Wafer Mapping
Identify semiconductor performace across a wafer.
See Also: Wafer, Mapping, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Probes, Wafer Probers, Wafer Inspection, Wafer Maps
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Ultrasonic Wafer Scanner
AutoWafer
Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Phased Array Corrosion Mapping Software
Concerto
Concerto is a UT acquisition and analysis software specially designed for Phased Array corrosion mapping. For the tough field conditions that operators deal with Concerto features no menu, less than 18 icons, and few controls so that operators can easily work and not be bothered by complex GUIs. Concerto is simple and easy to work with yet WT, Surface, and back wall C-scan can still be analyzed and setting can be changed using the same acquired data.
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Contactless One-Point Wafer Thickness Gauge
MX 30x
The MX30x series are manual one-point Thickness gauges for silicon wafers.
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Half-Cell Corrosion Mapping
XCell
Giatec XCell™ is a smart tablet-based NDT probe for fast, accurate and efficient detection and on-site analysis of corrosion in reinforced concrete structures. Giatec XCell™ meets all the requirements of the ASTM C876 standard specification.
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Solar Wafer Transfer Tool
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Solar Wafer Transfer Tool
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Portable Wafer Probe Station
PS-5026B
High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
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Wafer Probe Loadboards/PIB
DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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Validation, Mapping and other Services for GxP Regulated Applications
The individuality of your GxP application may require a variety of function-specific settings and measurement systems. Benefit from our know-how and let our application engineers design the optimal measuring system for you. With our consulting services in GxP, we support you from project planning (URS) to implementation and testing of your system. This ensures an optimal and efficient design.
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Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Wafer Probers
Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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Locate and Map Underground Utilities
UtilityScan DF
Geophysical Survey Systems, Inc.
UtilityScan DF incorporates our innovative dual-frequency digital antenna (300 and 800 MHz) and an easy-to-use touchscreen interface to view shallow and deep targets simultaneously in a single scan.
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Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
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In-situ Wafer Temperature Monitoring
CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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High Resolution Thickness & Surface Profiler for as-sawn Wafers
MX 70x
The MX 70x series measure Thickness, Warp, Waviness, Roughness and are usable for nanotopography.
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Wafer Prober Networking System
PN-300
The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
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WAFER MVM-SEM® E3300 Series
E3310
The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Pressure Mapping
CONFORMAT® SYSTEM FOR R&D
Tactile pressure measurement system utilizing a fully conforming array pressure sensor.
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Automated Wafer Prober for Magnetic Devices and Sensors
Hprobe design and fabricate turnkey automated testing equipment (ATE) for electrical characterization and testing of integrated circuits under magnetic field such as MRAM (Magnetic Random Access Memory) and sensors. In each phase of the technology and product development as well as during mass manufacturing, a dedicated magnetic tester is available.
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Wafer Inspection System
AutoWafer Pro™
AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Wafer Auto Line Integration
The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
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PORTABLE PRESSURE MAPPING
I-SCAN® HANDHELD SYSTEM
Handheld pressure measurement system for collecting tactile pressure data.
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Wafer Inspection System
INSPECTRA® Series
INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Continuous Surface Current Mapping & Wave Monitoring System
SeaSonde
The SeaSonde HF radar system by CODAR Ocean Sensors is your solution for making continuous, wide-area ocean observations. The SeaSonde will provide you with years of real-time data over large coverage areas, with ranges up to 200 km — This is not possible with any other technology!
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Wafer Analyzer
RAMANdrive
RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Wafer Inspection System
JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Single Wafer Transfer Tools
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Single Wafer Transfer Tools
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Combined Map Display Unit & Interface Unit Tester (COMED)
MS 1117
This system is used to test COMED (Combined Map Electronic Display) IFU cards. This ATE checks the LRU Status and card status and identify faulty component in the individual UUT. On fault, this suggests the possible component failure as diagnostic report, for repairing the cards.
