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SoC
A complete computer "System on a Chip".
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Computer-On-Module
ETX®
ETX is one of the earliest successful computer-on-module form factors. Today it is still widely used in applications such as industrial automation, transportation and medium and low level medical appliances. While high-end Intel® Core™ applications have mostly migrated to COM Express, ETX is still very much alive in the lower power segment, mostly notably using Intel Atom® SoCs.
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Ultra-Low Power Computing Module
CM22303
LinkedHope Intelligent Technologies Co.,Ltd.
CM22303 uses Intel® 7th generation Kaby Lake-Y platform and Core M Ultra low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.6 GHz and the display output resolution can be up to 4K. CM22303 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. SPI BIOS is designed on board to support dual-channel low voltage on board memory (up to 16GB), Gigabit Ethernet, TPM module and other functions. With high-performance and low power consumption, it can be widely used in the field of low power embedded systems. Meanwhile, CM22303 adopts COM Express standard and is compatible with Type10 pin out definition, and also provides rich peripheral interfaces such as USB3.0/2.0, PCIe, SATA, HD Audio etc.
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COM Express Mini Size Type 10 Module with Intel Atom® E3800 Series SoC or Celeron Processors (formerly Bay Trail)
nanoX-BT
The nanoX-BT is a COM Express COM.0 R2.1 Type 10 module supporting Intel Atom® processor E3800 Series and Intel® Celeron® N2930/J1900 processor SoC (codename: Bay Trail).
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COM Express Compact Size Type 6 Module with Next Generation Intel Atom® Processor SoC
cExpress-EL
ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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VS Tool Suite for Virtual Scan Synthesis and ATPG
VirtualScan
VirtualScan is SynTest's solution to combat increase in test data volume and test cycle volume. With VirtualScan (VS) an extremely large number of short scan chains within the SOC can be virtually accessed from outside the chip with a limited number of pins assigned as scan pins.
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Automatic Constraints Compiler & Manager
ConMan
ConMan is the first commercially available formal constraints compiler tool that automatically generates SDC for any level of hierarchy and for any mode of a SoC, thereby significantly shortening the timing closure cycle. ConMan provides an intuitive means of automatically compiling and managing sign-off quality correct-by-construction timing constraints for all applications.
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Signal Board Computers
PX1-C415
WINSYSTEMS’ PX1-C415 single board computer (SBC) is a PC104 form factor SBC with PCIe/104™ OneBank™ expansion featuring the latest generation Intel® Atom™ E3900 series SOC processors (formerly known as Apollo Lake-I). Its small size, rugged design and extended operational temperature make it a great fit for Industrial IoT applications and embedded systems in the industrial control, transportation, Mil/COTS, and energy markets.
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COM-HPC Server Type Size E Reference Development Platform based on Ampere® Altra® SoC
Ampere Altra Developer Platform
Backed by a broad Arm® ecosystem with an Ampere® Altra® SoC at its core, using the Arm® Neoverse™ N1 platform, the Ampere Altra Developer Platform provides premium performance from a cloud-to-edge infrastructure, keeps an extremely low thermal envelope, lower TCO, and significantly lower power consumption than x86 designs. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.
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Linux-based Development Platform For The GridARM™ ΜController
PEAK gridARM Evaluation Board
The ARM7 microcontroller gridARM™ was developed by Grid Connect® as a system on a chip solution (SoC) for the implementation of embedded applications with a focus on industrial communication. The Evaluation Board PEAK-gridARM is a Linux-based development platform for the gridARM™ microcontroller. It has connections for Gigabit Ethernet, high-speed CAN, USB 2.0, RS-232, SPI and I²C. The digital and analog inputs of the evaluation board can be manipulated with buttons and potentiometers. The states of the microcontroller, the supply and the message traffic are displayed via LEDs. A board support package for Linux enables access to the hardware resources of the PEAK-gridARM evaluation board.
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QSeven
ROM-7420
ROM-7420 Qseven Module integrates an ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips with Linux. NXP i.MX6 supports 2D, 3D graphicsacceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
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Automotive System-on-Chip (SoC)
R-Car
"R-Car" is the nickname for Renesas' system-on-chip (SoC) family for car information systems designed for the next-generation of automotive computing for the age of autonomous vehicles.
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Cyber Crisis Simulator
When responding to a cyber crisis, the C-Suite no longer works in a silo. Executive management continuously collaborates with incident response and SOC teams to make well-informed decisions. But tabletop exercises and conventional crisis simulation platforms do not prepare for this new reality.
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Cladding Alignment Splicer
95EA
OFS-95EA optical fiber fusion splicer is designed with high-speed image processing technology and special precision-positioning technology. It will automatically finish the whole fiber fusion process in 9 seconds by fast mode, and splice loss is lower than 0.02dB for single mode fiber. 3.5-inch LCD, dual CMOS monitors, X and Y axis separately display or simultaneously display, thus different fusion stages can be showed clearly. It is compatible with ITU-T SM/MM/DS/NZDS/ED fiber, and is equipped with 4-in-1 holders and SOC adapter.
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Rugged PC Compatible
SYS-427X
WINSYSTEMS’ SYS-427X is a rugged, fanless industrial computer with the Intel® Apollo Lake-I SOC quad-core processor. Its compact size, low power, and extended operational temperature make it a great fit for rugged embedded systems in the industrial control, transportation, energy, and IIoT markets. In addition to the standard system configuration, three optional configurations are available, adding WiFi 6, CAN Bus, or both.
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3D-IC Solution
Consumer demand for increased bandwidth and low power in smaller form factor has forced design teams to pursue design and manufacturing alternatives to single system-on-chip (SoC) approaches. Moving to advanced geometries like 20nm/14nm is a natural progression; however, it has its own cost, yield, manufacturing, and IP reuse challenges.
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COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs
Express-BD74
- 4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)- Intel® Xeon® D SoC (up to 16 cores)- Two 10G Ethernet and NC-SI support- Up to 32 PCIe lanes (24x Gen3, 8x Gen2)- GbE, two SATA 6 Gb/s, four USB 3.0/2.0- Supports Smart Embedded Management Agent (SEMA®) functions
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Semiconductor Testers
Designing and manufacturing scalable Automated Test Equipment (ATE) targeted at testing SOC, MCU, RF PA/FEM, Sensors/MEMS and Power and Analog devices
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Intel® 5th Generation Xeon Processor, AMC
AMC752
The AMC752 is a Processor AMC in a single module, mid-size based on the Intel® 5th generation Xeon (Broadwell). The efficient SoC design has low power consumption and integrated PCH technology. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
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COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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SMARC V2.0 SoM Evaluation Kit With I.MX8M Quad/Dual 1.5 GHz/1.3 GHz (Industrial) SoC, 4GB Memory, 64GB EMMC, CAN, MIPI CSI/DSI, And HDMI 2.0
SCM180-180-EVK
*Ultra-Low Power i.MX8M Dual/Quad A53 Core*Single M4 Core*HDMI 2.0a up to 4K*Dual Channel LVDS*MIPI CSI*10/100/1000 Mbps Ethernet*USB3.0, USB OTG*PCIe 2.0*CAN 2.0B*Audio
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SMARC Short Size Module with Qualcomm® QRB5165 Series octa-core SoC
LEC-RB5
The ADLINK LEC-RB5 is a SMARC module powered by the Qualcomm® QRB5165 SoC with 8 Arm Cortex-A77 cores and up to 15 TOPS Qualcomm® Hexagon™ Tensor Accelerator. The module is designed for robotics and drone applications and integrates several IoT technologies in a single solution. The LEC-RB5 SMARC module provides on-device artificial intelligence (AI) capabilities, support for up to 6 cameras, and low power consumption. It is capable of powering robots and drones in consumer, enterprise, defense, industrial and logistics sectors.
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ETX Module with Intel Atom® Processor E3800 Series SoC (formerly codename: Bay Trail)
ETX-BT
The ETX-BT is based on the latest Intel Atom® processor E3800 SoC series, adopting the latest 22nm process technology with 3-D Tri-Gate transistors featuring significant improvements in computational performance and energy efficiency. The E3800 SOC series integrates processor and GPU cores and all I/O on a single chip. Processor performance is scalable from a single-core Intel Atom® processor E3815 at 1.4GHz to a quad-core Intel Atom® processor E3845 at 1.9GHz. Two quad-core Intel® Celeron® processors, based on the same microarchitecture, are also available.
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I-Pi SMARC IoT Development Kit Based On Intel® 7th Gen Atom® X7433RE Quad-Core SoC
I-Pi SMARC Amston Lake
The I-Pi SMARC Amston Lake is a SMARC-based edge solution devkit powered by power-efficient Intel Atom x7433RE quad-core SoC with integrated Intel UHD graphics with 32 EUs, deep learning inference capabilities, industrial grade durability and comprehensive high-speed interfaces.
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Fanless Embedded System With Intel® Celeron® 2980U/ Core™ I5-4300U/i3-5010U ULT SoC, HDMI/DisplayPort, 2 GbE LANs, 4 USB 3.0, 2 COM And PCIe Mini Card
eBOX560-880-FL
The eBOX560-880-FL, a palm-sized, fanless embedded computing system utilizes high performance Intel® Haswell ULT multi-core SoC. The ultra-compact, ultra-lightweight eBOX560-880-FL adopts an IP40-rated rugged aluminum cold-rolled steel enclosure to withstand vibration of up to 3 Grms (with SSD) and has a unique thermal solution to support the temperature range from -20°C to +50°C (-4°F to +122°F). Supporting 4K2K resolution via HDMI interface, the outstanding embedded box computer is ideal for passenger information system, Kiosk, entry-level gaming, video surveillance, and other automation & embedded applications.
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FRAMOS SLVS-EC RX IP CORE
Sony’s SLVS-EC interface standard has emerged as the best high speed interface to Sony’s best image sensors, enabling higher throughput, greater signal integrity, and simpler designs. Engineers developing solutions using Xilinx FPGAs and SoCs can take advantage of FRAMOS’s SLVS-EC RX IP Core, Evaluation Board and tested source code examples. Device builders and camera vendors can de-risk the design while reaping the benefits of Sony’s latest high-speed interface.
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(IoT) Wireless Module
SX-59HLS
The SX-59HLS is an ultra-low power Hosted Dual Band 1x1 802.11a/b/g/n Internet-of-Things (IoT) wireless module based on the Qualcomm QCA4012-2 System-on-Chip (SoC). The SX-59HLS is a first in its class to provide enterprise security for today’s high performing networks.
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SMARC
ROM-5880
Advantech ROM-5880 SMARC 2.1 Computer-on-Module is powered by the Rockchip RK3568 SOC, which includes a Quad-Core Arm Cortex-A55 processor and Arm Mali-G52 3D graphics engine. It provides a rich display interface: HDMI 4K @ 60Hz, LVDS or DSI, or eDP to meet specific requirements. It also features USB 3.0, PCIe 3.0, SATA, Gigabit Ethernet, and MIPI-CSI for embedded applications. It is the ideal solution for POS, vending, infotainment, and medical applications
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SMARC Module
LEC-MTK-I1200
The ADLINK LEC-MKT-I1200 is a SMARC module powered by the MediaTek MT8395 SoC with 4x Arm Cortex-A78 and 4x Cortex-A55 cores and up to 5 TOPS APU. The module incorporates a spate of IoT technologies, such as on-device artificial intelligence (AI) capabilities and support for up to 3 cameras, while delivering a low power envelope, making it the ideal solution for robotic and drone applications across various sectors, including consumer, enterprise, defense, industrial, logistics, and more.
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Mini-ITX With Intel® Celeron® Processor J1900 (up To 2.42 GHz), VGA/HDMI/LVDS, USB 3.0, Mini PCIe Card And HD Audio
MANO842
The MANO842 Mini-ITX motherboard features quad-core SoC, fanless design, advanced graphics performance, and 12VDC/STD ATX power input. The powerful MANO842 is equipped with a quad-core Intel® Celeron® J1900 processor with Intel® HD Graphics engine, delivering outstanding computing, graphics and media performance at a competitive price. The cost-effective industrial-grade motherboard utilizes high bandwidth DDR3L-1333 SO-DIMM with system memory up to 8 GB and a rich set of I/O features. With 12V single voltage DC power or STD ATX jack, the ultra-compact Mini-ITX mainboard can be widely applied to automation and embedded industries, including medical healthcare, in-vehicle infotainment, kiosk, digital entertainment, digital signage, POS and much more.
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Architecture P4040/4080 Processor
VME-186
Curtiss-Wright Defense Solutions
The VME-186 VME Single Board Computer is based on NXP's high-performance QorIQ P4080 SOC multi-core processor. With four or eight Power Architecture cores running up to 1.5 GHz, and up to 8 GB of high bandwidth DDR3 SDRAM, the VME-186 SBC provides processing and a variety I/O interfaces to satisfy the most demanding requirements of embedded computing.
