3D
three dimensions.
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3D Automated Optical Inspection Systems
New 3Di Series
To handle today’s rapidly changing market trends, the system can handle complex inspection challenges such as high component mounting density areas containing highly miniaturized parts placed near much larger and taller component. With our new 3D AOI system, you can strengthen quality assurance and increase production efficiency.
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Geometry
EDM Modal Geometry/ODS/Animation is the primary EDM Modal software module, and is required for every EDM Modal system. This option provides fast and efficient structural model generation and full 3D visualization of test and analysis results.
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Micro-CT for material science
Micro computed tomography is X-ray imaging in 3D, by the same method used in hospital CT scans, but on a small scale with massively increased resolution. It really represents 3D microscopy, where very fine scale internal structure of objects is imaged non-destructively. Bruker microtomography is available in a range of easy-to-use desktop instruments, which generate 3D images of your sample’s morphology and internal microstructure with resolution down to the sub-micron level.
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Multibeam Profiler Sonar
MB1350-N
At 1.35 MHz, the MB1350 delivers 3D profile data at levels more akin to a laser line scanner than today' low frequency bathymentry systems. Mountable on Boats, ROVs, UUVs, and Tripods, BlueView's MB1350 is the right tool to take your operation into the next generation of 3D bottom and structure mapping.
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Architectural BIM Modeling Services
Tejjy Inc. is experienced Architectural BIM Modeling service provider in USA. With over 18+ years of experience, and skilled team of BIM architect, engineer and modeler we facilitate customized Revit content/family, floor plan, architectural drawings, scan to BIM, 2D to 3D model conversion, 3D rendering and visualization. We create Revit architectural modeling with customized BIM LOD(100-500) for building design including schematic design, conceptual design development and construction document set.
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3D Optical Microscopy
Bruker is the worldwide leader in 3D surface measurement and inspection, offering fast, non-contact analyses for samples ranging in size from microscopic MEMS to entire engine blocks. Our microscopes are the culmination of ten generations of proprietary Wyko® Technology advances that provide the high sensitivity and stability necessary for precision 3D surface measurements in applications and environments that are challenging for other metrology systems.
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Portable Metrology‑Grade 3D Scanner
Black Series
The HandySCAN 3D | BLACK Series delivers accurate, high-resolution and repeatable results, regardless of the measurement setup quality and no matter the user experience. Featuring dynamic referencing, both the scanner and part can move during measurement and still provide an accurate and high‑quality scan.
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Stylus Profilometry
Dektak®
Bruker's Dektak stylus profilers are the product of over four decades of proprietary technology advances. They provide repeatable, accurate measurements on varied surfaces, from traditional 2D roughness surface characterization and step height measurements to advanced 3D mapping and film stress analyses. Dektak surface profilers have been widely accepted as a superior solution for measuring thin film thickness, stress, and surface roughness and form in applications ranging from educational research verification to semiconductor process control.
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Atomic Layer Deposition Systems
Atomic Layer Deposition (ALD) is a powerful way to build ultra-thin, super-precise coatings, one atomic layer at a time. It’s especially useful and efficient when working with tiny, complex 3D structures, making it a go-to technique in advanced semiconductor manufacturing.
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Non-contact 3D Optical Profilers
LuphoScan platforms are interferometric, scanning metrology systems. They are designed to perform ultra precision non-contact 3D form measurements mainly of rotationally symmetric surfaces such as aspheric lenses.
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Multi-Channel PD System Locator
PDiagnostic Series
Power Monitoring and Diagnostic Technology Ltd.
The PDiagnostic is a portable system that utilizes Ultra-High Frequency (UHF), Acoustic Emissions (AE), High-Frequency Current Transformer (HFCT), and Transient Earth Voltage (TEV) sensors to detect, analyze, and locate the PD signals in real time for a multitude of medium and high voltage electric power equipment.The multi-channel PDiagnostic system locates PD on power equipment down to a meter by utilizing Acoustic-Electromagnetic Combination Location Technique, Time Difference of Signals’ Arrival (TDOA), Partial Discharge Signals Separation (PDSS), and 3D Positioning Technology with PC software included.The system features advanced PD diagnostic capabilities, automatic PD type pattern recognition, and accurate PD location capabilities. The PDiagnostic is an ideal trouble-shooting tool for your PD programs. Severity is determined and maintenance suggestions are provided accordingly.
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Surface Profiler Measurement System
SP series
SP series, high accuracy 3D surface profiler measurement system with white light interferometry.
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MXI Computerized Tomography (CT) Option
The Nordson TEST & INSPECTION µCT inspection option provides Computerized Tomography (CT) functionality to compliment the 2D X-ray investigations on Nordson TEST & INSPECTION X-ray inspection systems. It uses the superior, sub-micron feature recognition 2D x-ray images, that Nordson TEST & INSPECTION X-ray systems always provide, to produce the best CT models for 3D sample analysis, virtual micro-sectioning and internal dimensional measurements. It reduces the number of time-consuming micro-section analyses needed and / or assists in identifying where micro-section preparation and investigation must concentrate. Available with a system order or as retro-fit to suit application and workflow needs.
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High Powered External IP Transmitter
PowerSting
The PowerSting is a series of external high power transmitters (5kW, 10kW, and 15kW) for the SuperSting R8/IP/SP and SuperSting R1/IP/SP. The PowerSting system is a fully programmable constant voltage//constant current source. The PowerSting system comes with an SGS generator and a wireless repeater box, and operates in both wired and wireless modes. The applications of the PowerSting-SuperSting system include vertical electrical sounding, 2D electrical imaging, 3D electrical imaging, 3D offset electrical imaging of a 2D survey line in both manual and automatic modes.
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Multibeam Profiling Software
MB-DataLogger
Teledyne BlueView's MB-DataLogger software provides a powerful tool for multibeam profiling applications. From mission setup to data playback, review, and export, MB-DataLogger gives users full end-to-end mission support. Set up data collection parameters (sonar head range, ping rate, filename identifiers, etc.) for a SmartCore-enabled system prior to deployment, then review bathymetric profiles in a 2D or 3D waterfall display with or without navigation correction post mission. When regions of interest are identified, export batches of data files to georeferenced point clouds to be imported by third-party applications. MB-DataLogger is the software Swiss army knife for your BlueView multibeam profiling system.
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Electronics Design Software
Altium Designer
Professional unified design system, high productivity stress-free environment and native 3D PCB editor. Easily design the most complex and innovative board layouts with advanced and accessible routing tools. Stay at the frontline of innovative technology development with the world's first-and-only support for rigid-flex PCB design.
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CMOS SoC for mmWave 3D Imaging Sensor
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Vayyar chip covers imaging and radar bands from 3GHz-81GHz with 72 transmitters and 72 receivers in one chip. Enhanced by an integrated, high-performance DSP with large internal memory, Vayyar’s sensor does not need any external CPU to execute complex imaging algorithms.
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3D Printer Laboratory
Trialon’s commitment to providing 3D printing services is second to none. Our facility is equipped with state-of-the-art 3D printers that create accurate plastic prototype and end user parts.
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One-Piece Optical Sensor Head
OP
Sciences et Techniques Industrielles de la Lumière
OP series consists of a one-piece optical sensor head for dedicated applications (e.g. long distance).The performance and specifications are dedicated to various applications in the industry.Typically integrated as OEM for measuring 3D shapes, glass thickness, autofocus, OP series fits a wide range of applications.
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Industrial Computed Tomography
TomoScope® L
High Accuracy Multisensor coordinate measuring machine for 3D measurements using the principle of Computed Tomography, in combination with additional sensors (tactile sensor systems, optical sensors)
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SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex®-A9
LEC-iMX6R2
- NXP SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad processor- Integrated 2D/3D graphics processors, 3D 1080p video processing, power management- Onboard DDR3L-1600 system memory from 512 MB to 2 GB- Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s- Extreme Rugged operating temperature: -40°C to +85°C (optional)- 15 year product availability
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3D Automated Optical Inspection System
EAGLE 3D 8800 SERIES
EAGELE 3D 8800 AOI applies 8-way projection for 3Dmeasurements to all models, minimizing shadow effectserrors and performing 100% 2D&3D examinations simultaneouslyin all FOV areas.
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3D-Control FAYb Laser Marker
LP-Z Series
Panasonic Industrial Devices Sales Company of America
The LP-Z Series Fiber Laser Marker features:- Compact Air-Cooled Head- Full 3D Capabilities- 13 And 25 Watt Models- Wide Marking Area Up To 330mm- Economical And Flexible
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Dual HDMI Input Expansion Card
FMC-HDMI
Sundance Multiprocessor Technology Ltd.
The FMC-HDMI extends FMC-compatible FPGA systems with two HDMI Type A input ports. It’s extremely useful for image or video processing applications. One of the ports features a fully-fledged HDMI 1.4 receiver with CEC, HDCP, audio, and 3D TV support. The other port provides cable equalization and buffering for HDMI signals, leaving the decoding up to the user.
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Bond Alignment Systems
With the invention of the world’s first double sided alignment system in 1985, EV Group has revolutionized MEMS technology and set worldwide industry standards in aligned wafer bonding by separating the alignment and bonding process. This process separation results in higher flexibility and universal application of the wafer bonding equipment. The EVG bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG bond aligners accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
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Solid Edge
Maya Heat Transfer Technologies Ltd.
Solid Edge® is an industry-leading mechanical design system with exceptional tools for creating and managing 3D digital prototypes. With superior core modeling and process workflows, a unique focus on the needs of specific industries, and fully integrated design management, Solid Edge® guides projects toward an error free, accurate design solution.
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LED626/620 Goniophotometer For LEDs
Hangzhou Everfine Photo-E-Info Co., LTD
It can measure the luminous intensity data and automatically plot the luminous intensity distribution curve and luminous flux, and the test conditions meet the CIE condition A (far field) or condition B (near field).In addition, the software can provide customers with 3D luminous intensity distribution graphic.
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Stereoscopic Analyzer
Cel-Scope-3D
Can provide stereoscopic 3D monitoring and depth budget analysis at low cost. This allows accurate and comprehensive assessment and QC in a post-production environment. Alternatively it can also be used camera and rig set-up to be done quickly and confidently so that the 3D will be right first time. The Cel-Scope3D can be relied on to ensure your 3D to be pixel perfect and that the depth budget is used to its full advantage without abusing the audience.
