Defect
other than specified, imperfection .
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Product
Defect Inspection Module
EB40
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The Class 1 certified E40 and B40 modules (available separately or combined in one module) can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
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Product
Luminescence Defect Inspection System
INSPECTRA® PL Series
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This system uses luminescent images created using photoluminescence (PL) to perform high-speed, high-sensitivity automatic inspection for crystal defects, cracks, and luminescence defects which cannot be detected with conventional visible light surface inspection!
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Product
Wafer Defect observing instrument
HS-WDI
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Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Product
Defect Inspection Systems
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Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Product
Defect Inspection System
NovusEdge
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The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.
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Product
Solar EL Defect Detector
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Jiangsu Keyland Laser Technology Co., Ltd.
Features: - Reveals invisible defects- Improves line yield prior to lamination- Improves quality and reliability of final product- Exceptional optical resolution in its class- Flexible system configuration for framed or unframed modules testing
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Product
Transistor-Level Defect Simulator
Tessent DefectSim
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Tessent DefectSim is a transistor-level defect simulator for analog, mixed-signal (AMS), and non-scan digital circuits. It measures defect coverage and defect tolerance. Tessent DefectSim is perfect for both high-volume and high-reliability ICs. Tessent DefectSim replaces manual test coverage assessment in AMS circuits needed to meet quality standards such as ISO 26262 and provides objective data to guide improvements in DFT. Tessent DefectSim dramatically reduces SPICE simulation time compared to simulating every potential defect.
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Product
Defect Isolation
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*Traverse through the physical design to trace nets and vias down to the defect location*Utilizes industry standard LEF/DEF design files, scan-based test information, tester fail logs and diagnostic reports to determine and isolate the physical defect location*Enables the user to leverage their diagnostic experience to determine the root cause of the defect*Interactive layout viewer displays scan chains, mapped mismatches of scan cells, layers, nets and subnets with search capabilities(component, net, cell)*Physical XY coordinates are always displayed for components and nets to guide the user through the design to quickly identify suspect sites for FA using techniques like Emission, OBIRCH, LIVA, TIVA, or FIB
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Product
Large Surface Defect Gauge
4D InSpec® XL Surface Defect Gauge
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The 4D InSpec XL Surface Defect Gauge expands 4D Technology’s 4D InSpec product line—they’re the first handheld, precision instruments for 3D non-contact surface defect measurement.
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Product
Ultrasonic Immersion Probes
SONOSCAN I
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The SONOSCAN immersion transducers for Non-destructive Testing (NDT) are mainly used to test metals and plastics for the smallest material defects. For example, binding defects, welding defects or cracks and pores in metal parts can be detected. The powerful, robust ultrasonic probes can be connected to all common ultrasonic testing devices. Due to variable designs and sizes, the immersion probes guarantee optimal use. In addition to ultrasonic standard pobes, we also offer customized transducers according to your individual specifications.
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Product
Software
Interface Analysis
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Surface-mount components warp during the reflow process, and the area where they attach also changes shape during assembly. This interface between components is where solder, paste, and gaps created due to thermal expansion combine to create 100% good products, or defects such as Head-in-Pillow, Shorts, and Opens. Fully understanding that critical interface between surfaces is more important than ever.
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Product
Magnetic Permeability Meter Ferromaster
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Instrument for easy measurement of the relative magnetic permeability µr of feebly magnetic materials and workpieces with a permeability between 1.001 and 1.999. The permeability is measured by touching the workpiece with the probe tip and reading the result from the display. Typical applications are: non-destructive testing of materials, e. g. quality control of stainless steel, material selection for electron-/ion-beam equipment, detection of material defects induced by mechanical or thermal stress.
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Product
Sapphire Defect Laser Probe and Glasses
LP-100
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Easy to use and portable■ low price with long lifetime■ can be used to detect many defects, like micro crack, bubbles, impurity, crystal subgrain■ When the laser go though the crystal, if it is monocrystal the light should be scattering, in macro it should be white.
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Product
Optical Inspection Machine
3D AOI
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3D AOI latest optical inspection machine 1. No part dead angle, 4-way projection, complete measurement 2. Part height measurement, accurate measurement of defects 3. Multi-piece inspection without additional program 4. DLP digital projection, program editable height measurement
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Product
Automated Visual Quality Control System for Lid Assembly
Angara-form
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The automated visual inspection system is designed to identify and reject covers that have defects that have arisen during industrial production, as well as visible defects in the form of black dots or dirt on the surface of the cover.
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Product
Robotic 2D & 3D Vision Inspection
EyeT+Inspect
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EyeT+Inspect is the outstanding 3D device for robotic visual inspection combining robust 3D vision to inspect product shape with fast 2D vision to inspect product surface. EyeT+Inspect optimizes production thanks to automatic and objective removal of defective products from the production line.
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Product
Ultrasonic Testing
Pundit 250 Array
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The Pundit 250 Array brings a quantum leap in the ultrasonic pulse echo testing. A number of unique innovations make the Ultrasonic multi-channel instrument the best and fastest solution for thickness measurements, detecting defects and localizing objects which cannot be easily detected by any other technology. This includes the assessment of thick concrete elements such as tunnel linings as well as pipes and tendon ducts beyond the rebar layer.
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Product
In-Line X-ray Inspection System
X-eye 6200
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Automatically in-line inspect Solder joint defects of PCBA, and other defects on Hidden Components.Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently.Performing X-ray inspection in various production site, integrated with other manufacturing equipements.
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Product
Front-end
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With geometries getting smaller, macro inspection becomes both more challenging and crucial for defect-free and high-yield wafer manufacturing. The variety of defects calls for detection optimization, fast screening and categorization of the high volume manufacturing environment, while maintaining high throughput.
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Product
Automated System for Visual Quality Control of Printing and Marking on Plates
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The automated visual control system (ASVK) is designed to detect defects in the printing of images and markings applied to the blanks of extruded expanded polystyrene during the production of plates.
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Product
Test Management App
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Test Management goes mobile with the new Kualitee App. Now, simply use your Kualitee mobile app to manage your testing activities by viewing multiple projects, creating defects, approve or reject test cases and view your Kualitee Dashboard to get the latest status reports on the defects being reported.
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Product
Magnetic Particle Inspection
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Is an inspection method used to identify defects on the surface of ferromagnetic materials by running a magnetic current through it.
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Product
Inspection System
X-eye 7000B
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Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's significantly reduced and long-term use possible with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Product
Defect Inspection System
F30
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The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
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Product
Testing for Si Solar Cells Using High Performance CCD
EL Imaging Tester
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EL Testing for Si Solar Cells using High Performance CCD. The determination of luminescence (photo emissions) in solar cells is an important characterization tool. Typical solar cells often have defects which limit the efficiency or lifetime of a cell. Many of these defects are visualized with Luminescence Imaging. By using this technique, the manufacturing process can be optimized to produce better cells. Luminescence Imaging takes advantage of the radiative inter-band recombination of excited charge carriers in solar cells. The emitted photons can be captured with a sensitive CCD camera to obtain an image of the distribution of the radiative recombination in the cell. This distribution is determined by the local excitation level, allowing the detection of electrical losses, thus mapping the diffusion length of minority carriers as the emitted light is low intensity and in the near infra-red range, the CCD camera has a high sensitivity wavelength from 900 to 1100 nm with little thermal noise. This CCD camera provides excellent resolution of 1024 x 1024 pixels with a large 1μm pixel size, multi-megahertz readout speed, and robust USB 2.0 connectivity. The EL CCD Camera is the ultimate high-performance CCD camera for electroluminescence and photoluminescence imaging for Photovoltaic (PV) Cells and Modules. This camera combines low noise electronics and optimal sensitivity in NIR.
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Product
Automated Live Fish Measuring System
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The system for measuring and identifying aquatic organisms is designed to measure the linear dimensions and volume of live fish on a conveyor. The conveyor speed can reach 2.5 m / s, that is, up to 5 fish can pass through the installation in one second.The measurement of the thickness and volume of fish is carried out using a specialized camera Sick Ranger D40, which works on the principle of laser triangulation.The camera operation is synchronized with the conveyor movement using the Sick DGS-60 encoder.The industrial color camera Basler Scout scA1300-32gc is used for measuring the linear dimensions of fish (length and width), as well as highlighting characteristic features of different types (color of scales and fins) and possible defects.
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Product
Multi-Layer Analysis for Next Generation PONs
Multi-ONU Emulator
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The NG-PON Xpert multi-layer analyzer is a unique, real-time protocol analyzer for XG-PON1, NG-PON2 and XGS-PON networks and products. The Multi-ONU Emulator introduces a new revolutionary approach for comprehensive testing of an OLT. It enhances the testing with repeatable test scenarios and functionalities that cannot be tested in any other way, including the OLT's ability to handle various ONU models and configurations, error and defect conditions, alarms and traffic loads.
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Product
Automated Excise Stamp Control System
Kama
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The automated control (verification) system of excise stamps allows for blotting accounting of alcohol, dairy and other products (inspection of the readability of DataMatrix, PDF, QR, Barcode and other barcodes of excise or federal stamps) at a speed of up to 20 pcs / s. This visual inspection allows you to quickly identify defects in DM and PDF printing. The recognition system also analyzes gaps and doubles in a sequence of codes. The system has its own mechanism for rewinding a roll with a volume of up to 5000 marks. All types of stamps (old and new, large and small) are supported. Wide range of options for configuring scanning parameters and automatic generation of reports for the EGAIS department. Possibility of manual scanning (by hand scanner).
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Product
Interoperability Testing Services
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Using our decades of knowledge and experience of Bluetooth, markets and products we'll help you deliver products which are free of defects, minimize field issues, lower development costs and reduce time to market. Teledyne LeCroy offers test services to help in all stages of product development from Specification to Market Launch and beyond.
