Product

Tilera GX72 Processor AMC, 72 Core

AMC740

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Vadatech Inc

AMC740 - Vadatech Inc

The AMC740 is ideal for packet filtering, intelligent networking, multimedia, video transcoding, cloud and other applications. The device includes 72 identical processor cores (tiles) interconnected with Tilera’s iMesh™ on-chip network. Each tile consists of a full-featured, 64-bit processor core as well as L1 and L2 cache and a non-blocking Terabit/sec switch. The high processing density and high internal bandwidth of the GX72CPU make it ideal for intensive computing tasks.

Product

Dynamic Image Analysis (DIA)

CAMSIZER

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Microtrac

CAMSIZER - Microtrac

Dynamic Image Analysis (DIA) is a modern particle characterization method for the determination of size distributions and shape parameters. It allows quick analyses with excellent accuracy and reproducibility over an extremely wide measuring range. With the renowned CAMSIZER system, Microtrac introduced its first Dynamic Image Analyzer over 20 years ago and has pushed technological innovation ever since.

Product

Consumer Global Shutter Image Sensors

Smart GS Series

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SmartSens Technology Co.,Ltd

Smart GS Series - SmartSens Technology Co.,Ltd

SmartSens creatively combines the backside-illuminated (BSI) pixel design process with the Global Shutter image sensor design to provide imaging performance with better signal-to-noise ratio, higher sensitivity and wider dynamic range . The new vitality of intelligent sensing equipment.

Product

Architecture P4040/4080 Processor

VME-186

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Curtiss-Wright Defense Solutions

VME-186 - Curtiss-Wright Defense Solutions

The VME-186 VME Single Board Computer is based on NXP's high-performance QorIQ P4080 SOC multi-core processor. With four or eight Power Architecture cores running up to 1.5 GHz, and up to 8 GB of high bandwidth DDR3 SDRAM, the VME-186 SBC provides processing and a variety I/O interfaces to satisfy the most demanding requirements of embedded computing.

Product

Charge Coupled Device (CCD) Standard Image Sensors

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Teledyne e2v

Teledyne e2v

Teledyne e2v is the leading supplier of scientific grade Charge Coupled Device (CCD) image sensors for the most challenging low light imaging and spectroscopy applications.

Product

Multi-Band Imaging

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Bodkin Design & Engineering, llc

Bodkin Design & Engineering, llc

A multi-band camera provides high-resolution, co-registered visible and infrared imagery through a common aperture telescope, unlike conventional visible or infrared cameras that provide image data in limited wavelength bands. Bodkin Design has created the Omnispotter multi spectral camera to enable the user to better discriminate targets from both background and decoys by blending color images with information from the IR band. The images obtained from this system penetrate darkness, camouflage, smoke and clutter better then either visible or IR images could alone.

Product

SC9-TOCCATA, CompactPCI® Serial CPU Card Equipped With 11th Generation Intel® Core™ & XEON® W Processors (Tiger Lake H45 Platform)

EKF-SC9-TOCCATA

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ELMA Electronic, Inc.

EKF-SC9-TOCCATA - ELMA Electronic, Inc.

SC9-TOCCATA is a rich featured high performance 4HP/3U CompactPCI® Serial CPU board, equipped with an Intel® 11th Generation XEON® Processor (Tiger Lake H45 platform) for demanding industrial applications.

Product

Infrared Thermal Imaging Gas Leak Detector (VOCs)

EXPEC-1880

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Focused Photonics Inc.

EXPEC-1880 - Focused Photonics Inc.

EXPEC 1880 infrared thermal imaging gas leak detector (EXPEC 1880) is a non-contact leak detector for volatile organic compounds (VOCs). It adopts a high-end mediumwave cooled type-II superlattice infrared detector and has passed Ex ic nc op IIc T4 Gc explosion-proof certification, with high protection level (IP54).

Product

VPX GPGPU Processor Card

VPX3-4924

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Curtiss-Wright Defense Solutions

VPX3-4924 - Curtiss-Wright Defense Solutions

The rugged VPX3-4924 NVIDIA Tesla Pascal GPU processor board is designed and manufactured by Wolf Advanced Technology. This board is part of a family of GPGPU modules available from Curtiss-Wright Defense Solutions to enable development of High Performance Embedded Computing (HPEC) systems.

Product

Combinated Thermal Imaging Cameras

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PeakTech Prüf- und Messtechnik GmbH

PeakTech Prüf- und Messtechnik GmbH

This new combination of the latest True RMS graphic multimeter and responsive thermal imaging camera enables professional use in all areas of electrical engineering. The multimeter has many various functions to carry out precise measurements, which you can log automatically, save with a screenshot or record and process using an app for Android or iOS mobile devices.

Product

Intel 80486 DX2 Processor Board

MS 1500

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Meltronics Systemtech

MS 1500 - Meltronics Systemtech

- PC 104 bus and ISA bus interface- Facilitates design of scalable architectural solution for Embedded System- Back plane eliminated by self-stacking PC 104 bus- Substantial reduction of development time, cost, as well as risk- Helps to Faster time-to-market / timely product productions- Used for LCA Simulation Project- Intel 80486DX2 @ 33MHz- 512Kbytes of STATIC RAM, 2048 Kbytes of FLASH PROMS- 64 Kbytes of DPRAM- External Interrupts- RS232 Serial Interface- Watchdog Timer- External Bus Interface

Product

3U Processor Board

CP32108

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LinkedHope Intelligent Technologies Co.,Ltd.

CP32108 - LinkedHope Intelligent Technologies Co.,Ltd.

CP32108 is a compact modular 3U CPCI single board computer compliant with CompactPCI specification. Based on Intel® 6th Skylake-H platform, CP32108 supports a variety of processors. On CP32108, there are rich interfaces like SATAIII, USB3.0, GbE, PCIe2.0, etc. In addition, CP32108 can provide up to 1TB SSD storage with mSATA interface.CP32108 applies high-speed CPCI connector on J2, in order to transmit PCIe2.0, USB3.0, SATAIII signals. CP32108 supports up to x4 PCIe to rear with flexible PCIe configuration including 1 x4, 2 x2, 1 x2+2 x1 or 4 x1.CP32108 integrates Intel® Gen9 HD Graphics P530 display controller, and supports various display outputs like eDP, DP and HDMI(with resolution up to 2560x2160 @24Hz, 24 bpp).

Product

High-Speed Image Processing Technology

STC-OFS701N

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Shanghai Stone Communication tech Co., Ltd

STC-OFS701N - Shanghai Stone Communication tech Co., Ltd

STC-OFS701N adopt high-speed image processing technology and special precision- positioning technology, automatically finish the whole process of fiber fusion in 8 seconds typically, TFT LCD monitor displays all steps of fiber fusion clear at a glance. Widely used for SM and MM Quartz Fiber with diameter 80-150m, coating layer diameter 0.1-1.0mm and bare fiber length 16mm more or less.Ideal tools for construction and maintenance of fiber and cable in both field and laboratory applications.

Product

OnyxFX Virtex-7 Processor and FMC Carrier - 3U VPX

Model 5973

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Mercury

Model 5973 - Mercury

- VITA-57.1 FMC site offers access to a wide range of possible I/O- Supports Xilinx Virtex-7 VXT FPGAs- GateXpress supports dynamic FPGA reconfiguration across PCIe4 GB of DDR3 SDRAM- PCI Express (Gen. 1, 2 and 3) interface up to x8- User-configurable gigabit serial interface- LVDS connections to the Virtex-7 FPGA for custom I/O- Optional optical interface for backplane gigabit serial interboard communication- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-66.4 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available

Product

Flexible and Modular T11 Processor

ADwin-Pro II

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ADwin

ADwin-Pro II - ADwin

The ADwin-Pro II system is the successor of the ADwin-Pro. The new system is equipped with a considerably faster T11 processor and transfers data 10 times faster with the new Pro II bus. At the same time the integrated ADwin Pro bus guarantees the compatibility with older modules still in use

Product

Processor Module

UPM STM32F429

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Holding Informtest

UPM STM32F429 - Holding Informtest

The universal processor module UPM STM32F429 is intended for use as part of devices developed by the user and for providing control of these devices via various control interfaces and for ensuring the interaction of these devices with a PC via the Ethernet or USB 2.0 HS interface.