Deposition
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Deposition Systems
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When a thin film requires the most stringent structural or compositional properties consistently across every layer, Veeco’s Ion Beam Deposition (IBD) technology is often the answer. Using a focused beam of ions to sputter material from a target, this physical vapor deposition technique builds dense, uniform films with standout adhesion and stability.
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Particle Deposition Systems
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MSP’s 2300G3 Particle Deposition System sets the standards for wafer inspection and metrology equipment. This advanced tool is vital for increasing the yield of future leading-edge devices, while meeting the measurement needs of today.
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Parylene Deposition Equipment
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SCS offers Parylene deposition systems that range from a portable laboratory unit to production models for high-volume manufacturing applications. SCS Parylene deposition systems are designed for accurate and repeatable operation, featuring closed-loop monomer pressure control, which ensures deposition of the polymer film at a precise rate. Whether researching new coating applications or developing structures out of Parylene in the laboratory, or coating components in a production environment, SCS leads the industry with its state-of-the-art Parylene deposition systems.
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Atomic Layer Deposition Systems
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Atomic Layer Deposition (ALD) is a powerful way to build ultra-thin, super-precise coatings, one atomic layer at a time. It’s especially useful and efficient when working with tiny, complex 3D structures, making it a go-to technique in advanced semiconductor manufacturing.
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Plasma-Enhanced Chemical Vapor Deposition (PECVD)
VECTOR Product Family
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Dielectric film deposition processes are used to form some of the most difficult-to-produce insulating layers in a semiconductor device, including those used in the latest transistors and 3D structures. In some applications, these films need to conform tightly around intricate structures. Other applications require dielectric films to be exceptionally smooth and defect free since slight imperfections are multiplied greatly in subsequent layers.
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NR01 net radiometer
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Hukseflux Thermal Sensors B.V.
NR01 is a market leading 4-component net radiation sensor, mostly used in scientific-grade energy balance and surface flux studies. It offers 4 separate measurements of solar and longwave radiation, facing both up and down. NR01 owes its popularity to its excellent price / performance ratio and major improvements relative to comparable instruments. These advantages include weight, ease of levelling, solar offsets in the longwave measurement and pyrgeometer heating, reducing measurement errors caused by dew deposition.
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RF Plasma Power Systems
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These are ideal solutions for plasma apps like etching, cleaning, deposition and more
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PED Systems
Pulsed Electron Deposition
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Is a process in which a pulsed (80-100 ns) high power electron beam (~1000 A, 15 kV) penetrates approximately 1 μm into the target resulting in a rapid evaporation of target material. The non-equilibrium heating of the target facilitates stoichiometric ablation of the target material. Under optimum conditions, the target stoichiometry is preserved in the deposited films. All solid state materials – metals, semiconductors and insulators, including those transparent to laser wavelengths in PLD – can be deposited as thin films with PED. By combining PLD and PED, the range of complex materials that can be prepared as thin films can be greatly enhanced.
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Structural Adhesive Bead Inspection
Predator3D
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The Predator3D bead inspection technology measures bead height, width (volume) and position to assure structural integrity. It also alerts users to skips and partial skips, where material is deposited with insufficient volume.
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Gas and Vapor Delivery Systems
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In thin film deposition, high-quality results start with how process gases are delivered, as they help create the stable environment needed for consistency by controlling flow, pressure and composition to support processes like ALD, CVD, and PVD. Advanced semiconductor devices developed for the most advanced computing processes, such as AI and edge computing, need the ultra-high-purity environments of our gas and vapor deposition delivery systems.
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In-Line Metrology
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In-line metrology systems are integrated into production lines for comprehensive process control during substrate transfer between deposition chambers.
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Oil In Water/Soil Analyzer
InfraCal 2 TRANS-SP
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The InfraCal 2 TRANS-SP is recommended for measuring oil in water, TPH in soil or FOG in wastewater concentration levels using the traditional EPA methods 413.2 and 418.1 or ASTM method D7066-04 and Freon-113, hydrocarbon-free grade of perchloroethylene, AK-225, S-316 or other spectroscopic infrared transparent solvent as the extracting solvent. Since the extract is deposited into a 10 mm quartz cuvette cell with Teflon stopper, light end volatile components are retained for measurement. Accurate down to 0.1 ppm.
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Long Term Test Kit
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When long term electro-chemical tests (>1000 hours) are run to monitor the cell degradation at the cathode for example, it is important to avoid any contaminant in the gas flow rate.Inconel 601 flange equipped with alumina housing and alumina tube to feed the gas to the electrode during long term test (>1000 h)Typical poisoning is coming from the chromium contained in the steel tubing. The volatile chromium species (Cr6+) will flow into the cathode (with the air) and thanks to the intake of electrons at the electrode, the chromium ion will transform to chromium oxide and be deposited at the cathode triple point. In such a case, the long term test kit is used. The Inconel 601 flange is equipped with an alumina housing (>96 % Al2O3) and the air (or other gas) is led through an alumina tube. The long term test kit is fully compatible with other functionalities proposed with the Open Flanges™ test Set-Up as the integrated steamer or the small pellet test kit. The long term test kit can be implemented on the fuel, on the air or on both sides.
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kSA BandiT
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The kSA BandiT is a non-contact, non-invasive, real-time, absolute wafer and thin-film temperature monitor used during thin-film deposition and thermal processing.
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SpectrOil M/F-W Fuel Analyzer
SpectrOil M
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The SpectrOil M/F-W is a compact, rugged and easy to use fuel analysis spectrometer. It is designed specifically for the analysis of ash-forming contaminants in fuel such as sodium, potassium and vanadium that cause corrosion or deposits at turbine operating temperatures. It measures trace quantities of dissolved or suspended contaminant particles in a fuel sample using the time-tested and reliable rotating disc electrode (RDE) technique.
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MOCVD Systems
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For growing high-quality compound semiconductor films, few techniques match the precision of Metal-Organic Chemical Vapor Deposition (MOCVD). They give engineers tight control over film composition and thickness, making them essential for optoelectronics and advanced power transistors.
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Dynamic Scale Deposition Loop System
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Dynamic Scale Deposition Loop fully automated systems includes hardware and software to measure and evaluate the performance of scale inhibitors under high pressure and high temperature conditions.
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Copper Pillar Bump
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Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Micro-spot DUV Reflection and Transmission Spectrophotometry
FilmTek 3000 PAR
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Scientific Computing International
Metrology system with a 50µm spot that delivers high-performance transmission and reflection measurement of patterned films deposited on transparent substrates. Ideally suited for measuring the thickness and optical constants of very thin absorbing films.
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ALD Materials
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Chemists have synthesized many exciting new precursors for ALD and have created a large number of atomic layer deposition materials, such as coatings with improved properties for metals, semiconductors, insulators, oxides, nitrides, dielectrics, magnetic, and refractive coatings.
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Vapor Concentration Monitor
IR-300 Series
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Metal-Organic Chemical Vapor Deposition (MOCVD) is widely used in the manufacture of LEDs, optical devices and other components. Liquid and solid precursors are delivered to the reaction chamber by controlling the temperature, pressure and the carrier gas flow rate (bubbling method). Process results can be affected by changes especially in temperature and liquid level. The in-line IR-300 Series measures and reports the precursor concentration in real time.
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3D Solder Paste Inspection (SPI)
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Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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Chip Manufacturing
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KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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Inline Wafer Testing
IL-800
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Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Dynamic Ultra Micro Hardness Tester
DUH-210/DUH-210S
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A new evaluation system for measuring the material strength of micro regions, such as semiconductors, LSI, ceramics, hard disks, vapor deposited films, and thin coating layers, not addressed by previous hardness testers. It can also be used to evaluate the hardness of plastics and rubbers. This instrument uniquely measures dynamic indentation depth, not the indentation after the test. This in turn permits measurement of very thin films and surface (treatment) layers that are impossible to measure with conventional methods. Additionally, this same method supplies the data needed to calculate elastic modulus on the test specimens.
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Microelectronics And Packaging AOI
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Machine Vision Products, Inc. has extensive experience in a wide range of Microelectronics and Packaging applications. MVP works with the world’s leading manufacturers on a global basis. From multiple die and wire technologies to leadframe, ball grid array and surface inspection applications, MVP has the widest applications toolbox of any AOI provider. MVP takes pride in the fact that they supply many complex inspection solutions to diverse industries such as Automotive, Telecoms, Medical Devices, Military, and Space. MVP’s 900 Series is the base platform upon which all Microelectronics and Packaging inspection solutions are based. The 900 series 2D capabilities provide metrology and defect detection using a propriety Quad-Color lighting, Telecentric optics and resolutions down to 1um. 3D height measurement capabilities allow for in-line high speed inspection of Dies, paste deposition, positional accuracy, volume and height with a resolution down to 1.13um.
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PICO Pµlse Contact Dispense Valves
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This contact dispense valve provides many of the same benefits of the PICO Pµlse jet valve, including high-speed dispensing at up to 1000Hz continuous*. It also delivers more accurate contact dispensing with less turbulence for greater fluid deposit consistency, placement, and process control.
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Reticle Manufacturing
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An error-free reticle (also known as a photomask or mask) represents a critical element in achieving high semiconductor device yields, since reticle defects or pattern placement errors can be replicated in many die on production wafers. Reticles are built upon blanks: substrates of quartz deposited with absorber films. KLA’s portfolio of reticle inspection, metrology and data analytics systems help blank, reticle and IC manufacturers identify reticle defects and pattern placement errors, thereby reducing yield risk.
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Thin-film deposition
Plasma Source
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SPECS Surface Nano Analysis GmbH
Thin-film deposition covers any technique for depositing material onto a bulk or thin film substrate. Elemental alloy or compound films are produced by non-reactive or reactive (co-)deposition. Often functionalization or tailoring of device interfaces by predeposition or deposition assisting surface treatment with atoms or ions is necessary.
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Pure Boron Foils
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MICROMATTER™ boron foils are also produced by laser plasma ablation; however, the deposition process is much more complex and time consuming than that for diamond-like carbon. Accordingly, only thin films, mainly designed for beam stripping of heavy ions in electrostatic accelerators, are available. All films are generally delivered on glass substrates coated with a release agent.
