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Product
Hybrid Single Site Test Handler
3110
Test Handler
Chroma Hybrid Single Site Test Handler 3110 is a full range ATC (Active Thermal Control) test handler capable of handling device bodies up to 120x120mm with 450kg force load.
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Product
Tabletop Single Site Test Handler
3111
Test Handler
The Chroma 3111 is an automated pick & place handling system ideal for small lot engineering samples and/or NPI test development parts.
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Product
Test Handler
M4841
Test Handler
High-Throughput Device Handler for Volume Production Testing of MCUs and DSPs.
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Product
Test Handler
M4872
Test Handler
Improve Efficiency in High-Volume Manufacturing and Device Characterization.
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Product
Test Handler
M6242
Test Handler
Optimal Test Handler for Mass-Production DRAM, with Double the Throughput.
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Product
6TL36 Inline Handler
AM304
Test Handler
Test handler 6TL36 able to test DUTs inside Faraday ChamberDual line (bypass)
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Product
Test Handlers
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Boston Semi Equipment test handlers are designed for optimum production performance on your test floor.
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Product
Gravity Handler
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State of the art model, which features a high throughput capability, eight sites, and high and low temperature measurements, and meets all high-frequence contact requirements. Complete measures to prevent jamming and lead deformation enable high availability. This model is highly regarded by top users around the world because of its high throughput and high reliability.
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Product
Wafer Prober
Precio octo
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200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Product
Wafer Tester
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Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Product
Wafer Test
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Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Product
WAFER MVM-SEM
E3300 Family
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The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Product
Wafer Level Test Handler
Kronos
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Wafer level test handler for 6/9DOF sensors with real stimulus. Very high UPH capacity and the lowest cost of test (COT). KRONOS is one of the only wafer level test solutions for motion sensors with real stimulus.
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Product
In-Line / Board Handler
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Circuit Check’s in-line board handler fixturing exceed the high performance requirements associated with high-volume production. Circuit Check supports in-line fixturing for all the leading ICT handlers including Keysight 5i, Teradyne TSh Multi-Site, IPTE and Pematech. Circuit Check is the go-to partner for in-line functional test fixtures to speed production throughput.
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Product
High Speed Gravity Handler
MT9928 xm
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This well-established test handler provides field-proven reliability and performance. Its modular and scalable design and variety of options allow configuration of the MT9928 exactly according to the test needs. Easy-access design and easy-to-change conversion kit parts support fast and easy package style changes. The MT9928 has a large soak capacity and features the entire tri-temp range at outstanding temperature accuracy and stability.
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Product
Test Handler
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Test Handler is an equipment that automates the final testing of semiconductor devices. It handles device transportation, controls temperature during semiconductor testing, and sorts devices based on test results.
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Product
High Parallel Test Handlers
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High parallelism test in strip or singulated device batch handling on carriers, WLCSP post singulation test.
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Product
Pick And Place Test Handlers
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Cohu offers a broad range of IC pick-and-place test handling solutions for the automotive, mobile, and computing markets. Our commitment is to provide world-class innovative products that incorporate thermal, vision and factory 4.0 automation options to meet your existing and future IC handling needs.
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Product
Wafer Prober
Prexa MS
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The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
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Product
Wafer Sort
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TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Product
High-Performance Strip Handler
MCT SH-5300
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SH-5300™ high-performance strip handler for testing advanced semiconductor packages, LEDs, MEMS sensors, and traditional ICs. It can handle a vast array of strip and laminate lead-frame sizes. Capable of tri-temp testing -55˚C to +160˚C and ambient testing to +160˚C.
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Product
Production Wafer Level Burn-in
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TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Product
6TL60 Rotary Test Handler
H79006010
Test Platform
6TL60 has been designed according to the 6TL philosophy, following the concepts of flexibility, modularity and scalability, and with the aim of improving production efficiency as well as increase production capacity and reduce costs.The 6TL60 is the best production solution to automate test processes to reduce the cycle time and the footprint used in the manufacturing plan
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Product
Logic Test Handler
M620
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- Maximized Productivity- Handles various device size- Short conversion time- Easy mantenance- Minimized footprint
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Product
Wafer Inspection System
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JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Product
Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.





























