Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Product
Optics Test Equipment + Flatness, Bow, Warp, Curvature, Glass Thickness
Wedge Angle Scanner For Car Windshields
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Optik Elektronik Gerätetechnik GmbH
Scanning of complete car windshields for measurement of wedge angle and thickness distribution, in particular in the HUD area.
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Automotive Paint Thickness Meters
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Linshang automotive paint meter, also named paint thickness meter, is a painting thickness gauge used to test car paint thickness. Linshang automotive paint meter can identify the substrate automatically. If you devote to find a cost effective paint thickness meter, you can view the digital coating thickness gauges listed below.
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Product
2D/3D Wafer Metrology System
7980
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Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
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Product
Ultrasonic thickness gauge
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The frequency range of sound that can be heard by the human ear is about 20Hz to 20KHz, and sound waves with higher frequencies are called ultrasonic waves. In general ultrasonic flaw detection equipment, 5MHz is often used in the range of 1MHz to 20MHz as standard.
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Product
Equipment Front End Module Wafer Handler
Sigma EFEM
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Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.
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Thickness Check Calix
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For the manufacturing of a perfect cold strip, many factors are crucial. Our measuring frames specifically check the thickness-related quality parameters of the strip steel or steel sheet. Free of radioactive radiation, laser sensors are used in the cold strip areas that do not require protection measures with laser class 2, or only low precautions when using laser class 3B sensors. The installation of our measurement systems is quick and uncomplicated for our customers. The CALIX is integrated into the line with its C-shaped frame across the material flow. Our solutions with and without traversing determine all important parameters for quality assurance, including strip thickness, edge thickness, wedge or cambering, and measure the complete thickness profile. Thus, you have full process control in the current production.
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Product
Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
Thickness and Flaw Inspection
NORTEC 600
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Olympus converges its latest advancements in high-performance digital circuitry and eddy current flaw detection into one compact and durable portable unit—the new NORTEC® 600. With its crisp and vivid 5.7 inch VGA display and true full-screen mode, the NORTEC 600 is capable of producing highly visible and contrasting eddy current signals in any lighting condition.
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Wafer Inspection System
INSPECTRA® Series
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INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Underwater Thickness Gauge
Multigauge 4000
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The Multigauge 4100 and 4400 ROV Underwater Thickness Gauges mount onto most types ROV. There are two models in the range, the Multigauge 4100 which has a depth rating of 1000m and the Titanium Multigauge 4400 which has a depth rating of 4000m.
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Ultrasonic Thickness Gauge
SONOWALL® 50
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The SONOWALL 50 features a highly accurate data read out and a large measurement range. An integrated data logger and its user-friendly operation make the device ready for a wide variety of applications. The included software is a convenient tool to store and evaluate the measurements.
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Product
Hall Effect Thickness Gage
Magna-Mike 8600
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The Magna-Mike® 8600 is a portable thickness gage that uses a simple magnetic method to make reliable and repeatable measurements on nonferrous materials. Operation of the Magna-Mike is very simple. Measurements are made when its magnetic probe is held or scanned on one side of the test material and a small target ball (or disk or wire) is placed on the opposite side or dropped inside a container.
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Silicon & Compound Wafers
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Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Product
Wafer Probers
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Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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Thickness Meter for Phosphor Coating
PM200T
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PM200T is applicable for the manufacturers of fluorescent lamp. During the procedure of powdering tube, PM200T solves the problem efficiently how to control the phosphor thickness and uniformly of the tube. It becomes the important tool to reach best lumen output and save the phosphor.
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Wafer Edge Profile Measurement
WATOM
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WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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Product
Handheld Gauge for Nondestructive Coating Thickness Measurement
PHASCOPE PMP10
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The most experienced device in our tactile portfolio – reliably solves all special applications.
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Product
Wafer Chucks
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ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Ultrasonic Thickness Gauge
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Shenzhen Linshang Technology Co., Ltd.
Ultrasonic thickness gauges (ultrasonic thickness testers, ultrasonic wall thickness gauges, ultrasonic thickness meters, etc.) measure the wall thickness of materials such as steel, plastic, and more using ultrasonic technology which is ideal for measuring the effects of corrosion on metal, pipes or any structure where access is limited to one side.
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Benchtop Unit for Universal Coating Thickness Measurement
FISCHERSCOPE MMS PC2
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Multifaceted for coating thickness measurement and material testing. Universal multi-measuring system for parallel coating thickness measurement and material testing with up to eight measuring modules.
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Epi Thickness & Composition System
Element
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The Element system is the tool of record for wafer suppliers for high speed impurity mapping and epi thickness measurement. It is the only tool on the market with the unique combination of transmission and reflection based technology. This system is the industry standard for dielectric monitoring.
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Surveyor Datalogger Thickness Meter
Multigauge 5750
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Has a choice of Multiple Echo, Echo to Echo or Single Echo to cover all requirements. Measurements can be stored on the gauge and wirelessly transferred to the PC.
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Product
Inline Wafer Electrical quality Inspection
ILS-W2
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the Ultimate Wafer Electrical Quality Inspection Unit for Wafer Inspection Systems
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Product
Wafer Inspection Machine
IV-W2000
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The IV-W2000 is a wafer inspection machine that features on-the-fly scanning and inspection as well as automatic handling of 6/8/12-inch wafers. With the option to have a Chinese language UI, this machine is also known for being intuitive and user-friendly.
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EMAT Thickness Gauges
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The EMAT thickness gauge uses advanced electromagnetic-acoustic technology to measure metal thickness, even in cases where traditional methods like piezo-ultrasonic or laser-optical are not applicable.
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Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Product
Fully Automatic 4 Point Probe System for Silicon Wafer
WS-8800
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*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
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Product
Wafer Level Multi-Die Test System
ITC55WLMD
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The ITC55WLMD series of test systems has been developed by ITC to be stand-alone UIL test systems configured specifically to test on wafer. The systems include an ITC55series UIL tester and inductor box, a current limiter module and a system controller
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Thickness Gauges for Plastic films & Paper
CHY-CA
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CHY-CA is a highly precise thickness gauge with mechanical contact method, which can be used to measure the thickness of films, sheeting, paper, corrugated paperboard, textiles, non-woven fabrics, and solid insulation materials, etc.
