YAVModules (YAV90MMU &YAV90059), with room for fast ISP devices, optional PXI chassis and various power supplies. A removable back panel allows easy placement of custom connectors or test auxiliary circuitry.
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Product
BMS Manufacturing Test System
Test System
The Battery Management System (BMS) Manufacturing Test System performs functional testing of product during end-of-line manufacturing. The system hardware includes all instrumentation to test a BMS, including multiple cell simulators, a mass interconnect for quick product transition and bed-of-nail fixtures to ensure less down time, higher throughput, and easy maintenance. The system application easily integrates into manufacturing processes, provides a method to test multiple product types, and optimizes tests to ensure only good product is released from manufacturing.
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Product
High Power Rack And Panel Connectors
LSH Series
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The LSH rack and panel connectors include leading-edge Hypertac® hyperboloid technology. The Polyphenylene sulfide (PPS) insulators interconnect technology ensures LSH connectors are easy mating. The LSH Series delivers customers a high life cycle.
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Product
3-Port PCI Express
PEX 8613
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The ExpressLane™ PEX 8613 device offers 12 PCI Express Gen 2 (5.0 GT/s) lanes, with support for 3 ports. The switch conforms to the PCI Express Base Specification, rev 2.0. The 12-lane switch enables users to add scalable, high bandwidth, non-blocking interconnection to a wide variety of applications including workstations, communications, storage, and embedded systems as well as intelligent I/O modules and add-in cards.
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Product
Elastomeric Contact
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High performance contact materials specially designed for the advanced needs of the electronic industry. PariPoser Interconnects makes electrical connections uniformly between opposing contact areas using conductive columns, which are regularly distributed within a sheet of advanced polymer. PariPoser Interconnects is custom formulated depending on the application’s design rules.
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Product
OEM SOLUTIONS - Optical Switch Modules From 4x4 Up To 144x144 Ports
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Polatis Optical Switch Modules (OSM) are high-performance, fully non-blocking all optical matrix switch modules with port counts from 4x4 up to 144x144. Versions are also available for "any-to-any" port connectivity, which enables new interconnection architectures not possible with traditional symmetric NxN switch matrixes. The modules are designed for easy integration by OEMs integrating all optical switching with network equipment and are designed to meet the highest performance and reliability needs of the most demanding applications with exceptionally low optical loss, compact size, low power requirements and fast switching speeds.
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Product
Bulk Wire and Cable
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Teledyne Marine Cable Solutions
With 50 years of dedicated experience in providing cable and interconnect solutions, Teledyne Cable Solutions meets challenges for application-specific, multi-core cables for harsh environments and complex ruggedized cable assemblies and harnesses.
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Product
Plugbord
3795-1
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VECTOR Electronics and Technology, Inc.
44 Gold plated edge contacts (22 each side) on 0.100"(2.54mm) centers. 3-Hole Solder Pads One Side Only. 3-hole solder pads (0.28” x 0.080”) for interconnecting multiple component leads. All pad and bus surfaces solder coated for user convenience. No pattern on reverse side, edge contacts only. Convenient easy-to-read hole marking legend on wiring side.
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Product
VPX 6U Image & Video Processing Board - PCIe x8
VP69703
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LinkedHope Intelligent Technologies Co.,Ltd.
Based on AMD Radeon™ E8860, VP69703 is a VPX 6U image & video processing board mainly designed for applications of embedded image & video processing and GPGPU.Implementation of large data exchange of VP69703 with system board through PCIe 3.0 interconnected technology. VP69703 connects with system board by PCIe x8 and supports DirectX 11.1, OpenGL 4.2, and OpenCL™ 1.2. It provides a mature solution for bad working environment, such as vehicle and avionics, and needs high performance graphics and video processing.
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Product
Linear Testfixture for VPC iCon i1 Mass Interconnected Cassette Interface (Cassette Not Included) 4 or 10 Positions Blocks, UUT 586 x 248 mm
MG-03-01
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FEATURES• Linear click system with ball bearings, using gas springs• 10 mm ESD-proof top cover with aluminium reinforcement bars• Steel base cabinet with detachable aluminium back and bottom panels• Detachable interchangeable case system with an 8 mm spring loaded probe protection cover• Base cabinet fitted with a telescopic guide rail and catchTECHNICAL SPECIFICATIONS• Max. number of probes (2000N) 1300 units• Max. PCB height: 60 mm• Linear travel: 12 mm• Max UUT: 586 x 248 mm (wxd)• Outer dimensions: 750 x 490 x 100 x 170 mm (wxdxh1xh2)• Designed for Mass interconnect changeable cassette• Up to a maximum of 8 interface blocks of 160 or 170 signals• All interface blocks can be customized
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Product
Flexible Waveguide
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Flann offers a number of solutions for flexible waveguide interconnect including waveguide-coaxial-waveguide and semi rigid. Traditional flexible waveguide solutions are available on request.
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Product
9050 VXI - 50 Module Solution for VXI cards
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The 9050 VXI Solution is designed for use with VPC's pre-wired interconnect adapters on the top tier and discrete wiring modules on the bottom tier. The receiver opens downward via hinges to give the user access to the instruments in the rack. A microswitch, which comes standard, allows for shut off any power going through the system before removing the ITA. Using a plug and play plate or a flange kit allows for easy mounting of the receiver to any 19” rack system.
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Product
Off-Line Base Test Platforms
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To configure your Base Test Platform, the following parts can be added to the 6TL-19 bare half-rack:– Test Rack Manager, to control the test station.– Power Distribution Unit.– Uninterruptible Power Supply– Industrial PC or NI PXI to control the platform– 19’’ Monitor and keyboard with trackball– VPC Mass Interconnect Receiver (6 or 12 slots)– YAV Modules– Accessories: Beacon, Air inlet Pneumatic kit…– Any 19’ Instrument
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Product
BGA Socket And BGA Adapter Systems
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Mill-Max's BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 1mm, .050" and .8mm grid footprints.
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Product
1149.6 Boundary Scan Feature, GTE 10.00p
K8213A
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Keysight’s Interconnect Plus Boundary Scan 1149.6 feature enables all the tools required to develop and execute this test method on the board under test. Compared to the 1149.1 standards, the 1149.6 standards define test methods for the boundary scan devices that are designed with AC coupled signals or differential nets needed for high-speed operations of the device.
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Product
Probe Card
VC43™/VC43EAF™
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VC43™/VC43EAF™ probe cards offer a larger format version of the popular VC20. In addition to saving time, another advantage of the modularity is the ability to leave the interface in place and simply install the VC43™ topside using Celadon’s twist and lock insertion tool which minimizes the possibility of triboelectric or interconnect issues that can occur during typical probe card changes. The VC43™ can be used for production parametric test, modeling, characterization, and wafer level reliability testing. Cards can be configured up to 104 probes in either single or dual layer with near vertical probes to minimize scrub lengths on pads allowing the VC43s to probe pads as small as 30 microns.
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Product
Test Services
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D-Coax offers RF/Microwave test services for your researchprojects, as well as, production quantities tests. We have available resources and expertise in the high frequency interconnects testing that will benefit your research and products. We will work with you to make your requested tests the most accurate and reliable and we'll complete them in a timely fashion. The following parameters can be characterized or tested to specifications with our test services: Time Domain: Impedance, Impedance profile, rise time, propagation delay, skew and more. Frequency Domain: S21 - Insertion loss, S11- Return loss, S12 - Reverse Insertion loss (port 2 insertion loss), S22 - Reverse Return loss (port 2 return loss) and more.
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Product
Mini Modular, High Density Connector System
H Series
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The modular design of the Smiths Interconnect H Series allow custom configurations from standard off-the-shelf components without the cost and lead-time of custom tooling. The H Series offer a variety of designs to meet specific customer needs for extreme high density signal, power, and coaxial interconnect solutions.
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Product
Attenuator Interconnect Kit, 3.5 mm
11716E
Interconnect Adapter
The 11716E attenuator interconnection kit provides the necessary parts to connect 84904K and 84906K programmable step attenuators in series.
