Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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Product
LED Inspection
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Indicates which LEDs are not working. Checks if all diodes are placed in the correct places. Independently configures a test program for each new LED panel. Fast and effective – 1000 LED panel test takes up to 3 seconds.
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Product
Inspection System
Pixie
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3-D Metrology for automation. Pixie is a standard system for automated optical quality inspection. Pixie can be configured with 2 to 5 servo driven axis movement and the high-speed measurement capabilities make it suitable for inline and stand-alone solutions.
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Product
Wafer Mapping Sensor
M-DW1
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Panasonic Industrial Devices Sales Company of America
To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.
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Product
Optical Inspection
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Typically, in a standard PCB manufacturing facility, there will be a department where people perform inspection of PCBs through a manual processes, such as visual inspection with magnifiers, microscopes, etc...
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Product
Inspection and Maintenance
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Sensors' EMISSIONS INSPECTION ANALYZERS have a long-standing history for exceeding international standards with compact, portable, and cost-effective systems.
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Product
Magnetic Particle Inspection
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Shanghai Xianda Denshijiki Industry Co.,Ltd
Using the "leakage magnetic flux" phenomenon generated from the scratches, the magnetic powder (or fluorescent magnetic powder) of the ferromagnetic material scattered on the surface by magnetizing the specimen is adsorbed to the scratch. Observe this and detect scratches.
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Product
Wafer Prober
Prexa
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The latest fully automated 300mm wafer prober. The system offers excellent productivity and advanced functions, contributing to KGD (known good die) testing for advanced packaging.
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Product
Fiber Inspection & Cleaning
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ShinewayTech Fiber Inspection & Cleaning - Optical Connector Inspector, Wireless FIber Inspection Probe, Cleaning Pen, & more.
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Product
Xray Food Inspection
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FlexXray has developed leading, certified technology and processes to use advanced x-ray technology to inspect products specifically for food companies. Although they look like a TSA line at the airport, our systems are highly customized machines and processes built specifically to find contaminants like metal, glass, wood, stone, plastic, and rubber in food products of all types. What we do is find needles in haystacks – but the needles we find are even smaller than needles in a haystack. In fact, FlexXray can find contaminants down to 0.8mm or smaller.
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Product
3D Inspection Software
Metrolog X4
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Metrolog X4 architecture is designed not only to benefit from current computer and OS technologies (Windows 64-bit, and multiprocessor PCs) that significantly increase the performances and throughput of your Metrology software, but is also aimed at simplifying your day-to-day measurement work. Metrolog X4 is a perfect Point Cloud software able to analyze large data size. High Performances in Point Cloud analysis: Large Data file import (CAD files, Point clouds, ...)
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Product
WAFER MVM-SEM® E3300 Series
E3310
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The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Product
Visual Inspection Software
AdVISE
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R&S®AdVISE visual inspection software automates the process of visually monitoring an equipment under test (EUT) during a test sequence. This eliminates human inattention, ensures reproducible results and simplifies the test documentation. A typical application is EMS testing with R&S®EMC32 and R&S®ELEKTRA test software.
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Product
Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
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The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Product
Fiber Inspection and Cleaning
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Dust - just because you can't see it doesn't mean it's not there. A 1-micrometer dust particle on a single-mode core can block up to 1% of the light (a 0.05dB loss). The only way to know it's clean is to inspect it before you connect it. And if it's dirty, it needs to be cleaned with the right tools or you might just make it worse. Know it's clean with our cleaning and inspection tools.
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Product
Protective Coating Inspection
Kit 5
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A more comprehensive kit than kits 1-4, the Elcometer Protective Coatings Inspection Kit 5 expands the range of instruments available to the protective coatings inspector.
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Product
Wafer Auto Line Integration
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The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
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Product
Inline Wafer Testing
IL-800
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Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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X-Ray Inspection System
TruView™ Fusion
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The quality of your products is paramount to the success of your business. The TruView™ Fusion X-ray Inspection System allows you to "see inside" your products without destroying them, enabling unprecedented understanding of your manufacturing process. The TruView™ Fusion X-ray is the right solution if you are looking for a radiography system to inspect medical devices, printed circuit boards, electronic components, and mechanical parts.
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Product
Video Inspection Scope
BK3000
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• Integrated 8.5 mm high-res imager allows for ease of use and ensures the product is always ready to go. Imager is resistant to dust, dirt, and water ingress for 30 minutes at depths of up to 3 meters.
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Product
Digital Inspection Probes
DI-1000
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The ergonomically designed DI-1000 is Lightel’s all digital video microscope probe. It connects directly to your PC through the computer’s USB2.0 port. Featuring easy single finger focusing, a built-in image freeze/capture button, and detectable resolution to 0.5µm, the DI-1000 package includes our free ConnectorViewTM (standard) software, providing digital zoom, image display, image capture, auto-calibration and basic analysis tools.
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Product
Protective Coating Inspection
Kit 4
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The Elcometer Protective Coating Inspection Kit 4 provides a range of test equipment to help an inspector assess a substrate prior to the application of a coating.
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Product
Operation Support System for Wafer Prober
N-PAF
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N-PAF (Network-Based Prober Advanced Function) is a networking system developed for more effective operation and maintenance of multiple wafer probers. Remote operation helps save on labor on the factory floor. An E10-compliant RAM Analyzer can be used for operation management of the system
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Product
Inspection Cameras
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The inspection camera opens a new view into the insides of machines and systems; whether an endoscope, thermal imaging camera or infrared thermometer - an inspection camera is the ideal instrument for monitoring and maintenance.Due to the flexible control of the endoscope or the visual display of potential damage areas in machines or systems, weaknesses and points of failure can be detected and therefore be prevented. The inspection camera make this possible without the need for complex disassembly.The inspection camera is used by electricians, safety experts, expert witnesses, mechatronics, and mechanics. The inspection camera is also used for apprenticeships and in-service training. An inspection camera can be applied internally as well as at school or at universities for demonstration purposes. With their help, inspections in the industrial sector can be organized considerably faster, more targeted and more cost-efficient. An inspection camera is an important companion in the course of everyday work.
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Product
Contactless One-Point Wafer Thickness Gauge
MX 30x
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The MX30x series are manual one-point Thickness gauges for silicon wafers.
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Product
X-ray Inspection System
RTX-113™
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Glenbrook’s RTX-113 is designed for heavy production environments where X-ray is used to inspect PCBs and assembled PCBs containing advanced components such as BGA, micro BGA, QFN and other devices.
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Product
Wafer Tester
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Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
