Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
WAFER MVM-SEM
E3300 Family
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The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Product
Edge AI Box
EPC-R5710
Edge AI Box
Advantech EPC-R5710 is an AI edge intelligent industrial gateway integrating NXP's high performance of video coding/decoding and AI function. It can provide 2.3-28.3 TOPS NPU AIcomputing power, and support multiple network ports, a variety of industrial interfaces and storage, as well as wireless technologies including 5G/4G,Wi-Fi5/6. It also supports 8-wayMIC array to realize audio and video AI analysis. Integrated cloud collaboration functions.EPC-R5710 supports a variety of PLC data acquisition and industrial protocol conversion. With its high performance and high quality, it is widely used in AI video surveillance, machine vision and industrial data acquisition applications in the fields of security, smart city, smart transportation, smart factory, energy and power.
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Product
Edge AI HPC
AIR-410
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Edge AI HPC powered by AMD Ryzen 8040 series processor with 39TOPS supporting one 3-slot GPU. Ryzen 8040 processor up to 54W with 39TOPS AI computing (CPU+iGPU+iNPU) Dual channel memory up to 96GB DDR5 5600MT/s.
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Product
Wafer Prober
Prexa MS
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The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
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Product
Wafer Sort
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TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Product
Solid Edge
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Maya Heat Transfer Technologies Ltd.
Solid Edge® is an industry-leading mechanical design system with exceptional tools for creating and managing 3D digital prototypes. With superior core modeling and process workflows, a unique focus on the needs of specific industries, and fully integrated design management, Solid Edge® guides projects toward an error free, accurate design solution.
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Product
Production Wafer Level Burn-in
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TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Product
Azure SQL Edge
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Bring the security and performance of the Microsoft SQL engine to the edge with Azure SQL Edge running on ARM64 and x64 architecture. This productivity tool for edge computing combines new capabilities such as data streaming and time series with in-database machine learning and graph features. Develop your application once and deploy anywhere across the edge, your datacenter, and Azure. Get the Microsoft SQL database engine optimized for the edge for as low as USD60 per device.
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Product
Edge Mini Server System
UBX-510SL
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Edge Mini Server System with Intel® 13/14th Gen Core™ i7/i5/i3 Series Processor. Built-in an Intel® 13/14th Gen Core™ i3/i5/i7 processor, Support Windows Server 2022 or Windows 10/11. Plentiful I/O ports for various apploications, Supports pre-certified Intel®/NVIDIA® graphics, Advantech DVP, VEGA, and PCIe add-on cards for retail AI applications.
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Product
Wafer Inspection System
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JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Product
Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Product
Wafer Internal Inspection System
INSPECTRA® IR Series
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An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Product
Edge SRP
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Edge SRP includes different packages of bundled hardware and software which can be used for data collection, edge computing, and data visualization.
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Product
Edge AI System
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Axiomtek designs, develops and manufactures edge AI (Artificial Intelligence) systems to fulfill AI solution-ready system requirements. The AI embedded systems are ideal for smart manufacturing, machine vision, deep learning, edge computing, and much more.
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Product
Wafer Test
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Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
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Product
Edge Grinding Machines
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The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
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Product
AIR Edge AI
AIR-427A
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Edge AI system powered by NVIDIA® IGX Thor™ Powered by NVIDIA IGX T7000™, delivering up to 2070 TFLOPS (FP4-Sparse) inference performance. Powered by the NVIDIA Blackwell architecture iGPU and an optional NVIDIA RTX PRO™ 6000 Blackwell Max-Q Workstation Edition to deliver up to 5,581 TFLOPS (FP4-Sparse).
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Product
Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Product
Edge AI Acceleration Modules
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The EAI series provides low power plug-in AI modules and GPU cards to help accelerate deep learning inference on the edge
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Product
5G Edge Servers
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ADLINK is committed to developing industry-leading edge computing platforms to drive the transformation of communications network architectures, and enable customers to explore new services and business models across various market segments. Validated for NGC-Ready and AWS IoT Greengrass, ADLINK’s OTII-compliant Edge Server MECS series provides a versatile, cost effective and scalable white-box solution to facilitate deployment of 5G RAN and private networks, and enable a wide range of 5G use cases, including 5G DU/CU in open RAN and private networks in smart factory, mining, transportation and more.
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Product
Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
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The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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Product
Compact 2U Edge Server
SKY-821E3
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Compact 2U edge server with dual AMD® EPYC™ 9005/9004 processors, optimized for virtualization, HCI, and edge analytics.
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Product
In-situ Wafer Temperature Monitoring
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CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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Product
8K UHD Fanless Edge Computer
UBX-110H
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The UBX-110H is an 8K UHD fanless edge computer powered by an Intel® Celeron® 6305E or 11th generation Core™ i3/i5/i7 processor. Built-in an Intel® Celeron® 6305E or 11th gen Core™ i3/ i5/ i7 processor, Built-in a TPM 2.0 chip for data encryption enhancement.
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Product
Edge AI Platforms
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ADLINK is committed to delivering artificial intelligence (AI) at the Edge with its architecture-optimized Edge AI platforms. Featuring heterogeneous computing architecture, ADLINK’s Edge AI platforms integrate hardware acceleration in deep learning (DL) workloads, high performance per watt and per dollar, end-to-end connectivity to break down information silos, and industrial environmental compliance for 24/7 operation, generating actionable intelligence required to achieve operational improvements, performance boost, and efficiency gains in manufacturing, transportation, medical, gaming, defense, smart city, and retail applications.
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Product
Semi-Automatic Contactless Wafer Detector
NCS-200SA
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Semi-Automatically, non-contact measurement of wafer thickness, TTV ,bow,Point and flatness.Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.the powerful software can test all the data above within several seconds,all the design according to SEMI standard and the ASTM,make sure the data can be easily unify. the system can used for several sample size,like 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
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Product
Rugged In-Vehicle Edge AI Platform
TREK-60
Platform
Rugged In-Vehicle Edge AI Platform with 8 Channel PoE for In-Vehicle & Harsh Environments. 8ch PoE support for commercial vehicles and heavy duty machinery, In-vehicle specialized design: 12V/24V certified car power (E-Mark, ISO-7637-2), dual CANbus.
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Product
Edge AI Box
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Arm-based edge AI boxes are powered by NXP, NVIDIA and Rockchip. They provide AI inference capabilities in a low-power fanless design.
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Product
Wafer Prober Networking System
PN-300
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The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
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Product
Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
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The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
