Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
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Product
TDR System
TS9001
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The system accurately analyzes the wiring quality of various leading-edge semiconductor packages such as Flip Chip BGA, wafer level packages, and 2.5D/3D ICs using terahertz technology. It is a TDR analysis system that has the world’s top-class signal quality.
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Product
Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Product
Process & Material Characterization System
TriboLab CMP
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Bruker’s TriboLab CMP Process and Material Characterization System has been designed from the ground up specifically for reliable, flexible, and cost-effective bench characterization of waferpolishing processes. Small R&D-scale specialty system for CMP. Reproduces full-scale wafer polishing process conditions without downtime on production equipment. Provides unmatched measurement repeatability and detail. Allows testing on small coupons for substantial cost savings over whole-wafer testing.
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Product
Machine Vision Computers
AIIS Series
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Advantech AIIS Series are closely aligned with Machine Automation applications such as Automated Optical Inspection (AOI), Wafer Inspection, and alignment inspection which heavily rely on machine vision.
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Product
Process XRR, XRF, and XRD metrology FAB tool
MFM310
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Thickness, density, roughness & composition of films on blanket and patterned wafers. The Rigaku MFM310 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks.
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Product
Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
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The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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Product
CMP
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CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.
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Product
High Voltage 50 Ω Pulse Generator
TLP-4010C
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High Power Pulse Instruments GmbH
*Wafer and package level TLP/VF-TLP/HMM testing*Ultra fast 50 Ω high voltage pulse output with typical 100 ps rise time*Built-in HMM (IEC 61000-4-2) pulse up to ±10 kV*High pulse output current up to ±40 A*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 programmable pulse rise times: 100 ps to 50 ns*8 programmable pulse widths: 1 ns to 100 ns*Optional pulse width extender increases pulse width up to 1.6 µs in 68 programmable steps*Fast measurement time, typically 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurement of complete wafers*High performance and high quality components
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Product
EasyEXPERT Group+ Software (for PC)
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Keysight Easy EXPERT group+ GUI based characterization software is available for Keysight Precision Current-Voltage Analyzer Series. It is available on your PC or the B150xA's embedded Windows 7 platform with 15-inch touch screen to accelerate the characterization tasks. It supports efficient and repeatable device characterization in the entire characterization process from measurement setup and execution to analysis and data management either interactive manual operation or automation across a wafer in conjunction with a semiautomatic wafer prober. EasyEXPERT group+ makes it easy to perform complex device characterization immediately with the ready-to-use measurements (application tests) furnished, and allows you the option of storing test condition and measurement data automatically after each measurement in a unique built-in database (workspace), ensuring that valuable information is not lost and that measurements can be repeated at a later date. Keysight Precision Current-Voltage Analyzer Series provides the complete solution for device characterization with these versatile capabilities.
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Product
Failure Analysis
MicroINSPECT 300FA
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The MicroINSPECT 300FA is an automated wafer inspection tool used for semiconductor wafer failure analysis. Its small footprint, high speed, and low cost relative to its rich features yield a superb cost of ownership and makes this an ideal tool for your fab or failure analysis lab. The MicroINSPECT 300FA combines advanced robotics, wafer sorting, an intelligent wafer inspection microscope together with SiteVIEW Software to produce an integrated failure analysis tool.
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Product
Optical Metrology
YieldStar
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Our YieldStar optical metrology solutions for the semiconductor industry can quickly and accurately measure the quality of patterns on a wafer.
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Product
MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Product
Integrated Couplers/ Harmonic Mixers
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These waveguide bandwidth integrated coupler/mixers are designed to allow phase locking or signal monitoring of compact millimeter wave systems. RF inputs and outputs are on opposite sides of a thin wafer to obtain minimum insertion length. These devices use silicon Schottky barrier beam-lead diodes on a rugged stripline circuit. Nominal coupling value is 10 dB. For coupling values greater than 10 dB, non-directional coupler models are available (consult factory).
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Product
Test Contactor/Probe Head
cBoa
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cBoa™ test contactors and probe heads are the solutions for contacting high-frequency devices for package test or final test at wafer. The robust design and materials of the cBoa probe withstand the rigors of high-volume test by providing longer life and higher yield. The homogeneous DUT side plunger provides longer run times between cleaning and increased probe life.The cBoa features a stainless-steel spring for tri-temp testing and performs in operating temperatures of -55°C to +155°C and bandwidth of up to 35 GHz @ -1 dB.
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Product
Automated Discrete Semiconductor Tester (ATE)
5000E
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Same Proven Technology as all 5000 Series Testers. High Speed Single Test Measure. Capable of Testing Multiple and Mixed Devices. 1KV Standard, 2KV Optional. 1NA to 50A Standard, 100A Optional. 0.1NA Resolution. Complete Self Test. Auto-Calibration. RDSON to 0.1MOHM Resolution. Windows Application Software. Optional Scanner. Optional Wafer Mapping. Optional Curve Trace. MOSFET, IGBT, J-FETTriac, SCR, Sidac, Diac, Quadrac, STS, SBS Transistor, Diode, Opto, Zener Regulator, MOV, Relay. UNDER $23,000.00
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Product
Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
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Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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Product
Dicing And Lapping Systems
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In semiconductor fabrication, clean die separation and smooth surfaces can make all the difference. While these steps might come late in the process, they play a major role in how well a device ultimately performs. Dicing and lapping bring the necessary level of precision to cut wafers into individual dies and polish surfaces so everything fits, functions and holds up the way it should in real world scenarios.
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Product
Batch Wafer Transfer Tools
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Batch Wafer Transfer Tools
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Product
Semiconductor Technology, Micro Scriber + Flatness, Bow, Warp, Curvature, Glass Thickness
FLATSCAN
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Optik Elektronik Gerätetechnik GmbH
Non contact automated 2D- or 3D measurement of warp, bow, slope and surface curvature with software module for calculation of thin film stress (wafer stress) of wafers and glass substrates.
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Product
Wafer Defect observing instrument
HS-WDI
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Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Product
Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
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The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Product
Advanced Probe Card / V type
VC Series
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Japan Electronic Materials Corp.
*Vertical contact Probe Card*No limitation by Pad layout*Large probe area (Suitable for 200mm wafer 1-shot)*Small scrub mark*Suitable for High/Low Temperature Test
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Product
LED Type Wafer Alignment Sensor Controller
HD-T1
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Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Product
Wafer Edge Profile Measurement
WATOM
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WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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Product
ATE Test & Engineering Services
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We can provide a limited scope project or a full turn key solution where we analyze a data sheet and provide a full test plan. Our wide range of ATE test equipment and experienced team can support first silicon debug to release to high volume production for a wide range of products, from Digital to RF, including wafer sort and packaged part testing. Test platforms include Verigy, Teradyne, Advantest.
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Product
Photonics Wafer Probing Test System
58635
Test System
The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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Product
Probe Series
CAPELLA Series
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MPI Photonics Automation is the industry leading provider of turnkey test solutions for the LED / Mini LED manufacturing industry. With more than 10,000 MPI probers installed worldwide, the CAPELLA series of probers have a proven track record of superior performance and reliability. The CAPELLA series probers support electrical and optical characterization of all LED product types (Vertical chip, Lateral chip, Flip-chip) from wafer to packaged die level. Whether you need a high-performance, cost-effective or specialty prober system, MPI PA has the most comprehensive range of LED wafer/chip probers to meet your exacting requirements.
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Product
Metrology System
IMPULSE V
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With tighter wafer-to-wafer and within-wafer uniformity tolerances, integrated metrology systems are in use across various semiconductor processing steps. Based on demonstrated high-resolution optical technology, the IMPULSE V system provides higher sensitivity to thin film residue measurements during the CMP process. The IMPULSE platform boasts the industry’s most reliable hardware with best-in-class reliability and productivity metrics.
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Product
Cantilever Probe Card
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MPI Cantilever Probe Card is widely applied on gold bump and pad wafer testing for display driver, logic, and memory device. MPI’s cantilever probes are the corresponding answer to the demands of fine pitch, small pad size, high speed, less cleaning, multi-DUT, high pin count, and ultra-low leakage requirements. With outstanding craftsmanship, innovative architecture and proven methodologies based on mechanical and electrical simulation/measurement results, making MPI the top cantilever provider worldwide.
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Product
In Situ Process Management
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KLA’s comprehensive portfolio of SensArray® products enables in situ monitoring of process tools’ environments. With wired and wireless sensor wafers and reticles, an automation package and data analysis systems, SensArray products provide comprehensive information for a wide range of wafer and reticle processes. Wafer process equipment manufacturers, IC manufacturers and reticle manufacturers use SensArray data to visualize, diagnose and control process conditions.
