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High-Speed Precision SMU (100 FA, 60 V, 15 MSa/s)
PZ2121A
The Keysight PZ2121A is a high-speed precision source / measure unit (SMU) featuring best-in-industry narrow-pulse width, fast Digitizer Mode, and seamless current measurement ranging. It enables narrow-pulsed measurements and fast dynamic measurements with a wide dynamic range for a wide range of emerging applications such as vertical-cavity surface-emitting laser (VCSEL) optical devices, integrated circuit (IC) testing. In addition, its low measurement noise performance enables measurements with shorter aperture times, and its seamless current measurement ranging function enables a wide dynamic range and eliminates range change time, which improves test throughput.
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Steam Aging Test Chambers
Dongguan Amade Instruments Technology Co., Ltd
Steam aging test chamber is a climatic test machine used to judge the products performance to resist extreme circumstance under high temperature, high humidity and high pressure during the transportation, storage and usage. The principle is very simple, water in the tank is heated turning into steam to form a simulated test environment under specified temperature and humidity. Specimens are placed into the drawers of machine to carry out test lasting for preselected time. It is applicable to electronic connectors, semiconductor IC, transistor, LCD, diodes, resistances etc.
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FAult Detector and OScilloscope 7 Functions in 1 Device
FADOS7F1
Prot-Ar-Ge Industrial Project Design R&D Ltd. Co.
Usage of FADOS7F1: Determining faults of all types of electronic cards such as electronic cards of medical devices, textile and any other machines; automobile electronics; computer, monitor, TV, etc. Electronic Components Test: IC, transistor, FET, IGBT, resistor, capacitor, indicator, ect. This device is used to determine the faults at all these electronic components.
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Air-Cooled Universal Test Platform
Diamondx
Diamondx semiconductor test system extends Cohu’s low-cost, high-throughput production test solution platforms to high pin count, higher site count wireless, mobility, SOC, Flat Panel Display drivers, Power Management, and microcontrollers. Designed to meet the cost drivers IC companies face, Diamondx extends Cohu’s leadership in lowering the cost of operations.
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Test Socket Based Elastomeric Matrix Connectors
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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Analog IC test system
A paradigm shift has been occurred in Japan’s major brand WL25 series tester. Ultimate simple system is available by effective analog pin architecture.This cost performance system is covered analog IC extensively, which are high accuracy, speed and multi-site test function.
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Pin Point Range Systems
The PinPoint Alpha system is a flexible, adaptable and modular PCB and IC fault finding system, which allows you to apply different electronic test methods to obtain maximum test coverage and fault detection. Test signals can be applied at the PCB edge connector or through test clips and DTIs to perform fixtureless in-circuit testing.
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Develop - Simulate - Validate JTAG / IJTAG based IP
NEBULA
You, your vendors and your customers being able to use one common interface to control and observe on-chip IP, resources and instruments. The figure below shows an example IC. The new IEEE 1149.1-2013 standard supports an init-data register for configuring the analog paramaters of I/O as well as controlling on-chip PLLs. The standard further extends this by defining in BSDL user test data registers or 'scan chains'. These registers enable the ability of generic software to control and observe mission mode IP and instruments simply by describing the register interface in BSDL.
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Low Noise Test Leads For N1413 With B2980 Series, 3m
N1425B
The N1425B is designed to operate specifically with the B2985B/87B. It can hold DUTs with large terminals being used with the N1426C. The N1426A with the N1425B is available for measurements of small DUTs such as PC boards or IC sockets. The N1426B with the N1425B enables the construction of simple custom-made test leads. The N1413A High Resistance Meter Fixture Adapter is also required to connect the N1425B to the B2985B/87B.
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Dual PCM Tester
MS-177
This equipment is used for PCM function test to check thestate ofsingle IC PCM as well as dual IC PCM. It is applied for only 1Cell PCM and can consist ofup to 40 Channels.
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Near Zero Footprint SMT Spring Pin Sockets
Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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IC Test Services
With knowledge gathered from decades of supporting Tier 1 and emerging industry leaders, Amkor understands test solutions must address advanced technology, quality, performance and cost of test. We offer full turnkey solutions including wafer processing, advanced bump, wafer probe, assembly, final test, system-level test, burn-in and end-of-line services.
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Design-for-Test And Semiconductor Data Analytics
Mentor’s comprehensive solution for IC test, including best-in-class design-for-test tools and test data analytics that help ensure the highest test coverage, accelerate yield ramp and improve the quality and reliability of manufactured parts.
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Emulation & Test Interface
Solder down modules to suit any package type provides a cost effective solution for replacement test heads, male or female. The mating top modules can incorporate either a ZIF or standard IC socket and the addition of optional test pins if required from RS Components.
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VLSI Test System
3380D
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (256 I/O pins to test 256 ICs in parallel) that can meet the upcoming higher IC testing demands.
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Grypper
Grypper
*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to or smaller than the IC package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*No lid required: The package snaps directly without a lid, enabling easy probing, scoping and troubleshooting the topside of the device*Excellent signal performance: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection
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High-Throughput Film Frame Handler
MCT FH-1200
FH-1200™ film frame test handler is designed to handle leadless devices mounted on film frame, such as QFN, DFN, WLCSP, BGA, µBGA and eWLB packages. The FH-1200 enables high parallelism testing of post-saw IC devices at ambient temperature. It can accommodate 200 mm and 300 mm wafer rings and custom shapes onto which multiple strips can be mounted. No change kits are required regardless of package size (if same frame is used).
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Failure Analysis
A partial list of our state of the art test equipment, applicable to these testing disciplines, will include the following: Two Scanning Electron Microscopes with EDS (SEM/EDS) Three Differential Scanning Calorimeters (DSC) Three Thermogravimetric Analyzers (TGA) Three Thermo Mechanical Analyzers (TMA) One Dynamic Mechanical Analyzer (DMA) Two Real-Time Fluoroscopic X-ray Systems, including a Microfocus System One Fourier Transform Infrared Microscope (FTIR) (capable of identifying a single particle of an unknown material) Two Ion Chromatographs (IC) (capable of identifying ionic impurities in ppm)
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IC Tester
ICE1
The IC Test System was developed to measure the EMC behavior of circuits (ICs) in the event of targeted field or line-related interference and for measuring emissions. The test IC is tested in function. The test environment ICE1 creates the functional environment of the test IC. The respective measurement task is carried out with the corresponding probe set.
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Probe Cards
U-Probe for Multi-die Test of Memory IC. Vertical-Probe Needle Type Probe card suitable for multi-die test of devices with peripheral pads. ertical-Probe Spring Type. Probe card suitable for area array pad test. 64DUTs Multi-Die. Probe Card for RF devices. Fine Pitch.
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Test System
LPDDR4 and LPDDR3
Testing LPDDR4, LPDDR3 devices is made fast and simple with the "Lower Power" LPDDR4/3 TCE-3200LP IC test system. It can be configured up to 32 sites in parallel and integrated with the customer's selected handler.The TCIII-3200LP system can be used as a production tool as well as an engineering tool. To assist manufacturers and integrators, TurboCATS has developed a heat chamber that can be integrated with the TCE-3200LP, LPDDR4 and LPDDR3 test system. This allows the devices to be tested while being exposed to heat conditions.
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Digital Incircuit Test
PFL780/760
The PFL780 and 760 use IC clips as a test interface. This makes them ideal for the service and maintenance of legacy systems. If you need to work on high density surface mount PCBs you should consider the GRS500 as a more suitable alternative.
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IC Test Probes
C.C.P. Contact Probes Co., LTD.
Our IC Test Probes are suitable for pitches of less than 0.012mm.
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Semiconductor
With ultra-multi pin count and fine pitch, our general-purpose IC socket lineup corresponds to every need. For semiconductor burn-in sockets for thermal acceleration tests, and test sockets for semiconductor electrical testing, we continue to hold a high market share all over the world.
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Wireless Test Solutions
Adivic/Chroma Group has been in the development of RF & Wireless test solutions for more than a decade. Take RF Recorder as an example, it has been adapted by all major Japanese & Korean automotive brand names such as Mitsubishi, Honda, Hyundai,.. ,most of the global IC design houses with DTV chips, and also military entities in NATO. With the same customer-proved Software Defined Radio architecture, we have introduced Wi-Fi, Bluetooth tester since 2014. It will soon cover other current/future wireless standards such as 4G/LTE, 802.11ax, 802.11ah, etc.
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IC Pick & Place Handlers
Chroma's IC test and handler solutions assure that IC packaging meets the original design specifications and verify the performance of the IC before it is assembled into the electronic product.
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Analogue IC Tester
SYSTEM 8 (AICT)
The SYSTEM 8 Analogue IC Tester is the answer to testing analogue devices. The key feature of the AICT is its ability to functionally test all common analogue ICs and discrete devices in circuit. It is also capable of testing all types of analogue and digital components by means of the well-known, power off V-I test technique. For users requiring only the latter function, please select the Analogue Test Station section.
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DC Parametric Test System with Curve Trace
DC3
The wafer has been fully tested, cut and packaged. Today's IC manufacturers are finding tremendous cost savings in performing just fast DC tests on these packaged parts rather than running the full wafer tests all over again. Until now this required either an expensive full-power IC tester, or a "rack-n-stack" collection of instruments. Enter the HILEVEL DC3 Co-Optive Parametric Tester. No more instruments, no switching matrix, no tricky software. The DC3 combines a high-precision DC-PMU and internal DUT supplies to test up to 2,048 pins, all in a single chassis with Multi-Site capability up to 64 sites. And every DC3 includes our Classic Curve Trace feature, allowing easy curve tracing on every pin.
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Microelectronic Services
Services for ASIC houses and Integrated Device Manufacturers are IC Wafer / Final Test, IC assembly, Test Program development, product engineering, Flash / EEPROM programming, characterisation / capability studies, yield enhancement, design verification and failure / yield analysis. Das Test Haus are specialists for wafer test, low power, mixed signal and eeprom test.
