Defect
other than specified, imperfection .
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Product
Solar Panel EL Tester
EL-2400
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REOO EL-2400 Solar Panel EL Tester is designed for photovoltaic module manufacturing lines, enabling fast detection of cell microcracks and hidden defects during production.
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Product
Ultrasonic Immersion Probes
SONOSCAN I
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The SONOSCAN immersion transducers for Non-destructive Testing (NDT) are mainly used to test metals and plastics for the smallest material defects. For example, binding defects, welding defects or cracks and pores in metal parts can be detected. The powerful, robust ultrasonic probes can be connected to all common ultrasonic testing devices. Due to variable designs and sizes, the immersion probes guarantee optimal use. In addition to ultrasonic standard pobes, we also offer customized transducers according to your individual specifications.
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Product
1μΩ-4kΩ AC Milliohmmeter Low Resistance Tester
TH2521
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Shenzhen Chuangxin Instruments Co., Ltd.
TH2521 AC Milliohmmeter is a high-performance and intelligent tester widely used to test contact resistance, internal resistance and battery voltage. The application of constant current source with 1kHz frequency can greatly eliminate the potential error caused by thermoelectricity on DUT. This meter has the function to automatically detect contact failures on test cable. At the range of 30mΩ, basic R resolution can reach 1μΩ. It is applicable for transformer, inductance coil copper resistance, relay contact resistance, switch, connector contact resistance, wire resistance, PCB line and via reistance dan metal defect detection, etc. In the mean time, signals, such as HIGH, LOW, PASS, can be output through HANDLER interface, thus it is very convenient to be used in automatic production line.
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Product
VisualDetect LCD Voltage Detector / Interface Tester
VDL-01AB
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Hachmann Innovative Elektronik
VisualDetect LCD is an easily operated voltage detector and interface-tester. Its automatic, thorough self-test ensures reliable function. The permanently enabled interface-tester warns against defect interfaces. Additionally the LC-display indicates the measured current [I/A] and frequency [f/Hz]. Thanks to the integrated configuration menu it can be adjusted to switchgears operated below nominal voltage on-site.
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Product
Substrate Manufacturing
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KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
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Product
High Voltage System
HV-2
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International Electro-Magnetics, Inc.
*Tests Power Transformers for Continuity, Ratio and Phase. Applied and Induced Potential and No-load Losses.*14 Conductor Switching Matrix will test 7 individual windings, 13 taps of one common winding or some combination thereof. (10 Amp current limit)*The System Control is Windows/Visual Basic based. Menu screens allow full selection of test parameters and sequence. Low voltage tests can be performed first, allowing defective parts to be rejected without proceeding to time consuming induced Potential dwell routines. Test data labeling and data acquisition software can be easily added to the system.
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Product
Stamped Spring Pin Sockets
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Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Product
MASK DR-SEM
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Our defect review SEM tools perform detailed reviews of minute defects on photomasks.
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Product
Transportation Environment Data Recorder
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For investigation and evaluation of the transportation route by measuring vibration,temperature and humidity on the whole travel.For search of the cause of defects of any expensive freights as shock, fall, temperature or humidity,and location of place and time.For evaluation of vibration durability of the freights or R & D of the most suitable package using the function of tailoring.Specifications
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Product
Ultrasonic Imaging System
USPC 3010
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Ingenieurbüro Dr. Hillger Ultrasonic-Techniques
Detects internal defects in new materials and metals. The wide frequency range up to 35 MHz enables highestresolution. A-, C-, and D-scans can be recorded. The imaging in B-scans is an option.
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Product
Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
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Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Product
Power Line Purpose Tester
LX-221A+
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Shenzhen Lian Xin Technology Co., Ltd.
·Meet UL, VDE, CSA, SAA, T-MARK, KS. IRAM, CCC and other countries’ standards .·Used to test single – ends ,double –ends ,three-ends power supply cords.·Auto and continuous test in COND,Insulation Resistance ,Leakage Current, Line-to-line Hi-pot(inside HV), Leaking copper(outside HV), relative length,·Auto test the fine and detective goods, tested qualified ones can be be ejected by ejector pin and marked , automatic cutting defective products， and alarmed with voice prompt and light,·Provide with RS 232 interfaces, can communicate with PC, easy to upgrade,·Provide personalized customization according to different requirements.
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Product
Ultrasonic Flaw Detector
MFD500B
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Based on ultrasonic principle, digital ultrasonic flaw detector MFD500B with 320*240 TFT LCD, it can test, orient, evaluate and diagnose various flaws such as crack, lard, air hole in workpiece’s interior swiftly and accurately without any destruction. It can be used in Laboratory as well as in engineering filed. With range of 0-9999mm, it can meet the requirement for general defect inspection in manufacturing industry, metallurgical industry, metal processing industry, chemical industry and so on. Low power design with large capacity and high performance lithium battery module, it can be long standby for months. High quality with low price, it is the first choice for the practical economic model for ultrasonic testing equipment.
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Product
Sensor Products: Weld Force Gage
90061
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Model 90061 is a self-contained, portable measurement system which allows auditing of the pinch force generated between the electrodes of resistance spot welders. Resistance welding uses a pair of electrodes to clamp two base metals firmly together prior to and during application of electrical current. Poorly clamped parts result in a defective joint. A correctly clamped assembly aids in reducing the resistance in the joint and allows the current flow to properly heat the base metals to weld the part.
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Product
PXI Fault Insertion Matrix Modules
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All of our fault insertion matrices feature a breakout arrangement that allows faults to be attached to the sensor lines via the Y axis. This includes the breaking of a connection or the adding of a series defect – all of which can simulate connectivity problems in the system. The three pin breakout versions allow the connection to be swapped for a “bad” sensor simulation.
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Product
Terahertz imaging cameras
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The detectors are fabricated with a GaAs high-mobility heterostructure in the standard semiconductor cycle using conventional optical lithography. The imaging sensor is manufactured on a single wafer. That process ensures high homogeneity and reproducibility of the plasmonic detector parameters (pixel-to-pixel deviation responsivity is within a 20- percent range). Each detector unit has a room-temperature responsivity up to 50 kV/W with read-out circuitry and noise-equivalent power of 1 nW/\sqrt{\rm{Hz}} in the frequency range 10 GHz — 1 THz. The detection mechanism is based on excitation of plasma oscillations in a two-dimensional electron system with subsequent rectification. The rectification takes place on special defects made in the electron system.
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Product
Large Calibre Barrel Bore Gauge System
BG20
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Aeronautical & General Instruments Ltd.
The BG20 has been specifically designed to modernise and improve the inspection routines of large calibre barrels. A two-point measuring head is supported in the barrel or chamber by a clear disk which facilitates the angular alignment of the head and the location of a suspected defect.
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Product
Automatic Battery Testers
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T100BT is an innovative, modular battery testing equipment able to combine, on a single test platform, all the tests required to detect any possible defect on battery cells and modules: from defective cell wiring, to geometrical or surface irregularities, to out-of-specs performances.The battery tester is designed for the high-volume production test of battery modules composed by prismatic, cylindrical, or pouch cells, as well in a Lab/NPI version for engineering, prototypes and low-volume battery testing. The complete configurability allows you to equip the tester with the modules and tools you need to test your products, reaching the desired throughput.
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Product
Magnetic Particle Inspection
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Is an inspection method used to identify defects on the surface of ferromagnetic materials by running a magnetic current through it.
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Product
Pre-reflow AOI
Zenith LiTE
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Minimizes Shadow Problems with 4way projectionEasy Programming with parametric approachReal time defect diagnosis and root cause removalrortified 2D features using 9 channel RGB lights100% 3D measurement inspection.
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Product
Manufacturing Defects Analyzer
eloZ1-400
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The eloZ1 Manufacturing Defects Analyzer is an in-circuit tester of the very latest generation, reliably detecting connection and assembly faults on printed circuit board assemblies. The eloZ1-400 is the compact version of the eloZ1. It is particularly suitable if there is only limited space to fit test appliances. The eloZ1-400 can also be used as a mobile test system.
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Product
Open Source Service to Help Secure and Trust Your Software
Community Attestation Service / CAS
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- CAS stores all signatures inside of immudb, the standard for open source immutable databases.- CAS is protected against tampering. All attestation data is integrity-checked and cryptographically verified by the CAS client.- CAS is also protected against MITM attacks. The public key below is checked by every communication.A Software Bill of Materials (SBOM) is a list of components in a piece of software.Like a list of ingredients on food packaging -- where you might consult a label to avoid foods that may cause an allergy -- SBOMs can help companies avoid use of software that may harm their organization.If defects are later found in a specific part, the SBOM makes it easy to locate affected products.
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Product
Sewer Laterals Scanner
ES-38
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The ES-38 is designed for scanning laterals from 3 to 8 inches in diameter. Using Electro Scan's proprietary technology, variations of electricity flowing through the pipe wall, associated with distance measurements, are automatically transmitted to Electro Scan's Smartphone application to record and display defect locations and their relative size.
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Product
High Resolution Microscope For Multi-fiber Connector
D SCOPE MT LWD
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Designed for inspection of MPO connectors, patch-cords or bulkheads, the D Scope MT LWD checks the cleanliness of the connector face and precisely measures the defects on the optical fiber end-faces. Using Deep Learning technology associated with a high-resolution optical bench, the scratch and defect detection thresholds are significantly improved compared to traditional software.
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Product
Leak Testing
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Leak testing is a non-destructive method to verify the presence of a leak in a component or device.It is implemented as a control methodology for monitoring production process and product quality control. Leak tests are used to find out possible leaks due to non-suitable material (porosity, blowholes, cracks), or in the machining process to find out machining errors or defective parts, and ultimately in assembly, to find out missing or defective gaskets, wrong positioning or assembly. The presence of a leakage could jeopardize the correct functioning of the component, device or its life span, and can also be potentially dangerous for the environment and the safety of its user.
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Product
Nano-focus X-ray Inspection System
X-eye NF120
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Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
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Product
Low Frequency Test Systems
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Ingenieurbüro Dr. Hillger Ultrasonic-Techniques
Our imaging low-frequency inspection systems are excellently suited to displaying internal defects with high resolution and high dynamics.
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Product
Electroluminescence Test Systems
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The products of the SolarModule EL-inline family are integrated into a module production line, before lamination, after lamination or at the end directly after the performance measurement. High-resolution cameras provide excellent image quality and allow the automatic detection of relevant defects. A manual evaluation of images is no longer necessary, which means that considerable costs can be saved. Communication to upstream and downstream processes is flexible and can be adapted to all common interfaces.
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Product
Front-end
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With geometries getting smaller, macro inspection becomes both more challenging and crucial for defect-free and high-yield wafer manufacturing. The variety of defects calls for detection optimization, fast screening and categorization of the high volume manufacturing environment, while maintaining high throughput.
