Interconnects
Links between systems, networks,nodes, equipment, devices, components and circuits.
See Also: Mass Interconnect, Connectors, Cable Assemblies, Interfaces
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Plugbord
4112
VECTOR Electronics and Technology, Inc.
44 Gold plated edge contacts (22 each side) on 0.156"(3.96mm) centers. 3-hole solder pads (0.28” x 0.080”) for interconnecting multiple component leads. Zig-Zag Bus Pattern on wiring side. Zig-Zag Bus Pattern provides access to voltage or ground at alternating hole positions. Continuous ground plane on component side with 0.085” etched clearance area around each hole Row and column legends provided
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Surface Mount Package Emulation
SMT Adapters
Ironwood’s SMT package emulation adapters are often called “surface mount feet” or “emulator bases”. These adapters provide access and interconnections to surface mount lands. Typically, the adapters are soldered to the target board in place of the IC device and provide a pluggable array of pins interface for sockets, probing adapters, package converters, and even board-to-board connections. These adapters are often utilized as a base for many of our probing adapter products. We constantly innovate to provide the most reliable, cost effective interfaces available. For example, many of our PLCC, QFP and SOIC emulation bases use our proprietary shaped solder techniques, replacing expensive, and often fragile, J-lead and Gull Wing leads. Shaped solder parts are easily fluxed and reflowed onto the target system. Our emulator bases can present either a male or female interface at 1.27mm or 1mm or 0.8mm pitch gold plated array pins for pluggable connection.
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Attenuator Interconnect Kit, 2.4 mm
11716F
The 11716F attenuator interconnection kit provides the necessary parts to connect 84904/8M and 84904/6L programmable step attenuators in series.
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In-Line RF Test Station
AP770
ICT, Functional, Hipot, Vision, ISP and RF test with low cost fixtures in a very compact test station footprint Works with PCBs up to 450×550 mm or with palletized devices Space for up to 25 VPC mass interconnect modules or YAV switching units
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4-Port PCI Express
PEX 8716
The ExpressLane™ PEX 8716 is a 16-lane, 4-port, PCIe Gen 3 switch device developed on 40nm technology. PEX 8716 offers Multi-Host PCI Express switching capability that enables users to connect multiple hosts to their respective endpoints via scalable, high-bandwidth, non-blocking interconnection to a wide variety of applications including servers, storage, communications, and graphics platforms.
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Standalone Test System
1000 Series ATE
The Circuit Check 1000 Series ATE provides a configurable standard platform that can utilize multiple mass interconnect interfaces while providing ease of maintenance and the ability to accept a wide variety of test fixture solutions. With the 1000 Series ATE, test procedures become automatic, with test steps and go/no-go limits easily programmable.
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Functional Test Fixtures
Reliable connections to device under test (DUT) test points are essential for robust functional test. Bloomy provides rugged fixtures and cable sets (ITAs) built for thousands and thousands of cycles in manufacturing environments. With the industry’s best mass interconnects and internal electronic keying, our fixtures are easy to change out and are automatically recognized by the test system.
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20-Port PCI Express
PEX 8680
The ExpressLane™ PEX 8680 device is the industry's first PCIe switch to offer 80 PCI Express Gen 2 (5.0 GT/s) lanes, capable of configuring up to 20 flexible ports. The switch conforms to the PCI Express Base Specification, rev 2.0. The 80-lane switch enables users to add scalable, high bandwidth, non-blocking interconnection to a wide variety of applications including servers, communications, storage, blade servers, and embedded systems.
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PCI
PCI is a local computer bus for attaching hardware devices in a computer. PCI (Peripheral Component Interconnect) is part of the PCI Local Bus standard. The PCI bus supports the functions found on a processor bus but in a standardized format that is independent of any particular processor’s native bus.
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Signal Module, ITA, QuadraPaddle, 480 Position, Fully Loaded For Wire Wrap With Anti-Rotation (610 138 122)
510151127
QuadraPaddle modules are molded on .100” (2.54 mm) centers to meet the need for high-density I/O in a compact assembly. Allowing flexible configuration options with standard commercial connectors, QuadraPaddle modules are designed to fit any VPC pin and socket-based Mass InterConnect system. Available in 192 and 480 contact positions, QuadraPaddle modules accept standard .100” (2.54mm) pitch headers, breadboards, and connectors for direct PCB, ribbon cable, and other connections as well as discrete wiring.
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PCIe Cable: x8, 0.5 m
Y1203A
Use to interconnect PXIe and AXIe chassis in a multi-chassis system or to connect a PC host card to a PXIe system module.
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Digital Solutions
Enabling a better, safer and more interconnected world through digital technology and innovation.
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QuadraPaddle Signal
QuadraPaddle contacts are engineered for flexible interconnect options. Rated at 20,000 Cyles Rated at 5 amps continuous (1250 VAC) 2 oz. insertion force Provide 4 reliable points of contact per pin
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USB
The introduction of USB 3.2 and USB4 along with the Type-C connector ushers in a new era of unprecedented performance for consumer electronics that can now utilize this universal interface for power, data and display. Positioned as the primary high-performance interconnect for the next decade, developers are ramping up their USB3.2 / USB4 expertise. From engineering validation to compliance test, trust the experts at Teledyne LeCroy to help ensure product compatibility for next generation USB systems.
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Silver Button Sockets
For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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Test Services
D-Coax offers RF/Microwave test services for your researchprojects, as well as, production quantities tests. We have available resources and expertise in the high frequency interconnects testing that will benefit your research and products. We will work with you to make your requested tests the most accurate and reliable and we'll complete them in a timely fashion. The following parameters can be characterized or tested to specifications with our test services: Time Domain: Impedance, Impedance profile, rise time, propagation delay, skew and more. Frequency Domain: S21 - Insertion loss, S11- Return loss, S12 - Reverse Insertion loss (port 2 insertion loss), S22 - Reverse Return loss (port 2 return loss) and more.
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G2- 2 Module Solution
The G2 offers the reliability of VPC interconnect technology in a compact, high-density two-module package. While simultaneously engaging a wide range of interconnect options in multiple configurations, the G2 provides a rapid alternative to repeated connect and disconnect of individual leads and connectors in a rugged, reliable system.
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Rectangular Connectors
Smiths Interconnect offer a broad range of modular and rectangular connectors. Our modular solutions allow the user to customize, configure and combine signal, Power, Filter High Speed Data (coax, twinax, triax, quadrax, fiber optic) contacts into a single connector.
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Phase Sequence Indicators (Contact Type)
ST-860
Standard Electric Works Co., Ltd
● Three functions in one unit: open phase, phase sequence and motor rotation indication. ● Large size alligator clips for easy clipping onto switch- boards terminals. ● Highly reliable. ● Identifies 3 phase sequence and open phase check.● Ideal for installing conveyor lines, pump systems and interconnected drivers.
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Low Noise Pre-Amplifiers
Low Noise Pre-Amplifier and companion external low noise amplifier (LNA) are used to amplify low level microwave signals. The Pre-Amplifier contains an AC/DC power supply, internal low noise amplifier, and a bias tee to source a DC bias voltage on the RF input connector.To overcome cable loss between the test antenna and the Pre-Amplifier assembly, a remote low noise amplifier (LNA) is mounted directly onto the 10 GHz antenna. A bias tee inside the Pre-Amplifier chassis powers the remote LNA through the coax cable interconnecting the pre-amplifier and the 10 GHz test antenna.
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Standard for Mass Interconnect Performance
TITAN
TITAN sets the standard for Mass Interconnect performance, configuration modularity and long term reliability. TITAN has been designed to offer exceptional configuration flexibility for use with any ATE platform and offers unparalleled I/O density coupled with the widest selection of contact types available for Mass Interconnect.
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PAM analysis upgrade for Signal Integrity Studio, WavePulser 40iX High-Speed Interconnect Analyzer
WAVEPULSER-SI-STUDIO-UPG-PAM
Signal Integrity (SI) Studio uses SDA Expert (SDAX) serial data analysis software options to simplify NRZ or PAM serial data jitter, eye diagram, noise and crosstalk measurement and analysis setup.
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Connectors
Optimized Super SMA Connectors feature a 32 GHz operating frequency, leading the market in precision reflection (VSWR) performance. MegaPhase, with its team of design experts, drives innovation in RF/Microwave connectors and improvement of interconnects supporting aerospace, satellite, military and telecommunication applications. These connectors are Space Qualified.
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Manual Fixture Kit With Mass Interconnect Cassette Interface, Max number of probes (2N) 1000 units, Max UUT 335 x 250 mm (wxd)
CMCSK-02-01
Linear click system with ball bearings, using gas springs.10 mm ESD-proof top cover with aluminum reinforcement bars.Steel base cabinet with detachable aluminum back and bottom panels.Detachable interchangeable case system with an 8 mm spring-loaded probe protection cover.Base cabinet fitted with a telescopic guide rail and catch.
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sbRIO-9860, Non-Enclosed, 2-Port, C Series Vehicle Multiprotocol Interface Module
787325-01
Non-Enclosed, 2-Port, C Series Vehicle Multiprotocol Interface Module - The sbRIO-9860 is a hardware-selectable HS/FD controller area network (CAN) and/or local interconnect network (LIN) interface for developing CAN and/or LIN applications. As part of the NI-XNET product line, the sbRIO-9860 works well for applications requiring high-speed manipulation of hundreds of frames and signals while performing low-level FPGA control and embedded monitoring in the same CompactRIO Single‐Board Controller. Non-enclosed modules are available for OEM applications.
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Interconnect Adapters
Interconnect Adapters funnel wiring from modules to a VXI card. The adapter has removable side, top and bottom plates. Connector cover plates and cable clamps are ordered separately.VPC VXI adapters have been re-engineered to eliminate the need for punching holes in certain manufacturers cards. This design uses a clip that clamps down on the card's existing ejector tabs which firmly fastens the adapter to the card.
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Differential Picosecond Pulse Generators
PicoSource PG900 Series
The fast-transition pulse can stimulate a transmission path, device or network with a broad spectrum signal in a single instant. Such a pulse is very useful for many of the high-speed broadband measurements that we need to make; for instance in time-domain reflectometry, semiconductor test, gigabit interconnect and port test and in radar.
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Time Controller
ID900
IDQ’s Time Controller is an all-in-one device designed for flexibility and it efficiently solves a large number of problems encountered in the laboratory. Its core consists of 4 high-speed (<20 ps precision, 100Mcps rate) inputs and 4 high-speed outputs, interconnected by reconfigurable logic. The Time Controller performs the functions of a number of devices: time-to-digital converter, coincidence counter, delay generator, pattern generator, counter and discriminator. This is complemented by a 10Gbps link to the host computer for fast data transfers, by auxiliary analogue and digital I/O for interfacing with external devices.
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