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Probe Cards
semiconductor bond pad and signal terminals interchangeable electro-mechano Interface to tester.
See Also: Cards, Extender Cards, POST Cards, Test Cards, Probe Card Interfaces, Wafer, Test Probes
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Probe Cards
LCD Driver
LCD Driver devices are utilized in some of the most popular high definition tech products such as LCD televisions, high functioning smart phones and tablets.
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Complete Power Analysis System
PK3564-PRO+
PK3564-PRO+ complete Power Analysis System includes PS3550 Power Analyzer, AC charger, Quick-Start manual, deluxe voltage leads, four eFX6000 flexible current probes, SD memory card, PSM-A Software, Mini Line-to-DC Converter, Bluetooth Adapter, USB Communications Cable, CASW Weather-Resistant Carrying/Operating Case, and 2-year deluxe warranty.
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High-Speed Trimming System
LSR-3230
* no fixture or probe cards on top side * 2, 4, and 6 wire test capability * touch screen operation * high performance DC electrical tester * high throughput - low running cost
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PROBE CARD
the electrical characteristics of the individual CHIPs in WAFER that have been completed through the FAB stage during the semiconductor fabrication process
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Low-leakage Switch Matrix Family
Conducting all the parametric measurements necessary for the numerous test structures on a semiconductor wafer can be a time-consuming and expensive process. With the cost of end-user devices continuing to drop, even laboratory characterization environments must reduce the cost of test. Until now engineers and scientists working on current and future semiconductor process technologies were faced with a difficult choice: either use a semiconductor parameter analyzer with positioners on a wafer prober, which limits the ability to perform automated test, or use a switching matrix and probe card, which reduced the analyzer's measurement resolution. Utilizing a switching matrix with a semi-automatic or fully-automatic wafer prober enables characterization tests to be automated, eliminating the need to have an operator manually reposition the probes each time a new module needs to be tested. This reduces both test time and cost. Due to the many price/performance points available, Keysight's switching matrix solutions provide the flexibility to choose exactly what your testing needs require, without overspending.
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AUTOMATED TEST STAND DESIGN
Automated test systems may be as simple as a laptop with a DAQ module or a stand-alone controller, but they typically require a mix of off-the-shelf and custom hardware. All that hardware is integrated and wired into a test stand. Portable or mobile test stands are ideal for in-the-field research and development and servicing of multiple laboratories or manufacturing lines. Test stand access to the front panels of hardware and subcomponents allows manual configuration of non-automated settings. Quick disconnects, cable harnesses, and easy access to probes provides efficient setup and tear-down. Expandable or modular rack mount and card base systems facilitate future needs. Ergonomic considerations include keyboard and display placement, along with number of monintors. Safety is always crucial with proper E-stop placement and keeping dangerous elements away from users.
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Vertical Space Transformers
ST
The Space Transformer (ST) is an integral part of the probe card, utilized between the probe head and the PCB. Nidec SV Probe provides a wide variety of space transformation options including: • WST™ (Wired Space Transformer) • MST™ (Modular Space Transformer) • MLC (Multi-Layer Ceramic) • MLO/Mini-PCB (Multi-Layered Organic) • Multi-Site MLO Reflow of Package Substrate • MLC with MLTF to 50µm PitchOne of the main priorities for Nidec SV Probe is the internal development and manufacture of our own probe card components. We now offer in-house manufactured space transformer technologies with shorter lead time and competitive pricing. Contact your sales representative to learn more about our internally manufactured STs or any of our other ST technologies.
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FCB Probe Card
The FCB Probe Card is the most mature technology of buckling beam probe card. It is aimed to achieve the semiconductor ship manufacture time-to-market (TTM) and cost of test (COT) demand. FCB is a proven solution for a variety of semiconductor production tests from early engineering pilot-runs to high volume manufacturing (HVM). FCB is ready for device requiring high signal integrity probing (SI) and/or power integrity probing (PI). Applications include cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB guarantees the world’s best overall cost-of-ownership (COO) for various DUT applications.
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Probe Cards
PICOPROBE® PROBE CARDS by GGB Industries, Inc., allows for more chip design flexibility because each probe card is custom configured to your circuit for testing wafers on either manual or automatic probe stations. Probe cards with complex layouts consisting of numerous DC contacts and multiple microwave probes with operating frequencies of 40, 50, 67, or 110 GHz can be custom fabricated quickly and inexpensively.
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Metrology Systems
VIEW offers a full line of optical metrology systems for wafer, photomask, slider, MEMS, semiconductor package, HDD suspension, probe card, and micro-component process measurements.
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Cantilever Probe Card
MPI Cantilever Probe Card is widely applied on gold bump and pad wafer testing for display driver, logic, and memory device. MPI’s cantilever probes are the corresponding answer to the demands of fine pitch, small pad size, high speed, less cleaning, multi-DUT, high pin count, and ultra-low leakage requirements. With outstanding craftsmanship, innovative architecture and proven methodologies based on mechanical and electrical simulation/measurement results, making MPI the top cantilever provider worldwide.
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PCIe 2.0 Test Platform
PXP-100B
The Teledyne LeCroy PXP-100B Test Platform provides a convenient means for testing PCIe 2.0 add-in cards with a self-contained portable and powered passive backplane. The PXP-100B provides power required for both cards under test, and an interposer can be used for connection to a protocol analyzer. As an alternative to an interposer, the PXP-100B includes two mid-bus probe footprints to allow connection to an analyzer via a mid-bus probe.
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Probe Card
T90™ Series
The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.
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Semiconductor Test
Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
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Mid Bus Probes
MBP850
The PCIE850 provides a complete test and debug solution for PCI Express Bus. Interposers and probes connect to the PCIE850 providing access to PCI Card, AMX, XMC and VPX systems.
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Test Fixtures & Jigs
A test fixture or test jig is the component containing the bed of nails used for testing the PCB or assembled product. It is powered and controlled by the Yelo Testpoint system which has test cards capable of providing multiple test conditions. This system also controls the probes used in the bed of nails, and relays test information back to the Testpoint system to be analysed.
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Magnetic Field and Permeability Measurement
MAGNETOSCOP® 1.070
Foerster Instruments, Incorporated
The MAGNETOSCOP 1.070 is a portable magnetometer system with microprocessor and probes for measuring the magnetic flux density as an absolute or differential value (gradient). It has a USB port for simple data transfer and an SD card for saving measurement data and parameters. The measuring system also facilitates the recognition and saving of peak values and the adjustment of thresholds for limit values. The unit can be used for series and individual measurements. The data can be easily analyzed and documented with the PC software included in the scope of delivery. The MAGNETOSCOP 1.070 thus facilitates the portable and fast measurement of the relative permeability within the scope of the quality control of stainless steel and low-permeable (non-magnetic) alloys as well as the localization of ferrite enclosures. Changes in material (sulfidation, degradation of lamination, structural changes) can also be proven thanks to permeability comparative measurements.
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Probe Cards
U-Probe for Multi-die Test of Memory IC. Vertical-Probe Needle Type Probe card suitable for multi-die test of devices with peripheral pads. ertical-Probe Spring Type. Probe card suitable for area array pad test. 64DUTs Multi-Die. Probe Card for RF devices. Fine Pitch.
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LED Probes for testing
Advanced Probing Systems, Inc.
Probe Needles are used for the fabrication of most probe cards, however there exist applications for which these materials may not be appropriate, e.g., hubrid device and gold pad probing.
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DDR4 BGA Interposers, DDR4 DRAM X16 Packages
N2115A
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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Probe Card
Tile-on-Card™
Celadon’s uniquely robust and repairable patented probe-in-ceramic crash resistant probe cards reduce maintenance headaches while increasing tester utilization. Celadon’s TOC™ probe cards are known for achieving 10 million+ touch downs before rebuild on test floors worldwide.
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Expanding In-Circuit Capabilities
Circuit Check supports reading linear bar codes and 2D symbols within each of its fixture product lines.When spring-loaded probes are not practical or access is limited, Circuit Check can help you with thru-connector tests to contact connectors on any surface or edge of a circuit board. These tests can be implemented spring probes, mating connectors, sacrificial SMT connectors, and stabber cards.
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Probe Cards
These cards are compatible with WLCSP and can be customized according to pin positions. They can be used for a pitch of up to 180 μm. We are developing a product for a pitch of 150 μm, to be compatible with narrower pitches.
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Probe Card
Indexer™
The patented Indexer™ is the industry’s first automatic probe card changer designed for lights out parametric test.*Can support up to five VC20™’s with Advanced Cantilever™ technology, any variety*Card changes are complete in seconds*Fully programmable*Tested for hundreds of thousands of touchdowns.
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Cost-Effective ATE System
PRO RACK ATE
Qmax Test Technologies Pvt. Ltd.
Pro-Rack is a cost effective ATE System, which comes with Modular Structure provision option to improvise and enhance much instrumentation based on the user’s requirements. Basically it is designed to cater to the needs of PCB test and repair depots, keeping in mind the changing PCB technology and the challenges in testing them off-line. It can provide complete PCB test and diagnostic functions for any kind of PCB including the latest very high density complex PCBs with high pin count PQFP, FPGA VLSI chips. AC /DC parametric tests enables testing of the DC parametric of device pins on the edge connector for input bias current, Fan out capacity ,Tri-state leakage currents, AC parametric measurements such as Input / Output Propagation delay Rise time / Fall time to further enhance fault coverage. Pro-Rack is designed with VPC Mass Interconnect adapter with 16 bit fixture ID interface to the UUT through simple clips and probes or through card edge or through a bed of nail test fixture.
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Vertical Probe Cards
B3
The patent-pending B3™ structure requires a minimum number of parts and can handle up to 300 probes. This vertical technology can provide: • Increased Uptime • Extended Probe Lifetime • Reduced Maintenance • Lower Cost of TestThe B3™ is an ideal solution for testing small pads and the low force probes minimize scrub. Planarity also remains stable over time increasing probe card life. Contact your sales representative to learn more about our B3™ probe cards.
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Complete Power Analysis System
PK3564
PK3564 complete Power Analysis System includes PS3550 Power Analyzer, AC charger, Quick-Start manual, deluxe voltage leads, four eFX6000 flexible current probes, SD memory card, CAS3 hard-shell carrying case, PSM-A Software, and 1-year deluxe warranty.
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In-circuit Test
Medalist i1000 Systems
Cover Extend Technology (CET) is now supported on the Medalist i1000D. The i1000D only requires a VTEP MUX card to enable CET. If you are already using test fixtures with VTEP MUX cards , you can now implement CET without any fixture modification. Simply add new VTEP probes to devices that were previously not testable. This greatly reduces implementation efforts.
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Cryogenic Applications
Over the last 20 years the Celadon Engineering team has developed an expertise in cryogenic materials which has resulted in a solid reputation in the industry for producing extremely stable cryogenic on-wafer probe card as well as DUT probing solutions. These custom cryogenic probe card solutions are widely used to test Space, Military, Medical and Quantum Computing products. Celadon’s cryogenic solutions vary from standard VersaTile™ footprints which interface to positioners to innovative custom PCB based designs to allow for flexibility when testing at these very cold temperatures. Lakeshore cryogenic wire is used in standard DC solutions for high density cableout designs to support high pin count applications. During the development process, Celadon works closely with the cryogenic prober vendor to ensure the integrated solution is optimized for current and future testing needs.
