Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
01 With Soldering Eyelets | 12 Positions | M10 | 2 Wafers
01-2xxx-00/30xx-12-N
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Multi wafer compact selector with 30° detent angle, 6 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
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Product
Universal Edge Finder
BORDO
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No matter what surface condition may be given, our easy to use BORDO detects various edges in incident light and measures their position. The results of the measurement are transmitted with 1/10 mm resolution via a digital or serial interface to a PC or a PLC which now can place the object into the desired position. This makes BORDO being the perfect tool in many lay-down processes such as the alignment of tiles or other pressed goods. Other applications are checks of alignment. BORDO succeeds even under hard onditions e.g. with missing background, if a thickness of at least 5 mm is given. With its lasercross BORDO is fast and simple adjusted. Another ighlight are the selfregulating algorithms , which optimize parameters of easurement while processing.
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Product
Long Edge Wet Film Combs (Stainless Steel)
3238
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Each comb has 24 measurement steps (teeth) providing a more accurate wet film thickness value.
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Product
Edge AI Box
EPC-R5710
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Advantech EPC-R5710 is an AI edge intelligent industrial gateway integrating NXP's high performance of video coding/decoding and AI function. It can provide 2.3-28.3 TOPS NPU AIcomputing power, and support multiple network ports, a variety of industrial interfaces and storage, as well as wireless technologies including 5G/4G,Wi-Fi5/6. It also supports 8-wayMIC array to realize audio and video AI analysis. Integrated cloud collaboration functions.EPC-R5710 supports a variety of PLC data acquisition and industrial protocol conversion. With its high performance and high quality, it is widely used in AI video surveillance, machine vision and industrial data acquisition applications in the fields of security, smart city, smart transportation, smart factory, energy and power.
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Product
Wafer Auto Line Integration
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The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
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Product
Ultrasonic Wafer Scanner
AutoWafer
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Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Product
Edge Mini Server System
UBX-510SL
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Edge Mini Server System with Intel® 13/14th Gen Core™ i7/i5/i3 Series Processor. Built-in an Intel® 13/14th Gen Core™ i3/i5/i7 processor, Support Windows Server 2022 or Windows 10/11. Plentiful I/O ports for various apploications, Supports pre-certified Intel®/NVIDIA® graphics, Advantech DVP, VEGA, and PCIe add-on cards for retail AI applications.
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Product
LED Type Wafer Alignment Sensor Controller
HD-T1
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Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Product
4U Edge AI HPC
AIR-520
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4U Edge AI HPC powered by AMD EPYC 7003 series processor and NVIDIA Certified with RTX™ 6000 Ada Generation. Server grade perofmance powered by AMD EPYC 7003 processor. NVIDIA Certified with RTX™ 6000 Ada Generation graphic card.
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Product
4U 18" Short-Depth Edge Server
HPC-7420+ASMB-977
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4U 18" short-depth edge server with dual 4th Gen Intel® Xeon® CPUs, 4TB DDR5, and 10 PCIe Gen5 slots. Built for massive AI acceleration and HPC.
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Product
SQFlash ER-1 U.2 2.5" SSD (SFF-8639) PCIe/NVMe Gen.4 X4, Edge Grade
SQF-CU2 ER-1
Solid-State Drive
U.2 (SFF-8639) PCIe/NVMe 2.5" SSD, Compliant with PCIe Gen. 4 x 4 interface and NVMe 1.4, AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC, Read-Intensive and Mixed-Use support. Heat-spreading design with thermal solution, SMART and GUI management tool.
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Product
Wafer Inspection System
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JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Product
Signage & Edge Computers UBX-500 Series
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Mini edge servers are designed for compact spaces, efficiently storing and processing large data volumes for local computing and real-time AI.
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Product
Edge AI Compact Box PC With Intel® Core™ Ultra Processor (Series 3)
UNO-258
Box PC
Intel® Core™ Ultra series 3 processors (code name: Panther Lake H) with 25W and 45W TDP supportIntegrated AI acceleration providing up to 180 TOPS total AI performance (120 GPU + 50 NPU + 10 CPU)Xe3 GPU architecture providing up to 2× the graphics performance compared to Arrow Lake-HDual-channel DDR5 SO-DIMM memory supporting up to 128GB (64GB per channel)M.2 E-Key, B-Key, M-Key (supports NVMe) expansion for storage, LTE/5G, and Wi-FiBuilt-in 1000Mbps & 2500Mbps LAN ports with TCC and TSN supportModular I/O board design offering dual LAN or isolated DIO/CANBUS/COM
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Product
2D/3D Wafer Metrology System
7980
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Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
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Product
2U 19” Edge Server with Intel® Xeon® Scalable Silver/Gold Processors for 5G MEC Infrastructure Deployment
MECS-7211
MEC Server
The MECS-7211 Edge Server focuses on the edge of 5G networks to provide an open, white box platform for 5G Open RAN, private 5G networks, and a wide range of 5G MEC applications including smart cities, retail, manufacturing, autonomous vehicles, Argument Reality(AR), virtual reality(VR) and healthcare. The MECS-7211 is designed to meet stringent requirements by delivering a high level of deployment flexibility, reliability, scalability, and carrier-grade processing performance further augmented by hardware expansion. With a 450mm system depth in a small footprint 2U chassis, all I/O front access, wide operating temperature support (-5°C to +55°C), and PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA and QAT adapters, ADLINK’s MECS-7211 is a high performance COTS platform that meets varying application and deployment requirements, and enables customers to focus on differentiating their end solutions.
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Product
Intel® Movidius™ Myriad™-Based Industrial AI Smart Camera for the Edge
NEON-1000-MDX Series
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ADLINK's NEON-1000 Series of industrial smart cameras supports the Intel® Movidius™ Myriad™ X VPU and a range of image sensors, providing users the flexibility to handle a wide variety of applications.
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Product
4U 4GPU High Performance Edge Server With Dual AMD EPYC 9004/9005 Processors
SKY-641E3
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Support all AMD EPYC 9004/9005 family CPU up to 400W TDP24x DDR5 5600Mhz RDIMMSupport PCIe Switch Backplane, Up to 10 FHFL x16, 4 FHHL x8 PCIe Gen48 2.5" NVMe and 2 M.2 2280 NVMe SSD support1 OCP 3.0 PCIe Gen5 x16 NIC support
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Product
2U 19” Edge Server with Intel® Xeon® Scalable Silver/Gold Processors for 5G MEC Infrastructure Deployment
MECS-7210
MEC Server
The MECS-7210 Edge Server focuses on the edge of 5G networks to provide an open, white box platform for 5G Open RAN, private 5G networks, and a wide range of 5G MEC applications including smart cities, retail, manufacturing, autonomous vehicles, Argument Reality(AR), virtual reality(VR) and healthcare. As one of the first NGC-Ready validated and OTII compliant edge servers, the MECS-7210 is designed to meet stringent requirements by delivering a high level of deployment flexibility, reliability, scalability, and carrier-grade processing performance further augmented by hardware expansion. With a 420mm system depth in a small footprint 2U chassis, all I/O front access, wide operating temperature support (-5°C to +55°C), and dual FHFL PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA and QAT adapters, ADLINK’s MECS-7210 is a high performance COTS platform that meets varying application and deployment requirements, and enables customers to focus on differentiating their end solutions.
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Product
Wafer Prober
Prexa
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The latest fully automated 300mm wafer prober. The system offers excellent productivity and advanced functions, contributing to KGD (known good die) testing for advanced packaging.
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Product
Compact DIN-Rail Edge Controller With 11th Gen Intel® Core™ I CPU
UNO-148
Controller
Port isolation for 8 x DI, 8 x DO, 4 x COMSupports M.2 M key 2280 NVMe SSD storage, M.2 B key 2242 storage, 3042/3052 cellular modules, and M.2 E Key 2230 wi-fi modulesDual 2500BASE-T Ethernet supports Time-Sensitive Network(TSN) technologyRemote out-of-band (OOB) power management with Advantech iBMC technologyMicrosoft Azure IoT Edge and Amazon AWS IoT Greengrass certified
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Product
Wafer Prober
Precio octo
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200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
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Product
Multi Access Edge (MEC)
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The 5G future is open and disaggregated. Gain access to Radisys Edge offerings to accelerate time-to-market and reduce costs by leveraging a full cloud-native solution for virtualized or containerized deployment on any COTS hardware and access to a dedicated network services team.
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Product
Wafer Inspection System
INSPECTRA® Series
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INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Product
Edge AI SDK
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A ready-to-use toolkit for efficient LLM tuning, smooth deployment, and scalable edge AI management, built for reliability and rapid innovation.
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Product
Wafer Test
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Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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Product
Wafer Inspection Machine
IV-W2000
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The IV-W2000 is a wafer inspection machine that features on-the-fly scanning and inspection as well as automatic handling of 6/8/12-inch wafers. With the option to have a Chinese language UI, this machine is also known for being intuitive and user-friendly.
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Product
WDXRF Wafer Analyzer
2830 ZT
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The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, the 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
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Product
Production Wafer Level Burn-in
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TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
