Burn-In Sockets
See Also: Test Sockets, Burn-In, BGA Test Sockets
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Embedded System supporting FHFL dual-width PEG slot with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-4000 Series
- NVIDIA® Quadro® PEG card support- 8th/9th Gen Intel® Core™ i7/i5/i3 processor- Dual SODIMMs for up to 32GB DDR4 non-ECC memory (dependent on CPU)- 1x DVI, 1x HDMI, 1x DP (from CPU), additional display outputs from PEG cards- 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module- 300W/500W Flex ATX PSU
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Lo-PRO®file Collet Socket with Wire Wrap Pins
Series 503
LO-PRO file Collet Sockets with Wire Wrap Pins. Features: LO-PRO file Collet Sockets are available with solder tail or wire wrap pins. Consult Data Sheet No. 12011 for solder tail pins. Choose from several sizes and plating options.
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Electric Burn-in Board Carts
Conforms to SEMI ergonomic standards Holds and transports card cages for semi-automatic loading/unloading. Holds up to 10 burn-in boards. Raises and lowers the burn-in boards for easy loading/unloading of boards into ovens or onto test benches. Cart can be adapted to dock with any Micro Control oven.
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ATX Industrial Motherboard With LGA1150 Socket Intel® Xeon® E3-v3 Processor, Intel® C226, ECC DDR3, USB 3.0, SATA 3.0, Dual LANs, DisplayPort/DVI-I/HDMI And CFast™
IMB210
The IMB210 is an advanced ATX industrial motherboard based on the 4th Generation Intel® Xeon® E3/ Core™ i7/i5/ i3/ Pentium®/ Celeron® processors (codename: Haswell) in LGA1150 socket with Intel® C226 PCH. The optimized IMB210 is specially designed for workstations through better computing and visual performance ideally used in every major industry for tasks ranging from financial modeling to designing complex buildings and vehicles. With its built-in Intel® HD Graphics P4000, this industrial grade motherboard delivers great 3D visual performance with triple display capability through DisplayPort, HDMI and DVI-I ports demanded by professional-grade CAD and media/entertainment fields. In addition, the IMB210 supports Intel® Turbo Boost 2.0 technology, Intel® Hyper-Threading technology, Intel® HD Graphics with DX11 support, 3-D Tri-Gate transistors, 32 GB ECC DDR3 1600/1333 memory, and PCI Express 3.0 x16 slot. It also features Intel® Active Management Technology 9.0 (iAMT), Trusted Platform Module 1.2 (TPM), SATA RAID, as well as PCIe x4 expansion making it ideal for applications with added security features.
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Socket Wrench Torque Sensor Reaction Type
SWS SERIES
Our SWS Series reaction type socket wrench torque sensors are available in ranges from 10 ft-lbs. through 1000 ft-lbs. and provide accurate measurements of bolt or nut wrenching torques. These sensors are bi-directional so both tightening and break-away torques can be measured. These low cost sensors deliver high accuracy and outstanding frequency response. alibration of mechanical torque wrenches may be performed with this sensor. The sensing element incorporates bonded foil strain gages of the highest quality.
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Test Sockets
MEMS Device
Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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Open Pluggable Specification (OPS) Digital Signage Player With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® H110
OPS500-501-H
The OPS500-501-H is an OPS compliant digital signage player supporting dual displays with 4K at 60Hz resolution. The smart cableless open pluggable digital signage module is powered by the latest 7th/6th generation Intel® Core™ and Celeron® processors (codename: Skylake) with the Intel® H110 chipset, providing outstanding performance at a lower cost. It supports LGA1151 socket-type CPUs to offer greater flexibility for CPU selection. In addition, the OPS signage module has one 260-pin DDR4-2133 SO-DIMM socket with up to 16 GB memory capacity. The high-performance OPS500-501-H is a perfect solution for multi-display applications in airport information board, shopping mall, corporate, education, hospitality, religious organization, bank, retail store, restaurant, performing art center, and many more.
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Embedded Motherboard supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
AMSTX-CF Series
Embedded graphics enables system developers to boost the performance of a wide range of workloads, including medical imaging, image analysis, compute acceleration, and artificial intelligence (AI). Leveraging graphics processing units (GPUs), embedded graphics can be used to increase application speed and accuracy, as well as decrease latency. Many embedded system developers are using embedded graphics solutions in real-world applications, such as medical, manufacturing, and traffic management, along with other embedded segments.
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Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, HDMI, DVI-D, VGA, 8-CH PoE, 6 USB And 24 VDC
eBOX671-517-FL
The eBOX671-517-FL supports 8-port Gigabit PoE and able to work under harsh temperatures. Its eight Gigabit PoE ports allow multiple cabling to cameras and any PoE power device; and, the eBOX671-517-FL is specifically designed for security surveillance, optical inspection, and edge computing applications. This rugged NVR embedded box PC is powered by the 7th/6th generation Intel® Core™ (Kaby Lake/Skylake) or Intel® Celeron® processors with a 35W/65W TDP and comes with Intel® Q170 chipset. The eBOX671-517-FL comes in great expansion possibilities, including a flexible I/O module slot with a wide selection of PCIe Mini modules and four PCI Express Mini Card slots. It also has two front-accessible SIM slots and four SMA-type antenna connectors. For storage, this high performance fanless embedded system has two SATA HDD drive bays with a height of up to 15 mm and one optional mSATA for RAID 0 and 1. Moreover, the embedded device supports two non-ECC 260-pin DDR4 SO-DIMM slots for up to 32GB of system memory.
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Custom Test Connectors and Sockets
Custom test sockets are traditionally expensive to build and maintain. To reduce these costs, consider: Using rapid prototyping techniques to build a housing. Using replaceable Z-Axis Connectors. Depending on board layouts and compressed height, these sockets or test fixtures can achieve high numbers of mate/de-mate cycles and operate at GHz frequencies.
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Mini-ITX SBC With LGA1151 Socket 6th/7th Gen Intel® Core™ Processor, Intel® H110/Q170, HDMI/DisplayPort/VGA/LVDS/eDP, Dual LANs And USB 3.0
MANO500
The MANO500 is based on the new 14nm 7th/6th generation Intel® Core™ i7/i5/i3 and Pentium® processors in the LGA1151 package. Featuring the new Intel® H110 Express chipset with DDR4 2133MHz memory support, this motherboard is built to perform. Its three SATA 6G ports, four USB 3.0 ports, and two RS-232/422/485 ports provide robust storage and I/O options. Users also can increase board functionality with PCIe x16 slot and PCI Express Mini Card slot. The high quality MANO500 allows the connection of up to four display interfaces via HDMI, VGA, DisplayPort, and LVDS/ Embedded DisplayPort (eDP), making it an ideal solution for gaming, workstation, digital signage, medical and other IoT&M2M applications.
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Module Accessory Kit, Quantity 26 4-40 x .560" Socket Head Cap Screws
510109303
Module Accessory Kit, Quantity 26 4-40 x .560" Socket Head Cap Screws
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Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3200-CF Series
- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support
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Open Pluggable Specification-Plus (OPS+) Digital Signage Player With LGA1151 Socket 8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q370 And TPM 2.0
OPS700-520
The OPS700-520 is an Open Pluggable Specification Plus (OPS+) digital signage player. The high-performance signer player is powered by the high-performance LGA1151 socket 8th generation Intel® Core™ i7/i5/i3 and Celeron® processors (codename: Coffee Lake S) with the Intel® Q370 chipset. This OPS+ digital signage module supports Trusted Platform Module (TPM) 2.0, Intel® Active Management Technology (Intel® AMT) 11.0 as well as Intel Unite® solution for content sharing and collaboration. It comes with two 260-pin DDR4-2400 SO-DIMM sockets that can provide system memory of up to 32GB. The Coffee Lake S-based OPS700-520 offering future-proofed flexibility and performance is among one of the most advanced and powerful digital signage players in the market.
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Qualification Hardware & Sockets
Reltech Limited holds over 35 years’ experience in the design and manufacture of all types of qualification test hardware. Our advanced technology products include: HTOL Boards (Mother and Daughter cards) Burn-In Boards HAST Boards THB (humidity) Boards Burn-In Modules and frames Dynamic Driver cards (Digital, Analogue and Mixed signal) Back Planes Voltage regulator cards Custom electro-mechanical assemblies DUT Cassettes and test Fixtures
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Fanless Embedded System With LGA1150 Socket 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H81, 2 HDMI/ VGA/ DisplayPort, 2 GbE LANs, USB 3.0, CFast™ And PCI Express Mini Card
eBOX635-881-FL
The eBOX635-881-FL supports the 4th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® processor with Intel® H81 chipset. The super light yet compact eBOX635-881-FL comes packaged in an IP40-rated aluminum and cold-rolled steel enclosure and is designed to operate at temperatures ranging from -20°C to +50°C for use in the extremely environments. The fanless embedded system supports six jumper-less RS-232/422/484 and sixteen DI/DO ports along with three display outputs of two HDMI, DisplayPort and VGA for applications used in transportation, POS, kiosk, industrial control automation and medical equipment. Two PCI Express Mini Card slots are added to the system for greater expansion capability. One SIM slot is also available for 3G/4G, GPS, Wi-Fi and Bluetooth applications, allowing for more efficient networking options.
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Laser Diode Burn-In Testing
Laser reliability testing consists of a series of tests that laser diodes can be put under in order to ensure their reliability for post-production use. There are different types of tests that can be carried out and there are multiple measurements that can be taken in order to evaluate the reliability of the device. One of these tests is laser diode burn-in.
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2U Rackmount Network Appliance Platform With Dual LGA2011 Socket Intel® Xeon® E5-2600 V3/v4 Family Processors, Intel® C612 And Up To 42 LAN
NA850
The NA850 offers cutting edge performance for networking applications with dual high performance 12-core Intel® Xeon® E5-2600 V3 series processors and Intel® C612 chipset, 16 high bandwidth DDR4 memory slots and two hot swappable 3.5” SATA HDD bays. For greater flexible and easy maintenance, the NA850 can be fitted with up to five Ethernet modules, supporting up to 42 Gigabit LAN ports or 20 10GbE LAN ports. Two PCIe x16 standard expansion slots are available for optional network security cards. The superior network appliance platform also supports the Intel® Data Plane Development Kit (Intel® DPDK), a set of software libraries that can improve packet processing performance by up to ten times. It could achieve over 80 Mbps on a single Intel Xeon processor and double with a dual-processor configuration. With its friendly design and high capacity, this powerful network appliance is suited for IDS/IPS, VPN, content filtering, UTM, network security applications, and cloud computing solutions.
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Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3000
- Medical grade computer compliant with IEC 60601-1:2005 + A1:2012 + A2:2020 (3.2 edition) / IEC 60601-1-2:2014 + A1:2020 (4.1 edition)- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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Universal SOIC ZIF (Zero-Insertion-Force) Test Socket
Series 547
Universal SOIC Zero Insertion Force Test Socket. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC gull-wing and J-lead devices, up to 44 pins on .050 [1.27] lead pitch, body widths from .150 to .600 [3.81 to 15.24].
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Silver Button Sockets
For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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Burn-in Board Continuity Tester
CT-1
Burn-in Board Coninuity Tester. Verifies burn-in board continuity and component tolerances. 768 I/O channels, can be forced to the constant current source or grounded independently. Highly accurate measurement of resistance, voltage, and capacitance using a pair of precision instrumentation amplifiers.
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Mini-ITX SBC With LGA1150 Socket Intel® Xeon® E3-v3 And 4th Gen Intel® Core™ Processor, Intel® C226, HDMI/DisplayPort/VGA/LVDS, Dual LANs And USB 3.0
MANO882
The MANO882 supports Intel® Xeon E3 series, 4th generation Intel® Core™ i7/i5/i3 processors and Celeron® processors with the Intel® C226 chipset. Two SO-DIMM sockets onboard support up to 16 GB of DDR3-1333/1600 system memory. The outstanding motherboard sustains HDMI, DisplayPort, VGA and LVDS with triple-display capability, making this system board an ideal solution for digital signage, optical inspection for machinery, and industrial automation and control fields. In addition, the embedded board supports Intel® AMT 9.0 security technology to provide complete protection against viruses and attacks. Additionally, the MANO882 is equipped with an Infineon TPM 1.2 security chipset to enhance user data protection.
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Socket Tester
Shenzhen UYIGAO Electronic Technology Co., Ltd
*It tests your protection system to ensure the household electrical safety.*Widely used in the school, laboratory, factory and other social fields.
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4-slot Fanless Industrial System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, Front-access I/O, PCIe And PCI Slots
IPC964-512-FL
The IPC964-512-FL is a 4-slot fanless barebone system with modular design and optimized expandability. The rugged industrial PC supports the high-performance 7th/6th generation Intel® Core™ and Celeron® processors with the Intel® Q170 chipset. The IPC964-512-FL features dual DDR4-2133 SO-DIMM slots with up to 32GB memory. For easy cabling and maintenance, the IP40-rated embedded system features a wide choice of front-accessible I/O interfaces, including two Gigabit LAN ports, four USB 3.0 ports, one VGA, one HDMI, one audio (Mic-in/Line-out), and three optional I/O modules - a 4-port isolated RS-232/422/485 module, an isolated 8-in/8-out DIO module, and a 2-port isolated RS-232/422/485 and 4-in/4-out DIO module. The compact industrial PC also provides four flexible PCI/PCIe expansion slots with three different combinations of expansion kits: one PCIe x16 and one PCIe x4; one PCIe x16 and one PCI; and two PCI. Additionally, it has a full-size PCI Express Mini Card slot for 3G/4G, GPS, Wi-Fi and Bluetooth connections, and comes with two easy-swappable 2.5” HDD trays for storage. To fit various industrial environments, the rugged modular industrial PC supports 24VDC (uMin=19V/uMax=30V) power input with a lockable terminal block-type connector and a wide operating temperature range of -10°C to +60°C.
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Socket Saver
4690
The Technobox PMC Socket-Saver permits cost effective volume testing of PMC modules when used with Technobox P/N 3390 ?PMC to PCI adapter for Test.? It may also be used to reduce wear and tear on Technobox P/N 1518/1523 (?Extender/Preprocessor?).
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2U Rackmount Network Appliance Platform With Dual LGA3647 Socket Intel® Xeon® Scalable Processors, Intel® C621 (Purley) And Up To 66 LAN
NA860
The NA860 offers a perfect mixture of performance, flexibility, and durability with server-class dual LGA3647 socket Intel® Xeon® Scalable processors and Intel® C621 chipset (codename: Purley). It is robust and highly reliable for use in a wide range of network applications such as SDN, NGFW, IDS, IPS, UTM, etc. Designed with flexibility in mind, the 2U rackmount network computing system is capable of managing numerous connected computers through an integration of up to eight expandable NIC modules which support a maximum of 66 LAN ports. These NIC modules feature support for copper, fiber, bypass, 1G/10G/40G Ethernet speeds, and hardware acceleration. The NA860 comes with twelve high-capacity DDR4-2400 R-DIMM slots with up to 384GB non-buffer non-ECC/ECC memory. Moreover, there are two hot-swappable 2.5-inch SATA HDD trays, one mSATA slot and one optional 3.5-inch SATA HDD tray for sufficient storage. Two PCIe x8 expansion slots are available for add-in cards.
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ATX Motherboard With LGA1151 Socket 8th Gen Intel® Core™, Xeon® E Processor, Intel® C246, USB 3.1 Gen2, SATA 3.0, PCI Express Mini Card Slot, VGA, DisplayPort, DVI-D, And HDMI
IMB525
*LGA1151 socket 8th gen Intel® Core™ i7/i5/i3, Xeon® E, *Pentium® or Celeron® processor (Coffee Lake)*Four 288-pin DDR4-2666/2400 ECC DIMM for up to 64GB of memory*DisplayPort, DVI-D, HDMI and VGA with triple-view supported*6 SATA-600 with RAID 0/1/5/10*1 PCI Express Mini Card slot (optional)*2 USB 3.1 Gen2 and four USB 3.1 Gen1*TPM 2.0 supported (optional)
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Burn-In Boards
Manufacture of burn-in boards since 1976. Established for more than 40 years in the market, Trio-Tech is recognized and is an approved global supplier to all major semiconductor companies. Trio-Tech has the capability to design and manufacture boards for all system types, with solutions available for many test conditions, Including HTOL, PTC, HAST and 85/85.
