Mini Bump Probe F07537S030P300HP

1167099 - FEINMETALL GmbH

The Mini Bump Probe F07537S030P300HP (item number 1167099) is designed for precise contacting of very small, densely spaced mini bumps on printed circuit boards. Its tip style 37 (4-point crown stepped) with a tip diameter of only 0.3 mm focuses the contact on the individual bump and reduces the risk of touching adjacent structures at the same time. With a pitch of 1.90 mm / 75 mil and 300 cN spring force, F07537S030P300HP combines a compact contact geometry with defined mechanical loading. The continuous-current rating is 4 A. In this P/HP version, Progressive Coating and increased spring preload work together so that F07537S030P300HP is suited to difficult contacting conditions involving OSP, flux residues or contaminated test points.