Image Processors
algorithmically enhances image characterization.
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Product
17" SXGA TFT LED LCD Touch Panel Computer With 8th Gen. Intel® Core™ I3/ I5/ I7 Processor, Built-In 8G DDR4 RAM
TPC-317
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Industrial-grade 17" SXGA TFT LCD with 50K lifetime and LED backlight.8th Gen. Intel® Core™ i3- 8145UE dual-core/ i5-8365UE quad-core/ i7-8665UE quad-core processor with built-in 8 GB DDR4 SO-DIMM.Dual channel memory slots support up to 64G in total.Compact, fanless embedded system with aluminum alloy front bezel and chassis grounding protection.True-flat touchscreen with 5-wire resistive touch control and IP66-rated front panel.Support expansion via Full-size Mini PCIe and two M.2 slots (NVMe, 5G).Diverse system I/O and isolated digital I/O via iDoor technology.Support fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technology.Support TPM2.0 hardware security.
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Product
PICMG 1.3 Half-size CPU Card With LGA1150 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q87, SATA3, USB 3.0, DVI-I/LVDS And Dual LANs
SHB230
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The SHB230 is high-performing PICMG 1.3 half-size single board computer.The SHB230 based on the Intel® Q87 PCH is designed to support 4th Generation Intel® Core™ i7/i5/i3 and Celeron® processors (codename: Haswell/Haswell Refresh) in the LGA1150 socket.The slot CPU card is equipped with two DDR3-1333/1600 SO-DIMM sockets with up to 16 GB memory capacity to meet customers needs.The PICMG 1.3 specification brings advantages of PCI Express to this single board computer that offers four PCIe x1 or one PCIe x4, and one PCIe x16 routed to the backplane.The onboard two SATA interfaces support RAID 0/1 functions to ensure reliable storage for multiple applications.Utilizing with the latest Intel® technologies, this PICMG 1.3 system host board is an ideal solution for DVR, medical equipment, industrial automation, process control, and network security market.
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Product
3.5” Embedded SBC With Intel® Pentium® Processor N4200 & Celeron® Processor N3350, LVDS, HDMI, 2 GbE LANs And Audio
CAPA313
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The CAPA313 is powered by the Intel® Pentium® processor N4200 or Intel® Celeron® processor N3350 (codename: Apollo Lake). This 3.5" embedded board was designed for operational stability in harsh environments with a wide operating temperature range from -20°C to +70°C. It offers a wide range DC input of 12V to 24 for various industrial environments. It also comes with rich I/O connectors, stunning graphical performance and an emphasis on expandability. In addition to one 204-pin DDR3L-1867 SO-DIMM socket supporting system memory up to 8GB, the CAPA313 has one PCI Expess Mini Card slot for 3G/4G, GPS, Wi-Fi and Bluetooth connection. The compact-size embedded board comes with one RS-232/422/485, one RS-232, two USB 2.0, four USB 3.0, eight-channel digital I/O, audio, LVDS, HDMI, VGA (optional) and dual Gigabit LANs with Intel® i211AT Ethernet controller. It also features one SATA-600 socket and one mSATA interface for storage devices. To ensure reliable operation, the 3.5” embedded SBC supports watchdog timer and hardware monitoring features.
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Product
Custom Sensing And Imaging Solutions
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Micro Magnetics has a proven track record of excellence in designing and developing new products and solutions based on our knowledge of magnetic devices and materials. We offer specialized solutions to meet our customers? unique needs. These solutions include single magnetic sensors, sensor arrays, custom electronics and packaging solutions, sensor processing (polishing, dicing, and lapping), and custom film and device deposition.
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Product
PP B7x/msd, 6U CompactPCI Processor Board
PP B7x/msd
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PP B7x/msd is a single slot air-cooled CompactPCI® board, allowing customers to easily migrate to the latest generation of Intel® processors for improved performance and longer system lifecycles.
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Product
Ultimate Performance Gaming Platform Based on 7th Generation Intel® Core™ Processors Supports up to 11x Independent Displays Including 4K UHD
ADi-SA1X-SL
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- Ultimate " all-in-one" gaming platform- The best-in-class graphics capabilities in games with high levels of detail- Up to 11x independent HD monitors supporting 4K UHD- Advanced security feature set and software solutions- Intelligent middleware shortens development time- Various power supply options- Low-power consumption
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Infrared Imaging Products
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We currently offer the SLA32, a 2×16 staggered element silicon-based thermopile array. and the SLA64, a 1x64 element silicon-based thermopile array. . Additionally, development is continuing on future imaging products with integrated electronics. Please contact us with your specific requirements.
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Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, 4 PoE, 4 USB 3.0, And Real-time Vision I/O
IPS960-511-PoE
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Featuring a multi-core CPU, IP40-rated rugged design, camera communication interfaces, real-time vision-specific I/O with microsecond-scale and LED lighting control, the IPS960-511-PoE provides an all-in-one solution that addresses the needs across various machine vision platforms and automatic inspection cases. The IPS960-511-PoE is powered by the LGA1151 socket the 7th & 6th generation Intel® Core™ (codename: Kaby Lake/Skylake) and Celeron® processors (up to 65W) with the Intel® H110 chipset. The intelligent vision system comes with dual DDR4-2133/2400 un-buffered SO-DIMM sockets for up to 32GB of system memory as well as supports rich camera interfaces for connecting industrial cameras, including four IEEE802.3at PoE LAN ports and four USB 3.0 ports. Its vision I/O integrates a full range of isolated I/O interfaces and real-time controls essential to machine vision applications, including trigger input, LED lighting controller, camera trigger, as well as an encoder input for conveyor tracking. The IPS960-511-PoE also supports lighting dimming control to identify object characteristics for different inspection. Two easy-swappable 2.5" HDDs are available for extensive storage needs.
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Product
3.5" Single Board Computer With 13th Gen Intel® Core™ I7/i5/i3/ Celeron® Processor
SBC35-RPL
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SBC35-RPL is powered by Intel's latest processors, which offer improved performance, power efficiency, and support for the latest technologies based on Intel's 13th generation of 3.5-inch Single Board Computers (SBCs) offer a range of advanced features and capabilities for a variety of embedded applications.
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Product
Software Development Kit for 2D Imaging Sonar
Sonar Software Development Kit (SDK)
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Teledyne BlueView offers a software development kit (SDK) for its 2D Imaging Sonar to enable integration onto complex platforms and/or customized systems for OEMs and vehicle manufactures. The SDK enables control of the sonar, and provides access to the raw data files to facilitate sonar operation and data flow-through.
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Product
COM Express Compact Size Type 6 Module with Up to Quadcore Intel® Core™ and Celeron® Processors
cExpress-WL
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ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel® Core™ and Celeron® processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and up to 64GB memory capacity, offering edge computing applications uncompromising performance and responsiveness despite SWaP constraints. The cExpress-WL is suited for applications such as data acquisition and analysis, image processing, and 4K video transcoding and streaming at the edge.
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Product
EMCCD Image Sensors for Space and Ground-based Astronomy
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EM (Electron Multiplication) is a technology that uses on-chip gain in the charge domain to effectively eliminate read noise from an image sensor. This enables advanced ultra-low light applications that require extreme sensitivity at fast frame rates such as adaptive optics and lucky imaging™.The combination of Teledyne e2v’s back-thinning technology and anti-reflection coatings enables industry leading quantum efficiency that can be optimised for applications in the visible, UV or NIR wavelength ranges.
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Product
Compact Fanless System With Intel® Core™ Ultra 5/7/9 Processors (Series 2)
MIC-780
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Intel® Core™ Ultra 5/7/9 Processors (Series 2)CPU type: Socket (LGA1851)Chipset: Intel® W880/H810DDR5 Memory up to 128GB 6400MT/sMIC-780W: 3 x displays – 2 x HDMI/1 x DP, 4 x GbE LAN, 4 x USB 3.2 Gen2x1 (10G), 2 x COM, 1 x NVMe M.2 (PCIe Gen4 x4)MIC-780H: 3 x displays – 2 x HDMI/1 x DP, 2 x GbE LAN, 2 x USB 3.2 Gen 2x1 (10G), 2 x USB 3.2 Gen 1x1 (5G) , 2 x COM
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Product
COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
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The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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Product
FPGA Image Processing (IP) Development Kit
ProcVision
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Gidel’s Vision Pro Development Kit is an optimal solution for developing,validating, demonstrating and evaluating Image Processing (IP) andpipeline designs on FPGA.The suite is designed to provide a complete and convenient envelop enablingthe developer to focus strictly on the proprietary image processingdesign. The entire Vision Pro flow is within a single FPGA, independentof the final target application(s). The Vision Pro flow is composedof a pipeline that streams simulated data to the user image processingdesign under test (DUT) and then captures the design’s output streamfor displaying, storing, analysis and/or co-processing on host software.The entire process is performed on a single FPGA without the need foradditional peripheral connectivity or tools.Vision Pro suite is plug-and-play enabling the developer to begin at oncethe IP design development and validation. A simple design example providesthe developer immediate hands-on familiarization with the systemflow and supporting tools. The final design can be ported to any IntelFPGA device or other vendors’ devices (FPGA or ASIC) by replacing basiclibraries. To significantly reduce compilation time, initial design developmentmay be on a small FPGA device and later compiled for the targetdevice(s). The target implementation may use any FPGA board. For a fullImaging/Vision system solution, Gidel offers a number of off-the-shelfgrabbers and FPGA accelerators that are designed to utilize these imageprocessing blocks and Gidel Imaging Library (GIL).
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Product
COM Express Type 6 Basic Module With Intel® Xeon® And 6th Gen Intel® Core™ I7/i5/i3 Processor, Intel® CM236/QM170/HM170
CEM500
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The CEM500, a COM Express Type 6 basic module, is based on the 14 nm Intel® Xeon® processor E3-1505M v5 and 6th generation Intel® Core™ i7/i5/i3 processor (codename: Skylake-H) with Intel® CM236/QM170/HM170 chipset. The outstanding Intel® Gen 9 HD Graphics enables the CEM500 driving multiple 4K displays without the need of a discrete graphics card. Two DDR4-2133 SO-DIMM supporting up to 32 GB system memory capacity and four SATA-600 with RAID 0, 1, 5, and 10 are available. Additionally, the rugged COM Express computer-on-module Type 6 supports an industrial operating temperature range of -40°C to 85°C for applications in extreme harsh environment. With its full solid, outstanding computing performance and low power consumption design, the CEM500 is targeted at telecommunication, medical imaging, digital signage, gaming machines, military, human machine interface, industrial automation controllers and IIoT applications.
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Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM-AXe Based On Intel® Arc™ GPU, And Thunderbolt™ 4 Port
MLB-3100 with Intel MXM GPU
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- ADLINK MXM-AXe graphics module support (type A, up to 50W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
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Product
3U i7 Quad Core, 2.4 GHz Processor cPCI Express Controller
GX7945
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The GX7945 is a single-slot embedded cPCI Express 3U controller for use with Marvin Test Solutions' PXI Express chassis. When combined with the embedded storage peripherals which are integrated into PXIe chassis, the controller / chassis offers a compact, high performance, and integrated test platfrom solution.
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Micro-ATX Motherboard AMD Ryzen™ Embedded 7000 Series Processors
AIMB-523
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AMD Ryzen™ Embedded 7000 Series processors with B650 chipset6 LAN ports with 2.5GbE for multiple IP-based devicesTriple displays by 1 DP and 2 HDMIHigh-speed expansions: PCIex16 Gen5, 8 USB 3.2, 1 M.2 M-key (PCIe Gen4 x4)1 internal USB2.0 type A to support USB keylock functionsWindows 10/11
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3U OpenVPX™ SOSA™-Aligned SBC with Intel® Core™ i7-1186GRE Processor (Tiger Lake)
68INT6
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The 68INT6 is a SOSA™-aligned 3U OpenVPX Intel® Core™ i7-1186GRE Processor / integrated PCH-LP (Tiger Lake) w/ 4 Cores & 12M Smart Cache running up to 2.8 GHz Single Board Computer that can be configured with up to two Smart I/O and communications function modules (w/ NAI-XMC configuration option). Ideally suited for rugged Mil-Aero applications, the 68INT6 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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Imaging Systems & Components
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Thorlabs offers a wide selection of laser scanning, widefield imaging, and OCT imaging systems, including multiphoton microscopes, confocal microscopes, electrophysiology rigs, swept-source OCT systems, and spectral-radar OCT systems.
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Digital Imaging
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No one camera does it all. ACCU-SCOPE offers a wide selection of cameras for a variety of applications, and our experts can help you find the best match for your specific need. We have solutions from brilliant brightfield to low-light fluorescence, and from imaging living, moving specimens to fixed stained sections on slides. Need help deciding? Just ask!
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Image Analysis Software
Metallurgy Plus
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International Biological Laboratories
his software can be used in Steel plants, Metal forging industry, Oil & gas industry ,Material Science, Mineralogy - metal and metal strength analysis Cement (Klincker) quality control and where ever Metallurgical microscope are used in .This Package is very useful Educational Institutions and ALL MATERIAL SCIENCE TECHNOCRATS AND METALLURGISTS.
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Product
Mid-Focal Length Imaging Spectrometers
iHR Series
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The iHR Series of 320 mm and 550 mm focal length high performance and versatile imaging spectrometers are HORIBA’s most popular and iconic spectrometers. The iHR series is built on decades of experience in spectroscopy and represents the highest quality, performance and versatility of any spectrometers in this class. The iHR 320 and iHR 550 spectrometers are immediately recognizable around the world by their unique shape, the result of a superior optical design. These spectrometers benefit from the highest quality of gratings, also designed and manufactured by HORIBA.
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Mini Type COM-HPC Module With Intel® Core™ Ultra Processor (Meteor Lake)
COM-HPC-mMTL
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Combining a power-efficient Intel® Core™ Ultra processor with up to 64GB LPDDR5 memory in a 95x70mm size makes this ideal for battery-powered, space-limited, high-performance edge applications like medical ultrasound devices, industrial automation, data loggers, autonomous driving, and AI robots.
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COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors (formerly codename: Tiger Lake-UP3)
cExpress-TL
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ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
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ToF Image Sensors
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The ability to measure objects at a distance to determine how far away they are and/or their overall dimensions is becoming more popular in Imaging. With this, there are several different techniques and technologies, each with their own advantages and disadvantages. Picking the right one can be daunting without someone in your corner to help decipher your needs and direct you to the best product to meet them.
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Robust DIN-rail Fanless Embedded System With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor And Dual Modular I/O Expansion Design
ICO500-518
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The ICO500-518 featuring flexible I/O expansion, sufficient storage and network capability is well-suited for transportation, public utility, smart building, solar energy, as well as factory automation fields. By bundling Axiomtek’s intelligent AMS software solution for device monitoring and remote management, the ICO500-518 is able to implement environment signal monitoring, edge analytics and remote device management in the IIoT world. It has also passed the EN 50121-4 certified for railway applications. The rugged high computing edge gateway has scalable CPU options with the 7th gen Intel® Core™ i7/i5/i3 (codename: Kaby Lake-U) or Celeron® processors and supports one DDR4-2133 SO-DIMM slot for up to 16GB of system memory. The ICO500-518 features basic benefits whether low latency or cost efficiency; moreover, offering much more other advantages for IIoT applications. It not only supports multiple OT communication protocols that can significantly reduce the effort required to collect data from different field devices, but also provide local intelligence to allow operators respond faster to events that happen at the remote site and minimizes latency between edge devices and the cloud server. Also, with TPM 2.0, this IIoT edge gateway provides tailored levels of security depending on the application needs. Axiomtek’s ICO500-518 has two optional plug-in I/O module slots and four different types of I/O modules to meet different customization requirements. An integrator can choose from four available I/O modules including an 8-port GbE LAN module; 8-port isolated RS-232/422/485 module; 4-port isolated RS-232/422/485 with one isolated DIO (8-in/8-out) module; 8-port isolated CANbus 2.0A/B module to customize the ICO500-518 to fit its specific project requirements. Additionally, the ICO500-518 offers flexible communication options - two full-size PCI Express Mini Card slots and one external SIM card slot for 4G/3G, GPS, LoRaWAN, Wi-Fi and Bluetooth connections. Furthermore, it supports swappable 2.5-inch SATA drive and external CFastTM card to provide sufficient storage capability. For withstanding harsh operating conditions, this IP40-rated embedded box PC offers an extended operating temperature range of -40°C to 70°C, a wide range DC input of 12V to 48V with OVP, UVP, OCP, RPP power protection, and up to 3G vibration endurance.
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Product
High Performance InGaAs Camera Module with High Image Resolution
XSW 640 Series
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The XSW 640 modules are offered with frame rate of up to 100 Hz. The module comes with either a CameraLink, GigE Vision or QTE Samtec interface and features low weight and power.
