Wafer Resistivity
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
-
Product
4-Probe Resistivity and Resistance Tester
HS-MPRT-5
-
t used for measuring resistivity of silicon rods and wafers, and sheet resistance of diffused layers, epitaxial layers, LTO conductive films and conductive rubbers, etc.
-
Product
Hand Held Probe Type Eddy Current Sheet Resistance/resistivity Measurement Instrument
EC-80P (Portable)
-
*Auto-measurement start by probe head contacting to sample*3 measurement modes for wafer resistivity, bulk resistivity and sheet resistance*Easy set up to measurement condition by JOG dial*5 types of model for each measuring range*Resistivity probe can be changed by sample’s resistivity range
-
Product
Semiconductor Metrology Systems
-
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
-
Product
Wafer Probers
-
Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
-
Product
Ultrasonic Wafer Scanner
AutoWafer
-
Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
-
Product
Wafer Probe Heads
-
WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
-
Product
Wafer Mapping Sensor
M-DW1
-
Panasonic Industrial Devices Sales Company of America
To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.
-
Product
Wafer Manufacturing
-
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
-
Product
Wafer Level Test
-
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
-
Product
Resistance Measurement
PROMET
-
High-precision micro-ohm measuring systems with adjustable DC test current for determining resistances on circuit breakers or inductive loads such as transformers, for example. The high-precision ohm meters of the PROMET series are used to determine very low electrical resistances in the µΩ range. The adjustable test current of up to 600 A in combination with a four-wire measuring method delivers measurement results which meet stringent accuracy requirements. State-of-the-art power electronics coupled with a robust design guarantee excellent reliability for use as a portable device in switching stations and industrial environments. Typical applications include determining the contact resistance of switchgear devices and determining the resistance on inductive loads such as transformers.
-
Product
Wafer Testing
Trio Vertical
-
SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
-
Product
Contactless Wafer Geometry Gauge
MX 20x series
-
The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
-
Product
MPI PA Wafer Probers
-
MPI Photonics Automation is the industry-leading provider of turnkey wafer test and measurement solutions. We offer a complete line of high-performance wafer probers designed to address the diverse and complex needs of the Photonics, Optoelectronic, Semiconductor, and Laser industries.
-
Product
Wafer Bonder
AML
-
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
-
Product
Resistance Meter
MT8-4L
-
М-module МТ8-4Л is a mezzanine module designed to measure the resistance of resistive sensors using a four-wire measurement circuit in eight channels (eight-channel digitizer). М-module МТ8-4Л is installed on the carrier of mezzanines - module НМ-М and is connected to it via a local information highway. Up to four m-modules of various types can be installed on the NM-M module. The NM-M module, together with the m-modules installed on it, forms a VXI module of size C-1 and is used to create information measuring VXI systems.
-
Product
WAFER MVM-SEM
E3300 Family
-
The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
-
Product
Wafer Edge Profile Measurement
WATOM
-
WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
-
Product
Semiconductor Wafer Microscope Inspection System
MicroINSPECT
-
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
-
Product
Wafer Prober Networking System
PN-300
-
The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
-
Product
WAFER MVM-SEM® E3300 Series
E3310
-
The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
-
-
Product
Wafer Probe Test System
STI3000
-
The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
-
Product
Wafer Chucks
-
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
-
Product
Wafer Inspection System
AutoWafer Pro™
-
AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
-
Product
Winding Resistance Test
20A DC booster
-
The 20A DC STCS booster allows to perform resistance tests on a PT with a current up to 20 A DC. The option is used together with STS 5000 and STS 4000 and must be connected to STCS module.
-
Product
Electronic Store Of Resistances
PS8
-
The module is intended for use as part of information measuring systems based on the VXI bus for software setting of resistance values with a given step along three independent channels.
-
Product
Resistance & Resistivity Probes
-
Surface and/or volume resistance measurements are key parameters in describing materials' electrical properties. ETS offers a variety of probes to support numerous industry requirements and applications.
-
Product
Wafer Chip Inspection System
7940
System
Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
-
Product
Resistance & Capacitance Box
RCS Series
-
The RCS-box combines the features and specifications of both the R-box and the C-box in one convenient package. Ideal for setting timers, oscillators, and filters, the resistance and capacitance may be used independently, in series, or in parallel. A shorting link allows them to be coupled or separated.
-
Product
In-situ Wafer Temperature Monitoring
-
CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
