Burn-In Sockets
See Also: Test Sockets, Burn-In, BGA Test Sockets
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Product
Multi Socket Programmers
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Gang programmers are based around the universal programmers but offer multiple sockets allowing 4 or more devices to be programmed at the same time giving a greater throughput where a large number of devices require programming. Mass production environments churning out tens of thousands of chips a week are where these programmers are typically found.
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Product
Burn-in Room and Aging Test Chamber
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Aging test room according to your requirements. More types of Burn-In Test Room, Burn-In Chamber, Burn-In Test Oven wanted, please contact us freely.
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Product
Socket Outlet Tester
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Using the new Testavit Schuki 1 LCD and 3 LCD, specialists easily check to see if sockets, cable drums or connecting cables are correctly connected in 230 V installations. Due to three LEDs, the connection status can be quickly and clearly determined. In addition, through the finger contact, it can be tested to see whether an impermissible, high contact voltage is applied at the protective earth connection. In addition, using the Testavit Schuki 1 LCD, a 30 mA FI circuit breaker (RCD) can be triggered via a pushbutton.
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Product
Socket Tester c/w Buzzer
DL1090
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Clear visual and audible indication of wiring status LED indication of a wide range of wiring conditions Designed to EN 61010 and IP30
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Product
Strip-Line™ Socket with Bifurcated Contact Wire Wrap Pins
Series 0501
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Strip-line Sockets with Bifurcated Contact Wire Wrap Pins. Features: For mounting liquid crystal displays and other high pin count or odd centered components. Available in several sizes with bifurcated contacts in wire wrap or solder tail pins. Consult Data Sheet No. 12008 for solder tail pins.
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Product
Lock/Eject DIP Collet Socket with Surface Mount Pins
EJECT-A-DIP
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Lock/Eject DIP Collet Sockets with Surface Mount Pins. Features: Aries Eject-A-Dip is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance. The latch locks in the connector or device, making it ideal for high vibration environments. The latch, when used as an ejector, removes DIP packages without pin damage.
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Product
MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Product
Burn-In Boards
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Meets burn-in requirements, including extreme temperatures or continual handling. 2 or more layers of polyimide. 200 C maximum temperature. Gold-plated connectors.
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Product
Module Accessory Kit, Quantity 26, 4-40 x .375" Socket Head Cap Screws
510109301
Accessory Kit
Used with modules: 510104118 and 510108104.
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Product
Custom Test Sockets
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RTI specializes in producing custom test sockets We work with your engineering team from prototype to production, ensuring your product meets your test requirements. Contact us for a free quote.
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Product
JTAG External Modules (JEM) DIMM/SODIMM Socket Cluster Test
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The primary function of the JTAG External Modules (JEM) for the DIMM/SODIMM Socket Cluster Test is to provide test access to off-board signals that otherwise could not be accessed by a JTAG test system and to strengthen the memory-independent JTAG testing for the assembly correctness of the almost full spectrum of the modern socket types, particularly (according to JEDEC_Std.21-C):
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Product
Module Accessory Kit, 26 4-40x .750" Socket Head Cap Screws
510109359
Mounting Kit
Module Accessory Kit, 26 4-40x .750" Socket Head Cap Screws
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Product
Ultra Compact Industrial Computers, mini PCIe socket for WIFI / 4G module
Neousys NRU
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Ultra-compact industrial computers based on NVIDIA® Jetson AGX Xavier ™ for mobile use (in transport, in surveillance systems, in industrial systems).- NVIDIA® Jetson AGX Xavier ™ SOM with JetPack 4.4- IEEE 802.3at Gigabit PoE + or 0GBASE-T 10G ports - M.2 2280 M key socket for NVMe SSD- mini PCIe socket for WIFI / 4G module - GPS PPS input
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Product
Pin-Line™ Collet Socket with Solder Tail Pins
Series 0513
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Pin-Line Collet Sockets with Solder Tail Pins. Features: Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for .100 [2.54] grid or matrix patterns. Available with solder tail or wire wrap pins. Consult Data Sheet No. 12014 for wire wrap pins. Break feature allows strips to be cut to the number of positions desired.
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Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3200-CF Series
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- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support
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Product
Module Accessory Kit, Quantity 26, 4-40 x 1.250" Socket Head Cap Screws Stainless Steel
510109597
Accessory Kit
Used with modules: 510109315, 510150120, 510150125, 510150126, 510150127, 510150128, 510150141, 510150142, 510150143, 510150148, 510150152, 510150153, 510150154, 510150155, 510150210, 510150220, 510150227 and 510150238.
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Product
Socket Testers
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Socket testers are portable devices used for testing the wiring of power outlets. These testers are used widely in home and commercial buildings. UNI-T’s socket testers can speed up the testing process considerably and obtain reliable and accurate information socket status.
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Product
Burn-in or Rapid Temperature Cycling Chamber
KDL Series
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The Bemco KDL series is designed for production testing of electronic circuit boards and completed electronic systems. They accept Bemco KDLC Carts that have a working area of 42 wide by 60 high by 48 deep suspended on insulated runners and casters 11 inches above the test area floor.
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Product
Surface Mount Ball & Socket Test Point
SMOX
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SMOX is a unique select on test terminal which provides accurate line tests in PCB assembly. Supplied loose or on tape and reel for ease of assembly, its unique retention mechanism enhances reliability through low stress contact.
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Product
TEST SOCKET
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IC Package It is a device to install INTERFACE between TESTER and DEVICE during TEST to check electrical defects such as O / S (Open, Short) test, mounting test, BURN-IN TEST and RLC TEST, The device
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Product
Compact Fanless AMR/MMR Controller System With 12th/13th/14th Gen Intel® Core™ I CPU Socket (LGA 1700)
MIC-760
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High-performance computing powered by Intel® 12th/13th/14th Gen Core™ i CPUFanless design ensures reliable operation in environments up to 60°CIsolated DIO, CANbus and Serial ports guarantee for industrial communicationContact 8KV/Air 15KV IV level ESD protection , ClassB for EMI design, best choice for industrial environment3 Ethernet and 4 USB3.2 (5Gbps) for Camera and Lidar connectionIndustrial WiFi design enables fast roaming at 36msCompact size ensures easy installation for AMR/MMRBuilt on Ubuntu 22.04 and Advantech Edge Linux, with ROS2 package readinessROS2 package enhances industrial automation capabilities including EtherCAT and Modbus node support
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Product
Boundary-Scan DIMM Socket Tester
ScanDIMM
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Maximizing test coverage is an important piece in test procedure development. Unfortunately, not all designs have the necessary requirements in place to accommodate boundary-scan test methods on memory devices. ScanDIMM digital socket test modules are designed to overcome such limitations when testing DIMM sockets utilizing boundary-scan test techniques.ScanDIMM modules provide the capability to instantly turn any DIMM socket into a fully compliant IEEE-1149.1 device. Integration is as simple as assigning the included BSDL file to the reference designator of the target socket and compiling test vectors.In multi-socket systems, multiple ScanDIMM modules can be linked to provide even greater boundary-scan test depth.
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Product
SIMRC- 72 Pin Simm Socket
1090-001
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Our small format embedded switching (SIM relay) cards offer a choice of switching configurations using low cost industry standard SIM connectors. They free the designer from the detail of routing complex switching circuits, you may select from a wide range of cards using the built in RS-232 and I2C interfaces. These low-cost embedded switching cards are intended to be mounted on to a simple motherboard. They may be used to construct very high density switching networks. SIM based switching cards also allow for very simple in-field maintenance.
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Product
Silver Ball Matrix Sockets
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SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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Product
ZIF (Zero-Insertion-Force) Socket
Series 516
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Zero Insertion Force Socket. A choice of 24, 28, or 40 pin count devices can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Contacts are normally open and are closed by a unique cam action controlled by dual lever arms. The last 15° of movement of the cam provides a wiping action to the contacts on the legs of the device to remove any residue, ensuring a gas-tight seal.
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Product
IEC60065 Fig11 Australia UL Plug Socket Tester Socket Outlet Torque Tester
CX-CTN
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Shenzhen Chuangxin Instruments Co., Ltd.
The plug torque tester conforms to the standard of IEC60065 figure 11. It is used for checking whether the mechanical stress which occurs when the Direct Plug-in Equipment with plug pin normally insert into the socket is in the required range.
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Product
Open Pluggable Specification (OPS) Digital Signage Player With Socket G2 Intel® Core™ I5/i3 And Intel® HM76 Chipset
OPS870-HM
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OPS870-HM Open Pluggable Specification (OPS) compliant signage player is powered by 3rd Generation Intel® Core™ processors. The high performance OPS870-HM is based on Mobile Intel® HM76 Express chipset and features 3rd Generation Intel Core processors based on the leading edge 22nm process technology. Axiomtek's OPS870-HM is engineered to be installed into any OPS-compliant digital signage platform to enable faster and easier installation, and straightforward upgrading and maintenance. It significantly provides superb graphics performance, full HD content playback, and dual display presentations. Equipped with the OPS870-HM, users can apply a variety of DOOH (Digital Out Of Home) applications with ease!
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Product
Open Top BGA Sockets
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Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
