SoC
A complete computer "System on a Chip".
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Product
Semiconductor Test System
TS-960e
Test System
The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
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Product
Emulation Adapters
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With some of the more advanced 32-bit microcontrollers and SoCs, the full program and data trace capabilities of the device are not made available on production silicon. Instead, semiconductor vendors provide special 'emulation devices'. These typically feature more pins than the production device, thereby providing the interface to the trace interface.
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Product
SoC Tester
UltraFLEXplus
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The UltraFLEXplus combines new instrument and software capability with a revolutionary tester infrastructure that provides a step-function improvement in throughput and engineering efficiency – all while leveraging the cumulative test IP developed over the UltraFLEX’s 15 year history .
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Product
SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
Computer on Module
The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
Computer-On-Module
SMARC
Computer on Module
SMARC form factor is the only computer-on-module form factor that truly is capable of supporting both ARM and x86 designs. With 314-pins on a high speed MXM3 connector, SMARC can fully cover both typical x86 interfaces as well as typical ARM type low level signals. Using ARM SoCs opens the possibility to leverage the product ecosystem of familiar devices such as tablet computers and smart phones. Alternative low power SoCs and CPUs, such as tablet oriented x86 devices and other RISC CPUs may be used as well.
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Product
Rugged PC Compatible
SYS-427X
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WINSYSTEMS’ SYS-427X is a rugged, fanless industrial computer with the Intel® Apollo Lake-I SOC quad-core processor. Its compact size, low power, and extended operational temperature make it a great fit for rugged embedded systems in the industrial control, transportation, energy, and IIoT markets. In addition to the standard system configuration, three optional configurations are available, adding WiFi 6, CAN Bus, or both.
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Product
FPGA Boards
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For over two decades, Digilent has proudly worked with Xilinx to become a global leader in the design and manufacturing of cost-optimized field-programmable gate array (FPGA) and System on a Chip (SoC) development boards. Optimized for accessibility and flexibility, our control system boards are suited to a wide array of applications ranging from embedded vison and sensor fusion to networking and RF to embedded measurement and control systems. Enjoy high performance-to-price ratio, ease-of-use through onboard peripheral support, extensive documentation and example designs, and an open-source philosophy.
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Product
SMARC Short Size Module With Qualcomm® QRB5165 Series Octa-Core SoC
LEC-RB5N
Computer on Module
- Qualcomm® Kryo™ 585 CPU (8x Arm Cortex-A77 cores)- Qualcomm® Hexagon™ Tensor Accelerator (HTA) running up to 15 TOPS- 4K HDMI/MIPI DSI display, MIPI CSI cameras- 2x PCIe x2 Gen3- 2x GbE Ethernet- 2x USB 3.1/2.0 and 4x USB 2.0- GPIO/SD and UFS- 5VDC +/-5% voltage input
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Product
Ultra-Low Power Computing Module
CM22303
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LinkedHope Intelligent Technologies Co.,Ltd.
CM22303 uses Intel® 7th generation Kaby Lake-Y platform and Core M Ultra low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.6 GHz and the display output resolution can be up to 4K. CM22303 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. SPI BIOS is designed on board to support dual-channel low voltage on board memory (up to 16GB), Gigabit Ethernet, TPM module and other functions. With high-performance and low power consumption, it can be widely used in the field of low power embedded systems. Meanwhile, CM22303 adopts COM Express standard and is compatible with Type10 pin out definition, and also provides rich peripheral interfaces such as USB3.0/2.0, PCIe, SATA, HD Audio etc.
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Product
Rugged COM-HPC Server Type Size E Reference Development Platform Based On Ampere® Altra® SoC
Ampere Altra Developer Rugged
Software Development Kit
The rugged 4U rackmount server platform provides a cloud-native environment for embedded edge development. It can host the SOAFEE (Scalable Open Architecture for Embedded Edge) providing a cloud-native environment for embedded edge development and is compatible with Autoware Foundation's Autoware Open AD Kit. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.
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Product
Qseven V1.2 SoM With I.MX287 454 MHz (Industrial) SoC, 128MB Memory, 4GB EMMC, Gigabit Ethernet, Audio And CAN
Q7M100
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*Ultra low power consumption ARM9*High flexibility Qseven v1.2 compliant design*2 CANBus 2.0B compliant ports*24-bit TTL LCD*Dual 10/100 Base-T Ethernet*Audio
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Product
Intel® 5th Generation Xeon Processor, AMC
AMC752
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The AMC752 is a Processor AMC in a single module, mid-size based on the Intel® 5th generation Xeon (Broadwell). The efficient SoC design has low power consumption and integrated PCH technology. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
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Product
Semiconductor Testers
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Designing and manufacturing scalable Automated Test Equipment (ATE) targeted at testing SOC, MCU, RF PA/FEM, Sensors/MEMS and Power and Analog devices
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Product
TySOM Embedded Prototyping Boards
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TySOM™ is a family of embedded system prototyping boards. Depending on the board, one of three FPGAs will be at its heart: a Xilinx Zynq® UltraScale+™, a Xilinx Xilinx Zynq-7000 or a Microchip PolarFire SoC. The boards are compatible, through industry standard interfaces (FMC or BPX), with Aldec’s wide range daughter cards, making Aldec’s TySOM embedded prototyping boards ideal for the rapid development of applications that include automotive (and ADAS, in particular), artificial intelligence (AI), machine learning (ML), embedded vision, embedded-HPC (including edge-processing), IoT, IIoT and industrial automation.
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Product
PCI Express IP
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Rambus silicon-proven, high-performance PCI Express® (PCIe®) 6.0, 5.0, 4.0 and earlier generation digital controllers are optimized for use in SoCs, ASICs and FPGAs. These market-leading solutions for high-performance interfaces address AI/ML, data center and edge applications.
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Product
3.5" Embedded SBC With Intel® Celeron® J1900 Processor, LVDS/VGA/HDMI, Dual LANs, Audio And ZIO
CAPA843
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The CAPA843, a fanless 3.5-inch embedded board, features quad-core Intel® Celeron® processor J1900 SoC (codename: Bay Trail). A pair of SO-DIMM sockets supports up to 8GB of DDR3L 1066/1333MHz RAM. The compact size embedded board CAPA843 was designed with emphasis on expandability, offering two full-size PCI Express Mini Card slots, as well as an exclusive Axiomtek ZIO connector. With excellent thermal design, the 146 x 102mm embedded SBC can handle operating temperatures from -20°C to 70°C, and runs on +10V to +24V DC input. The 3.5” fanless embedded board provides three display interfaces with dual-display operation: HDMI, LVDS and VGA. The Axiomtek CAPA843 is an excellent choice for applications in IoT/M2M-related, industrial control, self-serve terminal, gaming, digital signage, POS, and kiosk.
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Product
Advanced SoC/Analog Test System
3650-EX
Test System
Chroma 3650-EX is specifically designed for high-throughput and high parallel test capabilities to provide the most cost effective solution for fabless, IDM and testing houses.
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Product
I-Pi SMARC Development Kit based on Qualcomm® Robotics RB5 Platform
I-Pi SMARC RB5
Software Development Kit
The I-Pi SMARC RB5 is a SMARC-based AIoT and robotics development kit harnessing ADLINK LEC-RB5, powered by the Qualcomm® QRB5165 SoC with Qualcomm® Kyro™ 585 octa-core CPU (8x Arm Cortex-A77), and Qualcomm® AI Engine.
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Product
SOC Battery Tester
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This sophisticated battery test equipment allows the battery tester to exercise and explore the battery’s internal profile and produce a true state of charge revealing the batteries true AHR capacity and ability to perform under load.
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Product
SMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor
LEC-iMX6
Computer on Module
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
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Product
Verification IP's
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SmartDV Technologies India Private Limited
We develop Verification Components, leveraging our rich experience in ASIC / SoC design verification and capabilities on high-level verification languages (HVLs). Our verification components are configurable, reusable plug-and-play verification solutions for standard interfaces based on HVL. We currently support SystemVerilog, Vera, SystemC, Specman E and Verilog. All our VIP''s are supported natively in SystemVerilog VMM, RVM, AVM, OVM, UVM, Verilog, SystemC, VERA, Specman E and non-standard verification env.
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Product
Rugged Conduction Cooled 3U CompactPCI Processor Blade with Quad-Core Intel® Atom™ Processor
CT-3620
Processor Blade
The ADLINK CT-3620 Series is a Rugged Conduction-Cooled 3U CompactPCI processor blade in single-slot (4HP) width form factor featuring a quad-core Intel® Atom™ SoC and soldered DDR3L-1333 ECC memory up to 4GB. Graphics is integrated graphics on the CPU and storage is provided by an onboard 32GB SSD. Rear IO signals include 2x GbE, 1x USB 2.0, VGA, 2x COM, and 1x SATA 3Gb/s, providing for expansion with an optional Rear Transition Module (RTM).
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Product
Wireless Networking Systems
ZigBee®
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Silicon Labs is the vendor of choice for OEMs developing ZigBee networking into their products. The Silicon Labs ZigBee platform is the most integrated, complete and feature rich ZigBee solution available a family of Wireless SoCs, based on ARM Cortex processor and 2.4 GHz transceiver, together the most reliable, scalable and advanced ZigBee software and supported by best-in-class development tools.
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Product
Gate-Level Design Optimization
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After logic synthesis, STAR helps reaching power, performance and area (PPA) requirements for complex SoCs is becoming a real challenge. Large design netlists are restructured and optimized to reach aggressive PPA requirements, cost-effectively.
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Product
Xilinx Zynq ARM + FPGA SoM
TE0720
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Sundance Multiprocessor Technology Ltd.
TE0720s are industrial-grade SoC modules integrating a Xilinx Zynq Z020 SoC, a gigabit Ethernet transceiver (physical layer), 8 Gbit (1 Gbyte) DDR3 SDRAM with 32-bit width, 32 Mbyte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged high-speed stacking strips. All modules in 5 x 4 cm form factor are fully mechanically and largely electrically compatible among them. All this on a tiny footprint, smaller than a credit card, at the most competitive price. A free and open embedded development suite with reference designs is included.
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Product
6U VME 1/10/40 GbE Switch
ComEth4070e
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The ComEth 4070e is a cutting-edge 6U Layer 2/3 Ethernet switch for VME64x systems. Powered by the newest Marvell highly integrated system-on-chip (SoC) with programmable packet processors.
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Product
Generates Test Cases on ICE
TrekSoC-Si
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TrekSoC-Si automatically generates self-verifying C test cases to run on the embedded processors in SoCs in in-circuit emulation (ICE), FPGA prototyping, and production silicon. This verifies your chips more quickly and more thoroughly than hand-written diagnostics or running only production code on the processors. TrekSoC-Si's generated test cases target all aspects of full-SoC verification and work in a variety of different environments. TrekSoC-Si is a companion to TrekSoC, which generates test cases for simulation and acceleration. TrekSoC-Si extends the benefits of TrekSoC into hardware platforms.
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Product
SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex®-A9
LEC-iMX6R2
Computer on Module
- NXP SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad processor- Integrated 2D/3D graphics processors, 3D 1080p video processing, power management- Onboard DDR3L-1600 system memory from 512 MB to 2 GB- Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s- Extreme Rugged operating temperature: -40°C to +85°C (optional)- 15 year product availability
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Product
3U OpenVPX FMC Carrier
VF361
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Sundance Multiprocessor Technology Ltd.
The VF361 is a 3U OpenVPX module that leverages on the ALTERA Arria ® V SoC FPGA, ARM Cortex-A9, and Texas Instruments Keystone Multicore DSP technology to provide a high bandwidth processing platform, ideally suited for computation and bandwidth intensive applications such as RADAR, networking, SIGINT, EW, SDR and Video.
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Product
Automotive Infotainment SoCs
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ST’s portfolio of infotainment systems on chips (SOCs) includes a complete offer of automotive-grade devices for a wide range of infotainment systems ranging from turnkey Accordo2 processors for car radio applications and Display Audio systems, featuring smartphone mirroring and support of rear-view cameras, up to powerful Accordo5 multi-core processors with best-in class 3D graphics and video decoding capabilities, to address multi-standard smartphone replication technology as well as Digital Instrument Cluster applications.
