Burn-In Sockets
See Also: Test Sockets, Burn-In, BGA Test Sockets
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Product
Fanless Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, Vision I/O, 4-CH PoE And 4-CH LED Output
MVS900-511-FL
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*Integrated real-time vision I/O**4-CH trigger input**4 trigger output**4-CH LED lighting control**2-CH quadrature encoder input**16-CH isolated DIO*Supports camera interfaces**4 IEEE802.3at GbE LAN ports (PoE)*Power input: 24 VDC (uMin=19V/uMax=30V)*-10°C to +60°C operating temperature range with W.T. SSD*Supports 2 swappable 2.5" HDD*Supports TPM 2.0 function
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Product
2U Rackmount Network Appliance Platform With Dual LGA2011 Socket Intel® Xeon® E5-2600 V3/v4 Family Processors, Intel® C612 And Up To 42 LAN
NA850
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The NA850 offers cutting edge performance for networking applications with dual high performance 12-core Intel® Xeon® E5-2600 V3 series processors and Intel® C612 chipset, 16 high bandwidth DDR4 memory slots and two hot swappable 3.5” SATA HDD bays. For greater flexible and easy maintenance, the NA850 can be fitted with up to five Ethernet modules, supporting up to 42 Gigabit LAN ports or 20 10GbE LAN ports. Two PCIe x16 standard expansion slots are available for optional network security cards. The superior network appliance platform also supports the Intel® Data Plane Development Kit (Intel® DPDK), a set of software libraries that can improve packet processing performance by up to ten times. It could achieve over 80 Mbps on a single Intel Xeon processor and double with a dual-processor configuration. With its friendly design and high capacity, this powerful network appliance is suited for IDS/IPS, VPN, content filtering, UTM, network security applications, and cloud computing solutions.
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Product
Embedded System supporting FHFL dual-width PEG slot with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-4000 Series
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- NVIDIA® Quadro® PEG card support- 8th/9th Gen Intel® Core™ i7/i5/i3 processor- Dual SODIMMs for up to 32GB DDR4 non-ECC memory (dependent on CPU)- 1x DVI, 1x HDMI, 1x DP (from CPU), additional display outputs from PEG cards- 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module- 300W/500W Flex ATX PSU
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Product
Fanless Embedded System With LGA1151 Socket 8th Gen Intel® Core™ & Celeron® Processor, Intel® H310, HDMI, DisplayPort, 6 USB, 2 COM And 8-CH DI/DO
eBOX640-521-FL
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*LGA1151 socket 8th gen Intel® Core™ i7/i5/i3 & Celeron® processor (Coffee Lake)*Supports 2 COM, 6 USB and 8-CH DI/DO*Two 2.5" SATA drive bay*M.2 Key E 2230 for Wi-Fi*Front I/O connectivity design*12/19 to 24 VDC power input via DC-Jack*Flexible I/O window supported
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Product
Socket Tester c/w Buzzer
DL1090
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Clear visual and audible indication of wiring status LED indication of a wide range of wiring conditions Designed to EN 61010 and IP30
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Product
Elevator Socket with Bifurcated Contacts
Series 8XXX
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Elevator Sockets with Bifurcated Contacts. Ideal for elevating devices (displays, switches, etc.) to desired level with .260 to 1.250 [6.60 to 31.75] height extension.
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Product
ATX Motherboard With LGA1151 Socket 8th Gen Intel® Core™, Xeon® E Processor, Intel® C246, USB 3.1 Gen2, SATA 3.0, PCI Express Mini Card Slot, VGA, DisplayPort, DVI-D, And HDMI
IMB525
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*LGA1151 socket 8th gen Intel® Core™ i7/i5/i3, Xeon® E, *Pentium® or Celeron® processor (Coffee Lake)*Four 288-pin DDR4-2666/2400 ECC DIMM for up to 64GB of memory*DisplayPort, DVI-D, HDMI and VGA with triple-view supported*6 SATA-600 with RAID 0/1/5/10*1 PCI Express Mini Card slot (optional)*2 USB 3.1 Gen2 and four USB 3.1 Gen1*TPM 2.0 supported (optional)
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Product
Module Accessory Kit, Quantity 26 4-40 x .560" Socket Head Cap Screws
510109303
Accessory Kit
Module Accessory Kit, Quantity 26 4-40 x .560" Socket Head Cap Screws
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Product
Compact Fanless System With 8th/9th Gen Intel® Core™ I CPU Socket (LGA 1151)
MIC-770
Modular Edge Computer
Intel® 8th/9th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q370/H310 chipsetWide operating temperature (-10 ~ 50 °C), 9 ~ 36 VDC input power range2 x GigaLAN, 2 x USB 3.1 and 6 x USB 3.02 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, and 1 x mSATASupports 2 x LAN, isolation COMs, and 32-bit GPIO modulesSupports Advantech i-ModulesSupports Advantech SUSIAccess and embedded software APIsVGA and HDMI™ output (The terms HDMI, HDMI High-Definition Multimedia Interface, HDMI trade dress and the HDMI Logos are trademarks or registered trademarks of HDMI Licensing Administrator, Inc.)
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Product
Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron®, Intel® Q170, 4 PoE, 4 USB 3.0, And Real-time Vision I/O
IPS962-512-PoE
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The IPC962-512-PoE meets the increasing requirements for maximum quality and flexibility in modern production plants. It features flexible expansion capacity, camera communication interfaces, real-time vision-specific I/O with microsecond-scale and LED lighting control. This machine vision controller is powered by the LGA1151 socket 7th/6th generation Intel® Core™ (codename: Kaby Lake/Skylake) and Celeron® processors (up to 65W) with the Intel® Q170 chipset. The IPS962-512-PoE comes with a full range of isolated I/O interfaces and real-time controls essential to machine vision applications, including trigger input, LED lighting controller, camera trigger, as well as an encoder input for conveyor tracking. The real-time vision system PS962-512-PoE enables a fast and high accurate inspection to ensure that the desired quality is achieved with no manufacturing defects. It supports four IEEE802.3at PoE LAN ports and four USB 3.0 ports for connection with industrial cameras. Operating over a wide temperature range from -10°C to +55°C, the IPS962-512-PoE provides reliable and stable performance within severe environments. Its easy setup and compact design are ideal for space constrained environments. Moreover, one PCIe x16 and one PCIe x4 expansion slots allow quick installation of I/O cards and graphics cards. Two easy-swappable 2.5" HDDs are available for extensive storage needs.
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Product
High Performance Chipscale Test Sockets
SC
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Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.
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Product
Burn-in Board Continuity Tester
CT-1
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Burn-in Board Coninuity Tester. Verifies burn-in board continuity and component tolerances. 768 I/O channels, can be forced to the constant current source or grounded independently. Highly accurate measurement of resistance, voltage, and capacitance using a pair of precision instrumentation amplifiers.
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Product
Multi Socket Programmers
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Gang programmers are based around the universal programmers but offer multiple sockets allowing 4 or more devices to be programmed at the same time giving a greater throughput where a large number of devices require programming. Mass production environments churning out tens of thousands of chips a week are where these programmers are typically found.
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Product
Strip-Line™ Socket with Bifurcated Contact Wire Wrap Pins
Series 0501
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Strip-line Sockets with Bifurcated Contact Wire Wrap Pins. Features: For mounting liquid crystal displays and other high pin count or odd centered components. Available in several sizes with bifurcated contacts in wire wrap or solder tail pins. Consult Data Sheet No. 12008 for solder tail pins.
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Fanless Embedded System With LGA1150 Socket Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q87, 2 HDMI/VGA/DisplayPort, 4 GbE LANs, 6 USB 3.0, Wide Range DC-in And PCIe Mini Card
eBOX670-883-FL
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The eBOX670-883-FL supports the LGA1150 socket type for 4th generation Intel® Core™ i7/i5/i3 and Celeron® processors (formally codename: Haswell) with Intel® Q87 Express chipset. Under this rich support system, the eBOX670-883-FL allows wide operating temperature ranging from -40°C to +55°C for the most endurable operation. The outstanding embedded controller comes with four 10/100/1000 Ethernet ports, Jumbo Frame (9.5K), PXE Remote Boot, Teaming, and wake-on-LAN (WOL) function to highly enhance its network connection speed. Additionally, the eBOX670-883-FL supports up to three independent hi-resolution displays or a 4K display. Undoubtedly, this rugged fanless embedded computer is the best solution for any industrial field, including host computers, cloud computing servers, multimedia applications, and automation systems.
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Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3000-CF Series
Embedded Platform
ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: - Smallest Embedded GPU Platform (3 liters) - Reliable MXM GPU Design with Low TDP - Scalable Graphics Processing Ranging from Pascal to Turing GPUs
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Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3000
Industrial Computer
- Medical grade computer compliant with IEC 60601-1:2005 + A1:2012 + A2:2020 (3.2 edition) / IEC 60601-1-2:2014 + A1:2020 (4.1 edition)- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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Product
LED Burn-In Test
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Burn-in system, based on LXI instrumentation, for concurrent testing of up to 80 DUTs in a climatic chamber. Devices to be tested include modern light emitting diodes and LED modules.The system consists of 2 control cabinets, each with 40 independent supply and measurement channels. Each channel can be configured individually via the operator software (current or voltage, including the relevant limit values). The software supports logging of current and voltage values for each DUT on all 80 channels with a sampling rate of <1s. Additionally, the software and system also support digital I/O channels, e. g. for controlling the climatic chamber. Inputs for connecting temperature sensors are also provided.
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Test Sockets
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Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
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Product
Plug and Socket Gauges
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Shenzhen Chuangxin Instruments Co., Ltd.
The plug and socket gauge is designed according to BS1363-1 and BS1363-2 standard.
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Product
Burn-In System
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The COBIS-II Series Burn-in System is designed to test the latest high frequency integrated circuits (ICs) and combines a large capacity oven with well proven Accutron FlexBID™ dynamic driver technology. This system is engineered for productive dynamic device testing and reliable monitoring.
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Product
ATX Motherboard With LGA1150 Socket 4th Gen Intel® Core™ Processor, Intel® Q87, USB 3.0, SATA 3.0, Dual LANs, DisplayPort, VGA, HDMI And MSATA
IMB211
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The IMB211 is industrial-grade ATX motherboard with a full-range of integrated peripherals for general industrial and embedded applications. The IMB211 is based on 4th Generation Intel® Core™ i7/i5/i3/ Celeron® processors in LGA1150 socket with Intel® Q87 Express chipset. Four 204-pin DDR3-1333/1600 slots provide a maximum memory capacity of 32 GB to improve overall system performance. This industrial-grade high performance motherboard also supports Intel® Active Management Technology 9.0 (iAMT 9.0), SATA RAID, and triple-display capability through DisplayPort, HDMI and DVI-I interface. The board helps users to deploy more responsive, high-performance, graphic performance systems for advanced communication, gaming, industrial and automation applications.
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Product
BGA Sockets
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Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Product
Low Distortion 1kW Power Source With UK/Schuko/USA Socket.
AC1000A
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Provides an EN61000–3–2 compliant source1000W power capability at 230VUp to 4·4A rms load current and up to 10A peak currentsComprehensive overload protectionConnection via standard power connectors
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Product
14th/13th/12th Gen. Intel® Core™ Processors (Alder Lake-S/Raptor Lake-S Series, LGA1700 Socket CPU) On 4" EPIC SBC
MIO-4370
Single Board Computer
14th/13th/12th Gen. Intel® Core™ Processor up to 24 Cores, TDP 35WHigh scalability with socket type CPU (LGA1700) & Support Std. CPU coolerDDR5 4800 up to 32GB + 3 simultaneous display: Dual HDMI+eDPDual High Speed 2.5G Ethernet with TSN, 2x COM, CANbus, TPM3 Expansions: Dual M.2 M-Key (support NVMe), M.2 E-KeySupports Windows 10 LTSC & Ubuntu 22.04 LTS, embedded software APIs, WISE-DeviceOn
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Product
3 Position Plug Socket Switch Life Tester
CZKS-3
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It is designed according to terms and conditions of IEC60884-1, IEC60669-1, GB2099.1-2008 and GB16915.1-2003, for life test of plug and socket and switch products of household and similar use appliances.The device can connect with matched load cabinet, in order to conduct a test of electrical life, normal operation and breaking capacity. The equipment provides some clamps. It can test plug and socket production, wall switch, rocker switch, dial plate switch and button switch.
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Product
Lo-PRO®file Collet Socket with Wire Wrap Pins
Series 503
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LO-PRO file Collet Sockets with Wire Wrap Pins. Features: LO-PRO file Collet Sockets are available with solder tail or wire wrap pins. Consult Data Sheet No. 12011 for solder tail pins. Choose from several sizes and plating options.
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Elevator Strip-Line™ Socket with Bifurcated Contacts
Series 700
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Elevator Strip-Line Sockets with Bifurcated Contacts. Features: For elevated mounting of LCDs and other odd-centered or high pin count components. Any height from .360 to 2.000 [9.14 to 50.80]. ?Optional spacer available for mounting on .300 [7.62], .600 [15.24], .900 [22.86], 1.100 [27.94], and 1.300 [33.02] centers. Consult factory for other sizes.
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Product
4-slot Fanless Industrial System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, Front-access I/O, PCIe And PCI Slots
IPC964-512-FL
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The IPC964-512-FL is a 4-slot fanless barebone system with modular design and optimized expandability. The rugged industrial PC supports the high-performance 7th/6th generation Intel® Core™ and Celeron® processors with the Intel® Q170 chipset. The IPC964-512-FL features dual DDR4-2133 SO-DIMM slots with up to 32GB memory. For easy cabling and maintenance, the IP40-rated embedded system features a wide choice of front-accessible I/O interfaces, including two Gigabit LAN ports, four USB 3.0 ports, one VGA, one HDMI, one audio (Mic-in/Line-out), and three optional I/O modules - a 4-port isolated RS-232/422/485 module, an isolated 8-in/8-out DIO module, and a 2-port isolated RS-232/422/485 and 4-in/4-out DIO module. The compact industrial PC also provides four flexible PCI/PCIe expansion slots with three different combinations of expansion kits: one PCIe x16 and one PCIe x4; one PCIe x16 and one PCI; and two PCI. Additionally, it has a full-size PCI Express Mini Card slot for 3G/4G, GPS, Wi-Fi and Bluetooth connections, and comes with two easy-swappable 2.5” HDD trays for storage. To fit various industrial environments, the rugged modular industrial PC supports 24VDC (uMin=19V/uMax=30V) power input with a lockable terminal block-type connector and a wide operating temperature range of -10°C to +60°C.
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ATX Industrial Motherboard With LGA1150 Socket Intel® Xeon® E3-v3 Processor, Intel® C226, ECC DDR3, USB 3.0, SATA 3.0, Dual LANs, DisplayPort/DVI-I/HDMI And CFast™
IMB210
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The IMB210 is an advanced ATX industrial motherboard based on the 4th Generation Intel® Xeon® E3/ Core™ i7/i5/ i3/ Pentium®/ Celeron® processors (codename: Haswell) in LGA1150 socket with Intel® C226 PCH. The optimized IMB210 is specially designed for workstations through better computing and visual performance ideally used in every major industry for tasks ranging from financial modeling to designing complex buildings and vehicles. With its built-in Intel® HD Graphics P4000, this industrial grade motherboard delivers great 3D visual performance with triple display capability through DisplayPort, HDMI and DVI-I ports demanded by professional-grade CAD and media/entertainment fields. In addition, the IMB210 supports Intel® Turbo Boost 2.0 technology, Intel® Hyper-Threading technology, Intel® HD Graphics with DX11 support, 3-D Tri-Gate transistors, 32 GB ECC DDR3 1600/1333 memory, and PCI Express 3.0 x16 slot. It also features Intel® Active Management Technology 9.0 (iAMT), Trusted Platform Module 1.2 (TPM), SATA RAID, as well as PCIe x4 expansion making it ideal for applications with added security features.
