Deposition
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Deposition Systems
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When a thin film requires the most stringent structural or compositional properties consistently across every layer, Veeco’s Ion Beam Deposition (IBD) technology is often the answer. Using a focused beam of ions to sputter material from a target, this physical vapor deposition technique builds dense, uniform films with standout adhesion and stability.
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Physical Vapor Deposition Systems
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Physical Vapor Deposition (PVD) systems use physical processes, like sputtering and evaporation, to deposit thin films with exceptional purity and control. These techniques are widely used in semiconductor manufacturing, optical coatings and protective applications.
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Dynamic Scale Deposition Loop System
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Dynamic Scale Deposition Loop fully automated systems includes hardware and software to measure and evaluate the performance of scale inhibitors under high pressure and high temperature conditions.
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Ion Beam System
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Veeco's unmatched Ion Beam know-how delivers proven etch and deposition performance enabling the data storage and MEMS markets for decades.
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Process Sense™ NDIR End Point Detector For Chamber Clean
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The Process Sense endpoint sensor is a small, low-cost SiF4 sensor specifically designed for Remote Plasma Chamber Clean Endpoint detection for silicon-based CVD deposition chambers. Process Sense is based on infrared absorption, the only technique applicable to all plasma cleaning processes (in-situ and remote). It gets mounted onto a bypass on the rough line, ensuring no effect on deposition hardware. The signal level reported by the Process Sense, which is proportional to SiF4 concentration, can be used to determine the completion of the chamber clean process.
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Micro-spot DUV Reflection and Transmission Spectrophotometry
FilmTek 3000 PAR
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Scientific Computing International
Metrology system with a 50µm spot that delivers high-performance transmission and reflection measurement of patterned films deposited on transparent substrates. Ideally suited for measuring the thickness and optical constants of very thin absorbing films.
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Digital Mammography
ITA
Analogic is an established worldwide leader in direct conversion digital detector technology used in digital mammography. We develop and manufacture flat-panel, direct conversion digital detectors used by major medical OEMs in mammography systems. These plates capture image data directly onto a patented detector made with a layer of amorphous selenium deposited onto a thin-film transistor array.
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3D Solder Paste Inspection (SPI)
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Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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Gridded RF Ion Sources
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Veeco's gridded RF ion sources are designed for improved production of long-run ion beam deposition processes.
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Conductivity Electrode
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As current-carrying and potential difference measuring electrodes, platinum was deposited on a quartz glass substrate. Voltage terminal distance can be varied by changing the connection pin. In-situ measurement of the metal transition produced in a conductive polymer insulator doping, 4 terminal electrode is used, where for insulator layer with low doping side 2 terminal method and for metal layer with high doping side 4 terminal method is used for the measurement. With this electrode, become possible to have measurement in 15 distances by combining the connection terminal.
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Electron Sources
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SPECS Surface Nano Analysis GmbH
To our customers in research and industry we offer a variety of sources for deposition, excitation and charge neutralization as well as analyzers and monochromators. Most of our sources originate from product lines which we have taken over from Leybold AG, Cologne, and from VSI GmbH. The X-ray monochromator Focus 500 and the UV monochromator TMM 302 are original developments by SPECS.Compliance with industry standards, a good price-performance ratio, stability, and longevity are the guidelines for our product development. We focus on standardized easy handling, user-friendliness, standardized software interfaces and safety.
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Pulsed-DC Systems
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Extend process innovation with Advanced Energy’s comprehensive pulsed-DC suite. Minimize arcing, enhance deposition rate, improve film flatness and packing density.
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Lens Measurement Spectrophotometers
LINZA 150
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LINZA 150 spectrophotometer is designed for broadband transmittance and reflectance measurement of lenses and lens assemblies (objectives) ensuring that only perfect lenses are approved for lens assemblies, delivered to customers or meet specs provided to your lens supplier. The instrument is perfectly suited for both routine lens measurements and sophisticated improvement of lens production technology: Fast on-axis transmittance measurement of individual convex/concave lenses. Fast on-axis transmittance measurement of lens assemblies (objectives). Unattended on-axis and off-axis reflectance measurement of individual lenses providing measurement data virtually from any area on lens surface (both convex and concave). Ideal for fine-tuning of deposition technology used to produce coatings on lenses.
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Ozone Gas Generators
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SEMOZON® Ozone gas generators and subsystems are the industry standard for compact, high concentration, ultra-clean ozone gas generation. Applications include Atomic Layer Deposition (ALD), Atomic Layer Etch (ALE), Chemical Vapor Deposition (CVD) and Wet Cleaning.
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X-Ray Detector
XRT Detector Onyx
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ONYX 1412-X is a performance-leading X-ray detector comprising a proprietary 2768 × 2376 active pixel sensor array of 50 × 50 µm pixels. This detector consists of a high-speed, low-noise, radiation-tolerant, 14 × 12 cm, 6.6M pixel CMOS image sensor, with a directly deposited high-resolution CsI scintillator on Fibre Optic Plate. The highly configurable sensor is accessed through a software interface, connected via a 10 GbE SFP+ hardware interface.
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Copper Pillar Bump
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Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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GHW Series 13.56 MHz, 1.25, 2.5, And 5.0 KW High-Reliability RF Plasma Generators
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The GHW Series RF power generators deliver maximum rated output powers of 1250, 2500 and 5000 Watts at a frequency of 13.56 MHz. The GHW generators offer field-proven reliability, exceptional stability, and unsurpassed repeatability for high uptime and process yield. They are ideally suited for Plasma Enhanced Chemical Vapor Deposition (PECVD), High Density Plasma CVD (HDPCVD), etching and other thin film applications during the manufacture of integrated circuits, flat panel displays, and data storage devices.
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ALD Applications
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Atomic Layer Deposition (ALD) has the potential to optimize product design across a wide array of applications from making silicon chips run faster, to increasing the efficiency of solar panels, to improving the safety of medical implants.
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Gas and Vapor Delivery Systems
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In thin film deposition, high-quality results start with how process gases are delivered, as they help create the stable environment needed for consistency by controlling flow, pressure and composition to support processes like ALD, CVD, and PVD. Advanced semiconductor devices developed for the most advanced computing processes, such as AI and edge computing, need the ultra-high-purity environments of our gas and vapor deposition delivery systems.
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Pure Boron Foils
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MICROMATTER™ boron foils are also produced by laser plasma ablation; however, the deposition process is much more complex and time consuming than that for diamond-like carbon. Accordingly, only thin films, mainly designed for beam stripping of heavy ions in electrostatic accelerators, are available. All films are generally delivered on glass substrates coated with a release agent.
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Packaging Manufacturing
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KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Multichamber PECVD/Etch System
IsoLok 5000
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Load locked cluster toolCassette to cassette processingUp to 4 coatings can be deposited without breaking vacuumSubstrate sizes: 125 x 125mm,156 x 156mm and200mm dia. (smaller sizes can be processedusing a carrier)Typical coatings: SiOx & SiNx - doped & undoped & a- SiR&D, Pilot production and production capabilitiesRIE chambers availableFull computer controlProcess chamber is modular and interfaced with 200mm slot valve
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Parylene Deposition Equipment
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SCS offers Parylene deposition systems that range from a portable laboratory unit to production models for high-volume manufacturing applications. SCS Parylene deposition systems are designed for accurate and repeatable operation, featuring closed-loop monomer pressure control, which ensures deposition of the polymer film at a precise rate. Whether researching new coating applications or developing structures out of Parylene in the laboratory, or coating components in a production environment, SCS leads the industry with its state-of-the-art Parylene deposition systems.
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Duct Deposit Measuring System
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The Elcometer 456 Duct Deposit Measuring System has been specifically designed to meet the requirements of the DTT (Deposit Thickness Test) in HVCA’s (Heating & Ventilation Contractor’s Association) Guide to Good Practice, for the measurement of dust and grease deposits within ventilation systems and kitchen ducts made of ferrous metals.
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Digital mammography system
AMULET
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The new format FPD has a proprietary panel structure with a double layer of amorphous selenium that has high X-ray absorption properties, and was developed by combining Fujifilm''s "Device Development Technology" and "Vacuum Deposition Technology." The first layer efficiently converts X-rays into electrical signals, while the second layer employs the unique "Direct Optical Switching Technology," that captures higher resolution and lower noise image electrical signals rather than using electrical switches such as conventional TFTs. By achieving both "50µm fine pixel size (higher resolution) and low noise," the AMULET system can show microcalcifications and tumors in greater detail, both significant indicators for early diagnosis of breast cancer.
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In-Situ Spectroscopic Ellipsometer for Real-Time Thin Film Monitoring
UVISEL Plus In-Situ
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The UVISEL Plus in-situ spectroscopic ellipsometer can be easily mounted on process chambers (PECVD, MOCVD, sputter, evaporation, ALD, MBE) for the real-time control of thin film deposition or etch processes.The UVISEL Plus in-situ provides the unique combinations of very high speed, sensitivity, dynamic range and accuracy making the instrument able to control deposition / etch at the atomic layer thickness level, even for rapid processes.
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High Power Microwave Plasma Source
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The High Power Microwave Plasma Source can be combined with a 6kW microwave generator for a high concentration of radicals providing a high productivity manufacturing solution. The High Power Microwave Plasma source is capable of igniting in multiple process gases, over a wide operating range with performance benefits in current and emerging applications such as, high throughput photoresist removal, advanced surface cleaning and conditioning, as well as, advanced deposition applications at the atomic level.
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ICP Plasma System
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The AXIC IsoLok® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.
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Vapor Concentration Monitor
IR-300 Series
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Metal-Organic Chemical Vapor Deposition (MOCVD) is widely used in the manufacture of LEDs, optical devices and other components. Liquid and solid precursors are delivered to the reaction chamber by controlling the temperature, pressure and the carrier gas flow rate (bubbling method). Process results can be affected by changes especially in temperature and liquid level. The in-line IR-300 Series measures and reports the precursor concentration in real time.
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PED Systems
Pulsed Electron Deposition
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Is a process in which a pulsed (80-100 ns) high power electron beam (~1000 A, 15 kV) penetrates approximately 1 μm into the target resulting in a rapid evaporation of target material. The non-equilibrium heating of the target facilitates stoichiometric ablation of the target material. Under optimum conditions, the target stoichiometry is preserved in the deposited films. All solid state materials – metals, semiconductors and insulators, including those transparent to laser wavelengths in PLD – can be deposited as thin films with PED. By combining PLD and PED, the range of complex materials that can be prepared as thin films can be greatly enhanced.
