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SMT
"Surface Mount Technology" printed circuit board testing. AKA: Surface Mount Technology
See Also: QFN
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High Flexible Inline AXI Platform
AXI X# Series
The X#-platform series is an inline automated X-ray system which covers a wide range of AXI applications. It is a flexible platform with very versatile fields of use depending on the application requirements. The inspectable applications range from component level inspection for wire bonds, large SMT boards, high-power electronic modules up to fully assembled modules.
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Prototyping Adapters/Interposers
Prototyping adapters breakout from any package type to 2.54mm pitch pins or a larger pitch SMT footprint to solder to your development board. Our extensive design library means that many are available for fast delivery or next day from RS Components.
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Inline AOI Machine
Sherlock-300I
Add PCB inspection to your automated production line, pre- or post-reflow, and speed up your process. Inline Sherlock 300I AOI system inspects components and solder joints on SMT, through-hole and mixed-technology boards and communicates with downstream equipment for automatic good/bad board sorting. The user interface is 100% touch control—as easy to use as a tablet.
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Near Zero Footprint SMT Spring Pin Sockets
Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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Preselectors
BSC have full design expertise in house to offer a range of preselectors suitable for any receiving system. Products can be offered in traditional machined and laser sealed aluminium bodies or in ultra-compact true SMT form factor, matched to carrier PCB’s.
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RF/Microwave Assembly Capability
Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
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Up Converters
Macom Technology Solutions Holdings Inc.
MACOM's upconverters are widely used in point-to-point radio, broadband communications, and RADAR applications. Operating up to a frequency of 86 GHz, our upconverters feature an integrated image reject (balanced) mixer, LO buffer, and RF buffer. Some products also include LO multiplication and variable gain, all within a single chip. Available in die, or SMT lead-free QFN and LGA packages, our upconverters boast excellent performance with adjustable bias, high linearity and image rejection with low LO leakage
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3D SPI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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DCDC
QQA Series
The QQA series features the latest in MOSFET design, state of the art surface mount technology, and offers a 4:1 ultra-wide input range, and efficiencies greater than 80% (typ). Features include continuous short circuit protection, 500 Vdc I/O isolation, and an operating temperature range of -25°C to +71°C with no derating. All models are packaged in a six-sided shielded miniature case measuring only 1.0” x 2.0” x 0.4” high.
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Deluxe Test Lead Set For The 3458A
34137A
Set includes 2 retractable sheaths, 2 fine tip probes, 2 SMT grabbers, and 1 mini grabber; works with the 3458A DMM
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5G 256-Element Active Antenna Innovator’s Kit
AWA-0134
The AWA-0134 is an active array for 5G wireless applications developed using planar antenna technology resulting in a very low profile, lightweight unit. The surface mount assembled antenna board is based on Anokiwave’s AWMF-0108 Silicon Quad Core IC and demonstrates the performance achievable using low power silicon integration and efficient antenna layout and design. Using the AWMF-0108, the antenna provides +60dBmi (1000 W) of EIRP. The electronic 2D beam steering is achieved using analog RF beam forming, with independent phase and gain control in both Tx and Rx operating modes. The AWA-0134 antenna leads the way in showing how 5G coverage can be rolled out by network operators using the mmW bands, with low power footprint and high energy efficiency, while meeting key operating specifications for data rate, latency, coverage, and reliability.
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Composite Inductors
Composite inductors are constructed by inserting a pre-wound coil over pre-press magnetic core and then pressing or molding a magnetic material around this assembly. The composite inductors are very similar to molded but typically offer lower DCR and lower overall losses. Our composite core inductors provide a fully shielded, high energy density, soft saturation solution for applications up to 120Apk. The construction enables the highest energy density of any available SMT inductors and also minimizes acoustic noise. We offer both commercial grade (-40C to 125C) and automotive grade (-55C to 155) in a wide range of platforms from 4x4x2mm to 17x16x13mm.
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KV CAPS
1000 V
Macom Technology Solutions Holdings Inc.
The MACOM KV CAPS™ Si high voltage capacitors feature very high working voltage ratings, very low loss and excellent stability by virtue of their novel internal construction and very high-quality dielectric layers. These capacitors are available in surface mount (SMT) plastic packages or in hermetic ceramic packages.
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RF/Microwave Assembly Capability
Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.
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2.5 GHz Non-Latching DPDT
GRF172
Centigrid hermetically sealed package, SMT straight-lead mounted, non-latching DPDT Bandwidth: DC - 2.5GHzAvailable options include:GRF172D - transient protection diode
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SPI | AOI | AXI
Suitable for a wide variety of SMT applications, Omron’s automated inspection solutions are designed to ensure the highest degree of quality and consistency in PCB production.
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Round Wire Coil Inductors
Round wire coil (RWC) inductors come in six platform sizes and enable the highest efficiency of any SMT inductor through the use of a low loss ferrite core material which minimizes AC losses and also eliminates thermal ageing. The use of round magnetic wire instead of rectangular flat coils enables a lower cost while still maintaining a low DCR and small footprint. The platforms have passed the AEC-Q200 stress test qualification proving the designs robustness and suitability to difficult environments but the parts are not IATF certified. The platform range from 7.6×7.4×6.4mm to 26x26x15mm and are suitable for a wide range of applications and markets including communications, computing and industrial.
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Test Solutions Services
Spinnaker Contract Manufacturing, Inc.
As standard practice, all of our SMT assemblies are washed and tested through our Automated Optical Inspection and pass through our stringent internal QA/QC policies. In Cables and Wire Harnesses, pretests, such as pull tests and crimp type tests, are performed on all builds before being tested for continuity, hi-pot, shorts and mis-wires, to name a few. Our electromechanical assemblies are capable of receiving full functional testing through custom test fixtures and RF test. Some RF tests include Gain/Loss, Frequency Response, VSWR (Voltage Standing Wave Ratio), Inter-Modulation Distortion and Output Power.
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Mek Selective 3D AOI
Every one of our desktop AOI and inline AOI systems is optimised for the demands of today’s advanced SMT applications and critical manufacturing environments. All are capable of delivering Selective 3D, using our unique stereoscopic imaging from the 9 cameras of the GTAz /GDAz optical heads.
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SMT Surface Mount MEMS High-G Shock Accelerometers
Piezoresistive MEMS high-amplitude shock accelerometers represent state-of-the-art industry technology for miniature, high amplitude, DC response acceleration sensors. This series is capable of measuring long duration transient motion as well as responding to and surviving extremely fast rise times, typical of a high-g shock event as found in explosive, gun and impact testing. Both packaged and OEM configurations are offered, to fulfill a variety of installation requirements.
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0.6" SMT Synthesizer
ZLX Series 0.6” x 0.6” x 0.15”
*Surface Mount Miniature Package *Excellent Phase Noise *Optional Internal Reference *Output Power to +10 dBm Available
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Surface Mount Package Emulation
SMT Adapters
Ironwood’s SMT package emulation adapters are often called “surface mount feet” or “emulator bases”. These adapters provide access and interconnections to surface mount lands. Typically, the adapters are soldered to the target board in place of the IC device and provide a pluggable array of pins interface for sockets, probing adapters, package converters, and even board-to-board connections. These adapters are often utilized as a base for many of our probing adapter products. We constantly innovate to provide the most reliable, cost effective interfaces available. For example, many of our PLCC, QFP and SOIC emulation bases use our proprietary shaped solder techniques, replacing expensive, and often fragile, J-lead and Gull Wing leads. Shaped solder parts are easily fluxed and reflowed onto the target system. Our emulator bases can present either a male or female interface at 1.27mm or 1mm or 0.8mm pitch gold plated array pins for pluggable connection.
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18 GHz Latching SPDT
Part No.s GRF121A, GR121AR
Extended-Centigrid hermetically sealed package, SMT straight-lead mounted, magnetic-latching SPDT, with ungrounded contacts, and a common coil negativeBandwidth: DC - 18GHz Signal Integrity: 40Gbps Available options include:GRF121AR - common coil positiveResistive: 0.25A /28Vdc
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6 GHz Non-Latching DPDT
Part No.s SGRF300, SGRF303
TO-5 hermetically sealed package, SMT J-lead mounted, non -latching, DPDT, with high insertion loss repeatabilityBandwidth: DC - 6GHzSignal Integrity up to 18GbpsResistive: 1A /28Vdc
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10-Zone SMT Reflow Oven
CR10000
10 fully controlled upper and lower convection heating zones allow the CR10000 SMT reflow oven to provide you with a thermal accuracy of ±1˚C. Manncorp’s low-velocity, low-turbulence air flow options produce an even ΔT of ±2°C across PCB assemblies out to 22” (570 mm) wide edge-to-edge backed by throughput that can still keep pace with your high-volume production needs.
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Fine Pitch Stencil Printer
MC110
MC110 SMT stencil printer offers quick and easy setup via tooling hole or edge mounting for both single and double-sided boards. Exceptional build quality, with a heavy-duty cast aluminum base, ensures stability and repeatability.
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Tx/Rx BenchBlade
This ATCA compatible test card offers the flexibility to verify the performance of Advanced TCA fabric and base channels. The set of four Transmit pairs and four Receive pairs allows access to a full channel's eight pairs for logic card characterization. The card includes a HM-ZD male right angle connector segment for access to the Zone 2 connectors of a switch fabric or node card. Edge-launch SMA connectors are utilized for ease of test cable attachment. SMT pads are included on the receive pairs.
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VME 32X 5 Slot 6U
ANSI/VITAV 1-1994 VME32 Backplane, 6U 5 Slot Including J1 & J2.Benefits:• Standard VME backplanes are available also in other slot count configurations• Surface Mount Technology – Excellent high frequency performance, high reliability and reduced cost due to SMT
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Voltage Variable Attenuators
Macom Technology Solutions Holdings Inc.
Voltage Variable Attenuators (VVA) from MACOM offer the ability to control the attenuation level relative to a voltage. Attenuation range is up to 30 dB covering frequency as high as 45 GHz. VVAs feature excellent return and insertion loss along with high IP3 in small SMT packages.