Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
-
Product
Defect Inspection and Review
-
KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
-
Product
Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
-
*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
-
Product
Electronic Inspection Systems
-
Intego's knowhow even makes it possible to identify challenging defects that may be located under the surface. One system is the inspection of chips by means of lock-in thermography, which visually represents the IR radiation intensity signal of electronics. Special lasers and flash lamps generate a very short heat impulse (10 ms) on the chip, which generates a measurable heat flow. In most cases, a resolution of < 1 μm can be achieved.
-
Product
GENERAL INSPECTION MACHINE AFTER SOLDER MASK
-
DVI is a technology of automated optical inspection, which can inspect deep to the difference from semi-transparent layers or semi-reflective layers.
-
Product
Digital Automated Interferometer and Microscope for Surface Inspection
DAISI-V3
-
The ultimate production interferometer for measuring end-face geometry on single-fiber connectors, equipped with a revolutionary «no-exterior-moving-parts» mechanical design.
-
Product
Property Inspection Solution
DJI / IMGING
-
Advanced DJI drone solutions for the P&C Insurance industry. IMGING™ to conduct full roof and property inspections with incredible detail in as little as ten minutes from start to finish, and they’re getting high-resolution, actionable data they can use to make informed decisions. By combining Insurance-focused workflows and patents-pending autonomous flight control technology, IMGING is making roof inspections safer, quicker, and more consistent. It’s deceptively simple, amazingly powerful, and built specifically for Insurance.
-
Product
MultiSite Test sockets and Wafer Level
-
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
