Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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Product
Field Inspections
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MISTRAS Group has evolved into an asset protection industry leader on the backbone of our expansive non-destructive testing (NDT) and field-testing portfolio.
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Product
Wafer Level Test
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Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Product
Wafer Testing
Trio Vertical
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SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Product
Test & Inspection
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Our test and inspection products support maintenance, product quality testing, diagnostics, and quality control. The extensive range of products covers almost any application need you to have.
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Product
Contactless Wafer Geometry Gauge
MX 20x series
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The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
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Product
MPI PA Wafer Probers
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MPI Photonics Automation is the industry-leading provider of turnkey wafer test and measurement solutions. We offer a complete line of high-performance wafer probers designed to address the diverse and complex needs of the Photonics, Optoelectronic, Semiconductor, and Laser industries.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
WAFER MVM-SEM
E3300 Family
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The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Product
Wafer Edge Profile Measurement
WATOM
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WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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Product
Intelligent PCB Inspection
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It uses a proprietary image analysis system based on Artificial Intelligence. Eliminates time-consuming (re)programming of the process thanks to advanced self-learning. Guarantees high efficiency of the error detection process regardless of the type of component or PCB being inspected. Effectively supports decision-making processes in the area of quality control. Fully compatible with every production line. Ideal for high-variability production models thanks to self-configuration.
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Product
Video Inspection Probe
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With today's high data rates and high definition services, connector quality and inspection has never been so important. Research reveals that up to 75% of all optical network failures are attributed to poor connector quality - reduce your installation time and ensure your network is reaching its full potential.The Video Inspection Probe (VIP) application for Anritsu field testing platforms gives operators a safe, easy way to analyze and document connector conditions.
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Product
Wafer Prober Networking System
PN-300
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The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
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Product
Automated Optical Inspection
AV871 Series
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The AV871 Series of AOI solutions from ASC International builds upon the industry leading AV862 Series with the addition of a larger platform to manage oversized boards. Accepting boards as large as 22" x 26", the AV871 Series meets the needs of those companies requiring large board capacity.
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Product
Chip Inspection System
GEN3000T
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GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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Product
WAFER MVM-SEM® E3300 Series
E3310
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The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Product
Defect Inspection System
F30
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The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
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Product
X-ray Inspection System
X-eye SF160 Series
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High-performance Micro-focus Open Tube with 160kV is installed and fine defects of 1㎛ are detectable. High-resolution X-ray image can be gained with world best magnification by installing high-price Open Tube as standard.Dual CT function can be purchased adtionally, and exact location & size of defects can be detected and analyzed with this function.
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Product
Wafer Probe Test System
STI3000
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The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
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Product
Wafer Chucks
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American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Product
PHOTOMASK INSPECTION MACHINE
NEGATIVE FILM
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Negative film and photomask inspection originated from the extensive use of printed circuit boards. Negative films and photomasks are used in large quantities. The early detection method is to use the "inspection light table" for inspection, which requires too much manpower and material resources, and manual testing may be due to eye fatigue and negligence.
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Product
In-situ Wafer Temperature Monitoring
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CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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Product
Digital Inspection Camera
MaxiVIDEO MV108S
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It turns your Autel tablet into a video inspection scope, allowing you to examine difficult-to-reach areas hidden from sight. It is capable of recording digital still images and videos. Includes mirror, hook and magnet attachments.
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Product
Video Inspection Station
VIS300
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Video Inspection Stations are available with?or without on-screen measurement capabilities?and offer?an excellent way to evaluate or test small works or items in?difficult to access locations.? As todays electronic and mechanical systems keep getting smaller, it becomes impossible to test or measure these products with traditional methods. For many applications, from development to production testing, video based inspection can help maintain quality control. Many of these systems are used in labs for development or used in production for testing production samples.
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Product
Article Inspection Solution
ExtraEye
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First article inspection (FAI) in the PCB assembly process is one of the most important steps - left unchecked every mistake from assembly machine setup multiplies into hundreds of incorrectly assembled PCBs. Maximum accuracy in first article inspection is extremely important.
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Product
Inspection System
X-eye 7000B
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Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's significantly reduced and long-term use possible with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Product
Biofuels Testing and Inspection
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Intertek delivers assurance, testing, inspection and certification services to refiners, producers, blenders, distributors, consumers and research institutes across the world.
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Product
Wafer Thickness Measurement System
MPT1000
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Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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Product
Non-Destructive Inspection Equipment
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Non-destructive inspection means that various materials such as metal are "without damaging the object, knowing the presence or absence of scratches on the surface or inside and the degree of scratches, and passing the object against standards such as standards.
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Product
WiFi Inspection Cameras
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WiFi Inspection Cameras generates a local WiFi hotspot (without Internet access) through which video clips and still photos of hard-to-reach or hard-to-see areas or equipment captured by the probe camera can be sent to an app-enabled smartphone or tablet for viewing and sharing. Free apps for iOS devices (iPhones or iPads) and Android devices are available from the iTunes App Store and Google Play Store, respectively. The three WiFi cameras differ in probe length, camera lighting and grip style.
