Semiconductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
See Also: iJTAG
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Dynamic Ultra Micro Hardness Tester
DUH-210/DUH-210S
A new evaluation system for measuring the material strength of micro regions, such as semiconductors, LSI, ceramics, hard disks, vapor deposited films, and thin coating layers, not addressed by previous hardness testers. It can also be used to evaluate the hardness of plastics and rubbers. This instrument uniquely measures dynamic indentation depth, not the indentation after the test. This in turn permits measurement of very thin films and surface (treatment) layers that are impossible to measure with conventional methods. Additionally, this same method supplies the data needed to calculate elastic modulus on the test specimens.
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Measuring Microscopes, Image Processing + Semiconductor Technology, Micro Scriber
Line Width Measurement
Optik Elektronik Gerätetechnik GmbH
COMEF is an image processing software with special functions for the highly accurate measurement of line width and line distance. Using grey value algorithms, the width and distance of conductor lines or structures on silicon wafers can be measured with subpixel accuracy.
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Ozone Generators & Systems
MKS offers a wide range of ozone generators and modular delivery systems which produce ultra-pure, reliable ozone gas. In the clean semiconductor environment, Ozone reacts with a wide range of precursor gases resulting in the creation of Al2O3, ZrO2, HfO2, and La2O3 metal oxides to enable thin film deposition processes like Atomic Layer Deposition (ALD) and Etch (ALE). MKS’ generator uses Grade 6 gas, enabling the creation of higher film density improving product yield. Photovoltaic and Display manufacturing leverage semiconductor best practices and utilize ozone to create enhanced thin film barriers, improving product performance and reliability.
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IC Testing System
Is a system for giving electrical signals to a semiconductor device to compare output signals against expected values for the purpose of testing if the device works as specified in its design specifications.
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Cryocooler
CryoTel® DS30
The CryoTel® DS 30 Stirling cryocooler offers efficient, reliable, compact and high power cooling to the market in the temperature range of 35 to 250 Kelvin. The DS30 was optimized for applications in which SWAP (size, weight and power) and reliability are concerns. The DS30 consumes considerably less power than other cooling alternatives and requires no maintenance, making it ideal for strategic as well as industrial applications. Both the cold head and the pressure wave generator can be mounted in any orientation. Application examples include semiconductor manufacturing, large infrared detectors, RF receivers or antennas, astronomical telescopes, laser cooling, high-temperature superconductivity, cold traps, and others.
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Laser Heads
The laser head is the source of the laser beam used in all laser motion and position measurement systems. The primary difference between laser heads is in the velocity, reference frequency and optical output power. Other considerations are size, heat dissipation, and input power requirements. Which laser you choose depends primarily on the application in which it will be used. For example, semiconductor lithography systems typically have faster moving parts (stages), and therefore need higher velocities than machine tool applications.
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Semiconductor Thermal Transient Tester
T3Ster®
T3Ster (pronounced "Trister") is an advanced thermal tester from Mentor Graphics MicReD Products for thermal characterization of semiconductor chip packages. Superior to all other thermal characterization equipment on the market due to its speed and ease of use; its extremely accurate temperature measurements (0.01oC); and its 1 micro-second measurement resolution in time.
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Semiconductor
You can find Spring probes used for test process for production of semiconductor here. Spring probe is probe with spring inside and is also called Double-ended probe and Contact probe. It is assembled in IC socket and becomes electronic path, which vertically connects Semiconductor and PCB. By our excellent machining technique, we can provide spring probe with low contact resistance and long life. “MARATHON” series is our standard lineup of spring probe for testing semiconductor.
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MOCVD Systems
For growing high-quality compound semiconductor films, few techniques match the precision of Metal-Organic Chemical Vapor Deposition (MOCVD). They give engineers tight control over film composition and thickness, making them essential for optoelectronics and advanced power transistors.
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RF & Microwave PXI Switch Modules
These switching systems are used for design validation, reliability and production test including 5G, SD radios, S parameter testing for RF cables, antennas, radar and semiconductor verification.
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Metrology
Optical critical dimension (OCD) metrology and film metrology require accuracy and repeatability. Onto Innovation's techniques are well-established and trusted by semiconductor manufacturers around the globe.
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AMIDA ATI 600 Tester
AMIDA ATI 600 Tester is a dedicated test system for semiconductor components (MOSFET, BJT, DIODE, ... etc.), which can accurately and quickly measure product parameters through form filling and editable program control. In practical applications, AMIDA ATI 600 Tester is the best choice for users, whether it is CP or FT mass production testing, or research projects of component characteristics.
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Parametric Test Fixture
U2941A
The Keysight U2941A is a parametric test fixture that is designed to complement the usage of U2722A USB source measure unit in the testing of semiconductor components, including SMT and DIP ICs.
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High-resolution, SWIR InGaAs camera
Wildcat+ 640 TE0 and WL Series
The Wildcat+ 640 TE0 and WL series is based upon a state-of-the-art uncooled InGaAs detector with 640×512 pixels and 20 μm pixel pitch. The WL version uses a special windowless sensor package for laser beam analysis applications. The camera offers superior, high-resolution SWIR imaging capabilities, comes in a versatile and industry-proven Wildcat camera package (GenICam compliant) and offers advanced on-board image processing.The Wildcat+ 640 TE0 and WL cameras output full frame images at 220 Hz via either a CameraLink or USB3 Vision interface.The Wildcat+ 640 TE0 and WL is suitable for semiconductor inspection, display inspection (mobile phone and TV), microscopy and laser beam analysis.Benefits & Features- Compact and industry-proven camera design- High resolution SWIR imaging- Advanced on-board image processing performance- GenICam complaint- Flexible optical mount and lens options
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PXIe-4163, 24-Channel, ±24 V, 50 mA PXI Source Measure Unit
784483-01
PXIe, 24-Channel, ±24 V, 50 mA PXI Source Measure Unit—The PXIe-4163 is a high-density source measure unit (SMU). It features 4-quadrant operation with a current resolution of 100 pA and the ability to sample up to 100 kS/s. The module also offers the ability to maximize stability and measurement accuracy with SourceAdapt, which allows you to custom-tune the transient response to match the characteristics of any load. The PXI-4163 is ideal for a broad range of mixed-signal integrated circuits (ICs) in semiconductor production test.
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Multiple Camera Board For NVIDIA® Jetson AGX Xavier™
E-CAM130_CUXVR
e-CAM130_CUXVR is a synchronized multiple 4K camera solution for NVIDIA® Jetson AGX Xavier™ development kit that has up to four 13 MP 4-Lane MIPI CSI-2 camera boards. Each camera is based on the camera module e-CAM137_CUMI1335_MOD, 1/3.2" AR1335 color CMOS image sensor from ON Semiconductor® and integrated high performance Image Signal Processor (ISP). All these four cameras are connected to the base board using 30 cm micro-coaxial cable. These four 4-lane MIPI camera modules can be synchronously streamed in 4K resolution, which will be best fit for high end multi camera solution. Customers can opt to purchase anything between single camera to four cameras as according to their requirement.
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Automated Front & Backside Mask Aligner System
Model 6000
With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
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Low Constant Temperature Trough
DRK6691
Shandong Drick Instruments Co., Ltd.
Drk6691 small low constant temperature trough is a special product designed for small Abbe refractometer, supporting the use of. It has many advantages such as constant speed, constant temperature, small volume, low noise and convenient operation and so on , so it is a higher price products. This product adopts the technology of the one chip computer, PID selftuning regulation technology;adopts imported platinum resistance temperature (Pt100), so it has high precision of temperature control and temperature fluctuation is small; adopts the semiconductor refrigeration technology, so that it consists of advantages of fast refrigeration, no noise.
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Benchtop Discrete Component Tester
Imapact 7BT
The 7BT Benchtop Discrete Component Tester is designed to test small signal and power semiconductor components in both single and multi-device packages or hybrids.. The 7BT automatic test system can be used in all test applications including incoming inspection, wafer probe, QC, engineering, production, final test, and high reliability.
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Wafer Analysis Systems
Tropel®
Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufacturers. The Tropel line of wafer analysis equipment enables measurement of wafer substrates from 2” to 450mm regardless of material type and surface finish.
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PXI Low-Leakage Switched Guard Switching Solutions
They are based on the switched guard design principle, and the overall designs assure isolation resistances of up to 1013Ω. This high level of isolation resistance ensures accurate and reliable measurements, making our products ideal for high-precision semiconductor testing.
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Field-installation Type Simplified Fluoride Ion Concentration Meter(Two-Wire Transmission)
HC-300F
HC-300F is connected to a fluoride ion electrode (1009) to detect free fluoride ions in the sample water.(Total fluorine is not detected.) It is suitable for fluoride ion monitoring in effluent from factories, e.g., those of semiconductor FPD and glass manufacturers.
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Thermal Conductivity Analyzer
Model 2000B
Teledyne Analytical Instruments
The Series 2000 represents a complete line of Thermal Conductivity Detector (TCD) based analyzers which can be applied in a wide range of applications and industries. By using field proven filament-based and semiconductor based TC detectors, Teledyne is able to continuously monitor hydrogen and a variety of other gases of interest in either binary or multi-component sample gas streams.
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32-CH/64-CH Isolated Digital I/O PCI Express Card With Digital Filter
AX92351
The AX92351 is a 64-ch isolated digital I/O PCI Express card with 2,000VDC isolation protection. This high-density digital I/O card with high-speed PCI Express x1 bus is excellent for use in applications requiring digital control or monitoring, such as semiconductor machinery, PC-based industrial machinery, programmable I/O logic control, and process status monitoring. The AX92351 features 32 isolated digital input channels and 32 isolated digital output channels with isolation protection of 2,000V for industrial applications where high-voltage isolation is required. It is equipped with a board ID feature for easy identification of multiple cards in single system. There is a digital filter function to prevent input signals from carrying noise or a chattering. Each isolated input has a sink or source current which supports dry and wet contact for maximum application flexibility. The card has a wide range of input voltage from 10 to 30V to meet most industrial application needs. The AX92351 also provides two interrupt sources on digital input channels. Digital output has open controller and supports maximum 30VDC. The read-back function is another useful function that allows monitoring each output port.
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Semiconductor
With state-of-the-art manufacturing facilities in the U.S., Europe and Asia, local sales offices throughout the world, and on-site applications support, FUJIFILM Electronic Materials is your global partner.
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Automated Mask Aligner with Integrated Mask Changer
Model 6000A-MC
The Model 6000A-MC is a precision system combining OAI’s Model 6000, Automated Production Mask Aligner, with an integrated mask changer. The mask changer can handle from 10 to 150 masks. Ideal for both semiconductor and bio-tech applications. It also is designed with a bar code reader to assure each mask is coordinated to the right process. Please contact OAI for further product information.
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Wire/Cable Harness Tester
PANTHER 4HT
Qmax Test Technologies Pvt. Ltd.
The Panther 4HT Wire \ Cable Harness tester is designed for Automotive and Semiconductor industry to apply in testing of wire harnesses, that needs testing during production with whole new fleet of features that make the task reliable, complete and fast. It uses innovative technology to test the impedance values. It can be interfaced to any type of fixtures as required. It uses the Learn and Compare technique for finding out opens or shorts in a harness. The learnt open / short combination from a Good Board is taken as reference and compared with the Board Under Test for any mismatch.
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Ultrasound Transducers
Utilizing optical and semiconductor fabrication techniques, Imaginant manufactures the PureView PrecisionTM line of RoHS-compliant delay-line ultrasound transducers with center frequencies ranging from 50 MHz to 250 MHz (higher and lower transducer frequencies are also available). Imaginant's precision-manufacturing process produces transducers that exhibit high reliability and high uniformity from device to device. This manufacturing consistency enables uniform test system performance to be attained across multiple systems. Imaginant transducers are available in focused and flat-face models that can be produced with minimal-damping for applications requiring maximal sensitivity or with maximal-damping and high-bandwidth for applications requiring the highest-degree of temporal precision.
