SoC
A complete computer "System on a Chip".
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Product
Demodulators and Tuners
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ST offers standalone demodulation ICs for cable, satellite or digital terrestrial data transmission. Demodulation is also is integrated in many of our multimedia and application processor SoCs.
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Product
PCIe/104 OneBank SBC w. Dual 1GHz ARM9 & 1Gbyte DDR3
EMC²-Z7015
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Sundance Multiprocessor Technology Ltd.
The EMC²-Z7015 is a PCIe/104 OneBank™ SBC with a Xilinx Zynq SoC, Artix-7 FPGA fabric and a VITA57.1 FMC™ LPC I/O board. The main processing power of the EMC²-Z7015 is a Dual Core ARM9 and combined with traditional FPGA fabrics/gates + High-Speed I/O interfaces, like USB2.0, HDMI, 1Gb Ethernet and SATA and provide an total solution for any Embedded Application.
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Product
PANAVIA Modules
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AIM’s PANAVIA test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core design with one processor for real time bus protocol support, massive memory and IRIG-B time code encoder/decoder functions are standard. AIM delivers versions of our modules with extended temperature range and conformal coating. With 8 Tx and 8 Rx channels per module, functions include autonomous transmit sequencing, continuous clock and data transmissions, host controlled double buffering, programmable interrupts, data selection on specific tag identifier, selectable triggers on data and/or tags with full protocol error injection/detection, real time bus recording and time stamping to ensure your bus integrity. Each module is delivered with a Board Support Package (BSP) comaptible to the legacy PCI and cPCI hardware modules.
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Product
Edge AI Inference System
AIR-101
Edge AI Inference System
Edge AI Inference System powered by Intel Atom® E3940 QC SoC and two Intel MA2485 VPUs. Intel Atom E3940 Quad Core SoC turbo burst up to 1.8 GHz. Intel® Movidius™ Myriad™ X VPU MA2485 x 2 Built-in.
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Product
Scienlab BMS Environment
SL101XA Series
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A BMS assumes important safety, control, and regulation functions. Those functions include monitoring parameters such as voltage, current, temperature, and state of charge (SOC). A BMS also regulates thermal management, energy management, cell balancing, and performance.
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Product
JAMMA (J-Series)
DPX-J100
Motherboard
High performance AMD Embedded V & R SOC APUs. Quad and dual core APUs up to 2.6 (3.5) GHz, 25W. Radeon™ VEGA GPU with up to 8 compute units. Up to three independent monitors supported.
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Product
Intel® Xeon™ SoC, PCIe Gen3, 3U VPX
VPX754
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The VPX754 is a processor module (VITA 46) for general purpose processing in demanding applications. Based on the Intel® 5th generation Xeon 4-core, 8-core or 16-core Processors (Broadwell). The efficient SoC design has low power consumption and integrated PCH technology.
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Product
Emulation Platform
Veloce
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The Veloce® Emulation Platform dramatically reduces risk in the verification of today’s complex SoCs and is a core technology in the Mentor Enterprise Verification Platform™ (EVP). Mentor’s software and application solutions and continual enhancements enable a comprehensive verification environment for IP, chip, and system level verification.
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Product
PCIe/104 OneBank Carrier for Trenz SoC Modules
EMC²-DP
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Sundance Multiprocessor Technology Ltd.
The EMC²-DP is a PCIe/104 OneBank™ Carrier for a Trenz compatible SoC Module and has expansion for a VITA57.1 FMC™ LPC I/O board and also has I/O pins, using a 100-way Samtec RazorBeam connectors system. The add-on board, called “Sundance External Interface Connector – SEIC” contains LEDs, RS232, USB2.0, HDMI, 1Gb Ethernet and SATA . The “SEIC” can be customize for individual applications and bespoke connectors.
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Product
PCI Evaluation Board
BCM91125E
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The BCM91125E is a full-length PCI evaluation board with the SiByte® BCM1125H MIPS processor System on a Chip (SoC). The board is designed for software development and developing PCI applications, which require high-performance processors. The BCM91125E can be plugged into a PCI slot in any PC, workstation or server, or can be used as a stand-alone device.
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Product
SMARC V2.0 SoM Evaluation Kit With I.MX8M Quad/Dual 1.5 GHz/1.3 GHz (Industrial) SoC, 4GB Memory, 64GB EMMC, CAN, MIPI CSI/DSI, And HDMI 2.0
SCM180-180-EVK
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*Ultra-Low Power i.MX8M Dual/Quad A53 Core*Single M4 Core*HDMI 2.0a up to 4K*Dual Channel LVDS*MIPI CSI*10/100/1000 Mbps Ethernet*USB3.0, USB OTG*PCIe 2.0*CAN 2.0B*Audio
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Product
3U CompactPCI Quad-Core Intel Atom® Processor X Series Blade
cPCI-3630
Processor Blade
The ADLINK cPCI-3630 Series is a 3U CompactPCI® 2.0 processor blade featuring the 64-bit Intel Atom® Processor X Series SoC (formerly Apollo Lake I) and soldered DDR3L-1600 MHz ECC memory up to 8GB.
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Product
11th Gen Intel® Core™ I5-Based Fanless Embedded Computer
EMP-510 Series
Box PC
- 11th Gen Intel® Core™ i5 BGA SoC processor- DDR4 SODIMM up to 64GB- FHD/4K/8K up to 4x independent displays- 2x GbE, 1x COM, 4x USB ports- M.2 2280 SSD- Wi-Fi 6/LTE compatibility
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Product
Qseven® Standard Size Module with Intel Atom® E3900, Pentium® N4200 and Celeron® N3350 Processor (codename: Apollo Lake)
Q7-AL
Computer on Module
The Q7-AL Computer-On-Module (COM) combines the QSeven® 2.1 standard with the Intel (“Apollo Lake”) Atom® E-series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
Xilinx Zynq UltraScale+ SoM
TE0808-ZU9
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Sundance Multiprocessor Technology Ltd.
The Trenz Electronic TE0808 is an industrial-grade SoC module integrating a Xilinx Zynq UltraScale+, max. 4 GByte DDR4 SDRAM with 32-Bit width, max. 512 MByte Flash memory for configuration and operation, up to 256 MByte HyperFlash, 20 Gigabit transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O’s is provided via rugged high-speed stacking connections.
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Product
Software and Tools
Design and Development
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Created by experts in the Arm architecture, our development tools are designed to accelerate product engineering from SoC architecture to software application development.
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Product
3U VPX SDR Module
VPX3-ZU1-SDR
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Sundance Multiprocessor Technology Ltd.
The VPX-ZU1-SDR from PanaTeQ is a 3U OpenVPX module based on a Xilinx Zynq Ultrascale+ MPSoC ZU6EG/ZU9EG/ZU15EG using JESD204B interface to an Analog Devices AD9371 or AD9375 Wideband RF Transceiver. Available in Air Cooled or Conduction Cooled version (see picture), this module offers incredible capabilities for the developers looking for ruggedized Software Defined Radio applications and targeting the defence/aerospace market. The module can work as stand-alone module or can be the SBC of the VPX system using the power effecient Quad-Core ARM Cortex A53 SoC and the on-board PCIe Gen2 Switch (worldwide unique feature)
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Product
SoC Test System
T2000
Test System
SoC devices require small-lot high-mix manufacturing methods in the present era of rapid generation change. Semiconductor makers struggle with requirements to replace their testers on a 2-3 year cycle. The T2000 addresses their needs by enabling rapid response to market needs with minimum capital investment.
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Product
SoC/Analog Test System
3650-S2
Test System
The Chroma 3650-S2 is specifically designed for high-throughput and high-parallel testing to provide the most cost-effective solution for fabless, IDM and testing houses.
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Product
SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
Computer on Module
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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Product
Computer-On-Module
CM22301
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LinkedHope Intelligent Technologies Co.,Ltd.
CM22301 uses Intel® sixth-generation Skylake platform and Core M low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.1GHz and the display output resolution can be up to 4K. CM22301 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. CM22301 supports up to 16GB dual-channel low-voltage DDR3L memory populated onboard, and up to 64GB on-board solid state disk silicon, as benefit the development of ruggedized products for harsh environment applications.As defined by VITA 59 specification, CM22301 provides up to 6 PCIe lanes, enabling flexible functionality expansions, such as NICs, DAQs, video capture and so on. Meanwhile, CM22301 also provides up to date computer interfaces like GbE, SATA3, USB3.0/2.0, HD Audio, etc. CM22301 uses the same 220pin board-to-board connector and Type10 pin out definition as COM Express.
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Product
Intel® Atom™ SoC E3825/ J1900 Pico-ITX SBC, DDR3L, 24-Bit LVDS, VGA Or HDMI, 1 GbE, Half-Size Mini PCIe, 4 USB, 2 COM, SMBus, MSATA & MIOe
MIO-2263
Single Board Computer
Embedded Intel® Atom™ SoC E3825 & Celeron J1900 up to Quad-Core processor design, DDR3L 1333MHz support up to 8GBIntel Gen 7 DirectX®11.1 support, dual independent display by 24-bit LVDS + VGA or 24-bit LVDS + HDMIFlexible design using integrated multiple I/O: MIOe to approach vertical applications & keep domain knowhowRich I/O interface with 2 COM, 1 SATA, USB3.0, PCIe Mini Card and mSATASupports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
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Product
µHELIX® Test Probes
Series S200, S300, S400, and S500
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Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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Product
Cladding Alignment Splicer
95EA
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OFS-95EA optical fiber fusion splicer is designed with high-speed image processing technology and special precision-positioning technology. It will automatically finish the whole fiber fusion process in 9 seconds by fast mode, and splice loss is lower than 0.02dB for single mode fiber. 3.5-inch LCD, dual CMOS monitors, X and Y axis separately display or simultaneously display, thus different fusion stages can be showed clearly. It is compatible with ITU-T SM/MM/DS/NZDS/ED fiber, and is equipped with 4-in-1 holders and SOC adapter.
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Product
Front Access Fan-Less Micro Computer
AIMC-2000
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Front Access Fan-less Micro Computer, Intel® Celeron® Quad Core J1900/N2807 SoC with VGA/HDMI, 6 COMs, 8 USBs. Intel® Baytrail Platform, Intel® Celeron® Quad Core J1900/N2807 SoC, Fanless Design. One mini PCIe expansion to support full size module.
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Product
UHD Set-Top Box Processors
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ST’s set-top box SoCs bring a world of media into your living room. Our UHD portfolio offers high-end solutions for 4K broadcast content as well as supporting internet media and operator-specific applications.
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Product
ARINC 429 Bus Interfaces
Interface
AIM’s > ARINC 429 test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. The latest versions also support avionics discrete I/O.
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Product
COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs
Express-BD74
Computer on Module
- 4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)- Intel® Xeon® D SoC (up to 16 cores)- Two 10G Ethernet and NC-SI support- Up to 32 PCIe lanes (24x Gen3, 8x Gen2)- GbE, two SATA 6 Gb/s, four USB 3.0/2.0- Supports Smart Embedded Management Agent (SEMA®) functions
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Product
SMARC
ROM-5820
Computer-on-Module
The Advantech ROM-5820 stands as a state-of-the-art SMARC 2.1 Computer-on-Module, incorporating the robust NXP i.MX95 System-on-Chip (SOC). This SOC features an impressive configuration, with up to six Arm Cortex-A55 cores, accompanied by a dedicated Cortex-M7 and M33 real-time processor, and an added Neural Network accelerator. The ROM-5820 provides extensive connectivity options, including USB 2.0, USB 3.2 Gen1By1, 10 Gigabit Ethernet, MIPI-CSI, PCI Express, as well as both a dual-channel LVDS and a 4-lane MIPI-DSI Display interface. These remarkable features position the ROM-5820 as an exceptional choice for a wide variety of embedded applications.
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Product
6U cPCI 1/10/40 GbE Switch
ComEth4050e
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The ComEth 4050e is a cutting-edge 6U cPCI Layer 2/3 Ethernet switch for PICMG 2.16 & VITA 31.1 systems and is powered by the newest Marvell highly integrated system-on-chip (SoC) with programmable packet processors.
