Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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Inspection Kits
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Elcometer offers one of the widest ranges of inspection equipment available. Our products are used across numerous industry sectors. In all cases, there is always a need to undertake a number of specific inspections during quality control assessments - as one parameter can affect another.
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3D Digital Inspection
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Digital stereo 3D imaging is a unique, advanced, stereo image presentation system designed to provide fully interactive real time natural 3D viewing and visualisation with outstanding depth perception.
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Product
NI Vision Builder for Automated Inspection (AI)
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With Vision Builder AI, you can easily configure your vision system. An easy-to-use interactive development environment replaces the complexities of classic programming, making development and maintenance easy without sacrificing performance or functionality.
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Product
Deep Inspection Kit
GRL-KIT-DI20
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The GRL Deep Inspection Kit (KIT-DI20) addresses the gap between expensive, challenging-to-use VNAs and simple functional/continuity tests that are not adequate for high speed interfaces. Now, users without years of signal integrity testing expertise can perform professional measurements with high accuracy to 20GHz with easy-to-use equipment.
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Real-time X-ray Inspection Systems
Ultra-Compact™
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Glenbrook Technologies redefines X-ray Inspection with our smallest JewelBox Micro focus x-ray system yet. With dimensions of just 22”W x 26”L, it’s small enough to fit on a standard desk, in an office or small lab. But it’s big in capabilities with >500x magnification , 5 axis manipulator and advanced image processing. To view our product video, please click below the product image to the right.
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Inspection of Glue Dot Assembly
ScanINSPECT's ADI
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ScanINSPECT provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, high-end AOI systems. ScanINSPECT uses a simple Windows user interface integrated with an automatic table and image-processing unit. This combination allows 100% inspection of adhesive placement on PCBs after dispensing.
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Smart Factory Inspection System
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API, recognizing manufacturing industry’s increasing demand for part measurement automation, with a higher degree of accuracy, has developed its Smart Factory Inspection System with true 6 Degrees of Freedom (6DoF) real-time 3D robotic measurement incorporating its proven metrology technology and calibration components.SFIS can be delivered as a customized integrated solution or as a standard production inspection cell.
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Product
X-ray Inspection Performance
MXI Quadra 7
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Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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Product
Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
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The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Product
Motor Vehicle Inspect Lines Engineer Program
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Foshan Analytical Instrument Co, Ltd.
It is suitable for measurement of motor vehicles equipped ignition engine with max total mass more than 3500kg. Including the dual idle speed method test. Meet the requirement of GB18285-2005"Limits and Measurement Methods for Exhaust Pollutomts from Vehicles Equipped Igintion Eigine under Two-speed Idle conditions and simple Driving Mode Conditions". The system can select the prompt mode of the dirver mode or the prompt mode of lattice screen.
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Product
Protective Coating Inspection
Kit 5
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A more comprehensive kit than kits 1-4, the Elcometer Protective Coatings Inspection Kit 5 expands the range of instruments available to the protective coatings inspector.
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Product
Stand Alone Wafer Sorter
MicroSORT
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The Microtronic MicroSORT semiconductor wafer sorter is designed to maximize throughput while minimizing wafer handling in a user-friendly operating environment. This stand-alone semiconductor wafer sorter enables sophisticated semiconductor wafer sorter routines for up to 4 wafer-cassette platforms. MicroSORT semiconductor wafer sorter reads OCR scribes from the top, bottom, or simultaneously, allowing for enhanced semiconductor wafer tracking and sorting. The MicroSORT semiconductor wafer sorter’s basic functions include the ability to move, compress, randomize, find, align, verify, and split semiconductor wafer lots. With our virtual tweezer mode, an operator can click on wafer icons to move wafers between cassettes, read semiconductor wafers, and swap wafer positions.
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Product
Automatic Flight Inspection System
AT-920DG
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Airfield Technology is pleased to announce the availability ofa new product, the AT-920DG Automatic Flight InspectionSystem.The new AT-920DG system combines the unique groundbasedinspection capability of our original AT-920 with theproven DGPS positioning system and WinFIS flight inspectionsoftware from our larger, dual equipment AT-930DG system.
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Digital Inspection
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The DI-1000 and DI-1000L-PRO inspect fiber optic connector endfaces, providing clear sharp digital images on your Windows® PC. The DI-1000 and DI-1000L-PRO use LIGHTEL's Series 2 Tips and come with a soft case designed to fit easily into a standard laptop case.
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Product
Fixture and Software for Open/Leak Inspection
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In addition to jigs and fixtures for probing conductors and electrode pads, NIDEC-READ provides specialized software for test point selection and log analysis.
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Product
Wafer Analysis Systems
Tropel®
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Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufacturers. The Tropel line of wafer analysis equipment enables measurement of wafer substrates from 2” to 450mm regardless of material type and surface finish.
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Product
Conformal Coating Inspection System
TROI 8800 CI
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The PEMTRON CI Series addresses the limitations of the area of theinspection due to the diversity of wavelengths of the existing UV,and performs a clearly separated area of coating onvarious wavelengths.
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X-Ray Inspection
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X-ray inspection systems are used wherever defects need to be detected by non-destructive means. The spectrum of use is broad and ranges from quality controls for complex assemblies, to the testing of materials for cracks and air inclusions, to foreign matter inclusions and shape deviations. The trend toward miniaturization, higher packing densities, and the relocation of components to the interior of the assembly require precise X-ray inspections that detect hidden defects quickly and reliably. X-ray systems from Viscom are used for the inspection of series assemblies as well as sampling and prototype controls. They take care of typical inspection tasks in concealed areas such as void controls, THT filling level measurements, and HIP inspections. At the same time, the systems reliably determine defect features such as coplanarity and polarity – at high inspection speeds and in a cost-effective way.
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Laser Sherography NDT Sensor for Post-Production Quality Control or In-Field Component Inspections
FlawExplorer
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The FlawExplorer is a laser shearography NDT sensor designed to be used for post-production quality control applications or in-field (in-service) component inspections. Depending on the application, the sensor can be configured with thermal or vacuum (partial) excitation systems and may also be automated. It incorporates the very latest in phase-shifting technology delivering accurate and reliable measurement results through clear and sharp imaging with sub-micrometer displacement resolution.
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Dimensional Inspection
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Initial Inspection Sample Reports (ISIR's)• Production Part Approval Process (PPAP)• Capability Studies• Production Surveillance• Reverse Engineering• Third Party Arbitration• Will Provide Same Day Quotation With Part and/or Print• Immediate Service Available
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Product
Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
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Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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Entry Level GPR System for Concrete Inspection
StructureScan Mini LT
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Geophysical Survey Systems, Inc.
The StructureScan™ Mini is GSSI’s all-in-one GPR system for concrete inspection. This handheld system locates rebar, conduits, post-tension cables, voids and can be used to determine concrete slab thickness in real-time.
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High Precision Angular Positioning, Calibration and Geometry Inspection
LabStandard COMPACT
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Rotary Precision Instruments UK Ltd
Designed for horizontal or vertical applications with a high accuracy angular encoder ensures sensitivity and fine positioning for metrology and precision testing.
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Measuring And Inspection Systems For Extrusion, Injection Molding & Calendering Of Plastics And Films
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Measuring and inspection systems from Micro-Epsilon are used in the plastics processing industry in order to ensure efficient production.
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Product
X-Ray and CT Inspection
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Systems offer a microfocus X-ray source, a large inspection volume, high image resolution and is ready for ultrafast CT reconstruction. They cover a wide range of applications, including the inspection of plastic parts, small castings and complex mechanisms as well as researching materials and natural specimens.
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Product
Wafer Thickness, TTV, Bow and Warpage
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ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
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Solder Past Inspection
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From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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Product
IoT Data Inspection App
Data Explorer
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he Application Data Explorer allows you to easily explore, aggregate, and analyze historical data across all of the devices in an application. The data explorer can be accessed through the "Data Explorer" link in the Application navigation bar: control the time range, resolution, and aggregation of the data. determine what devices and attributes we are gathering data from. displays the data in various ways (in graph form, in table form, or in aggregation form)
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Product
RFID Label Inspection System
Eurotech RFID FS
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The Eurotech RFID FS RFID accurately rewinds rolls of RFID labels and validates their receptivity by running them through the Voyantic Tagsurance RFID inspection system. The unit allows stopping at a predetermined editing spot for the removal and replacement of the defective piece, as well as indicating defective labels by a mark printed by an inkjet system integrated with the machine. Adjustment of the closed loop tension control system can be made through adjusting the parameters on the software that control the servo motor control system. This gives the customer a virtual infinite range with which to wind their labels without cracking the inlay or antenna. As well accurate web adjustment and guidance is provided with a web guide system complete with an ultrasonic sensor. The Eurotech RFID FS RFID label inspection system is equipped with the Voyantic Tagsurance for testing the performance of RFID tags. This is done by verifying that the tag responds to commands on its whole operational frequency range, which means testing the tag on multiple frequencies, also outside the RFID reader frequency. Accurate power output combined with the Voyantic Snoop Pro antenna, optimized for testing tags inline at high speed, allows defining precise acceptance criteria and achieving stable quality.
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Product
Wafer Thickness Measuring System
WT-425
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Contact type can measure any materials within 0.2 µm (2 σ at 20℃ ±1℃). The wafer floats positions while measurement points change and it does not damage even thin wafers. Best for the process control of compound wafers and oxide wafers. (SiC, GaN, LT, Sapphire and Bonded Wafers)
