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Wafer Resistivity
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Semiconductor Metrology Systems
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Hand Held Probe Type Eddy Current Sheet Resistance/resistivity Measurement Instrument
EC-80P (Portable)
*Auto-measurement start by probe head contacting to sample*3 measurement modes for wafer resistivity, bulk resistivity and sheet resistance*Easy set up to measurement condition by JOG dial*5 types of model for each measuring range*Resistivity probe can be changed by sample’s resistivity range
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Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Wafer Test
Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Wafer Manufacturing
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Resistance & Resistivity Probes
Surface and/or volume resistance measurements are key parameters in describing materials' electrical properties. ETS offers a variety of probes to support numerous industry requirements and applications.
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4-Probe Resistivity and Resistance Tester
HS-MPRT-5
t used for measuring resistivity of silicon rods and wafers, and sheet resistance of diffused layers, epitaxial layers, LTO conductive films and conductive rubbers, etc.
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Wafer Tester
Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Stand Alone Wafer Sorter
MicroSORT
The Microtronic MicroSORT semiconductor wafer sorter is designed to maximize throughput while minimizing wafer handling in a user-friendly operating environment. This stand-alone semiconductor wafer sorter enables sophisticated semiconductor wafer sorter routines for up to 4 wafer-cassette platforms. MicroSORT semiconductor wafer sorter reads OCR scribes from the top, bottom, or simultaneously, allowing for enhanced semiconductor wafer tracking and sorting. The MicroSORT semiconductor wafer sorter’s basic functions include the ability to move, compress, randomize, find, align, verify, and split semiconductor wafer lots. With our virtual tweezer mode, an operator can click on wafer icons to move wafers between cassettes, read semiconductor wafers, and swap wafer positions.
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Ground Resistance
Provide accurate and reliable measurements of both ground resistance and soil resistivity for installation and troubleshooting.
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In-situ Wafer Temperature Monitoring
CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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Resistance Welding
Resistance welding is a method in which the welding works are heated by resistance heat generated by sandwiching the welding workpieces with welding electrodes, passing current through them, and the metal is welded while pressurizing the works.A resistance welding machine composed of welding power supply, a weld head and an electrode. The welding power supply controls a welding current,the weld head exerts a pressure on the material to weld and the electrode provides welding current and pressurization force to the part under welding. We have been providing various kinds of welding power supplies and welding heads to meet these requirements.
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Wafer Test Solutions
Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer and other advanced packages.
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Non-contact Sheet Resistance /resistivity Measurement Instrument
EC-80
*Easy operation and compact design*Auto-measurement start by inserting a wafer under the probe*Easy set up to measurement condition by JOG dial*5 types of model for each measuring range
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Wafer Demounting And Cleaning Machines
Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
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Bare Wafer Inspection System
LS-6700
Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
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Resistance Meter
MT16-4L
М-module МТ16-4Л is a mezzanine module (hereinafter referred to as a mezzanine), designed to measure the resistance of resistive sensors using a four-wire measurement circuit in sixteen channels (sixteen-channel digitizer). М-module МТ16-4Л is installed on the mezzanine carrier - module НМ-М and is connected to it via a local information highway. Up to four mezzanines of various types can be installed on the NM-M module. The NM-M module, together with the mezzanines installed on it, forms a VXI module of the C-1 size and is used to create information measuring VXI systems.
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Wafer Probe Heads
WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
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Resistance Meter
MS8-2L
M-module MC8-2L is a mezzanine module designed to measure resistance using a two-wire measurement scheme in eight channels (eight-channel digitizer). М-module МС8-2Л is installed on the mezzanine carrier - NM module and is connected to it via a local information highway. Up to four m-modules of various types can be installed on the HM module. The NM module, together with the m-modules installed on it, forms a VXI module of size C-1 and is used to create information measuring VXI systems.
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Concrete Surface Resistivity
Surf
Giatec Surf™ is a laboratory test device for rapid, easy and accurate measurement of the surface electrical resistivity of concrete based on the four-probe (Wenner-Array) technique. The Surf™ patented technology automatically measures resistivity around the concrete specimen using four channels of 4-probe array (located at 90° from each other). The PC software generates the required reports according to the standard specifications.
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Photonics Wafer Probing Test System
58635
The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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Insulation Resistance Tester
250-1000V
Wuhan Fanke Transformer Manufacture Co., LTD
Professional Insulation Resistance Tester, 250-1000V
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Concrete Bulk Resistivity
RCON
Giatec RCON™ is a non-destructive device for measuring the electrical resistivity of concrete specimens in the laboratory without any additional sample preparation requirements. This measurement can easily be made on the same concrete samples that are currently used for the compressive strength testing of concrete.
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Earth Resistance & Resistivity Meter (for 50Hz mains)
MRU-120
* earth resistance measurment with 3-pole,4-pole method, * earth resistance measurement without disconnecting measured earths (using clamp), * continuity of equipotential bondings and protecting conductors * two clamps earth resistance measurement without auxiliary test probs, * earth resistivity measurement,
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Resistance Substitution Box
RS Series
The RS Series Resistance Substitution Box is the most commonly used decade box on the market today. The RS Series is not only easier to use, but it is also priced lower than most its competition.
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Wafer Level Multi-Die Test System
ITC55WLMD
The ITC55WLMD series of test systems has been developed by ITC to be stand-alone UIL test systems configured specifically to test on wafer. The systems include an ITC55series UIL tester and inductor box, a current limiter module and a system controller
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Electrical Resistivity Instrumentation
The resistivity survey method is more than 100 years old and is one of the most commonly used geophysical exploration methods (Reynolds, 1997). It has been used to image targets from the millimeter scale to structures with dimensions of kilometers (Linderholm et al., 2008; Storz et al., 2000).
